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1. (WO2019005087) SUPPRESSION OF CURRENT LEAKAGE IN N-TYPE FINFET DEVICES
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Pub. No.: WO/2019/005087 International Application No.: PCT/US2017/040156
Publication Date: 03.01.2019 International Filing Date: 30.06.2017
IPC:
H01L 27/092 (2006.01) ,H01L 29/78 (2006.01) ,H01L 29/66 (2006.01)
H ELECTRICITY
01
BASIC ELECTRIC ELEMENTS
L
SEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
27
Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
02
including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having at least one potential-jump barrier or surface barrier; including integrated passive circuit elements with at least one potential-jump barrier or surface barrier
04
the substrate being a semiconductor body
08
including only semiconductor components of a single kind
085
including field-effect components only
088
the components being field-effect transistors with insulated gate
092
complementary MIS field-effect transistors
H ELECTRICITY
01
BASIC ELECTRIC ELEMENTS
L
SEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
29
Semiconductor devices specially adapted for rectifying, amplifying, oscillating or switching and having at least one potential-jump barrier or surface barrier; Capacitors or resistors with at least one potential-jump barrier or surface barrier, e.g. PN-junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof
66
Types of semiconductor device
68
controllable by only the electric current supplied, or only the electric potential applied, to an electrode which does not carry the current to be rectified, amplified, or switched
76
Unipolar devices
772
Field-effect transistors
78
with field effect produced by an insulated gate
H ELECTRICITY
01
BASIC ELECTRIC ELEMENTS
L
SEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
29
Semiconductor devices specially adapted for rectifying, amplifying, oscillating or switching and having at least one potential-jump barrier or surface barrier; Capacitors or resistors with at least one potential-jump barrier or surface barrier, e.g. PN-junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof
66
Types of semiconductor device
Applicants:
INTEL IP CORPORATION [US/US]; 2200 Mission College Boulevard Santa Clara, California 95054, US
Inventors:
GILES, Luis Felipe; DE
RIESS, Philipp; DE
HODEL, Uwe; DE
MOLZER, Wolfgang; DE
BAUMGARTNER, Peter; DE
Agent:
HARTMANN, Natalya; US
Priority Data:
Title (EN) SUPPRESSION OF CURRENT LEAKAGE IN N-TYPE FINFET DEVICES
(FR) SUPPRESSION DE FUITE DE COURANT DANS DES DISPOSITIFS FINFET DE TYPE N
Abstract:
(EN) Disclosed herein are semiconductor layers with modified doping profiles for forming N-type (NMOS) FinFET structures, and related methods and devices. One exemplary semiconductor layer with a modified doping profile includes a plurality of regions with different dopant concentrations, the plurality of regions including an N-well region, a P-well region, a low-doped buffer region, and a connection region. The low-doped buffer region separates the P-well region and the N-well region and has P-type dopants with a dopant concentration less than that of the P-well region. The connection region has N-type dopants and is provided over the low-doped buffer region, between the P-type region and the N-well region, connecting the P-well region and the N-well region. Providing the low-doped buffer region together with the connection region may significantly reduce leakage current in NMOS FinFETs.
(FR) L'invention concerne des couches semi-conductrices avec des profils de dopage modifiés pour former des structures FinFET de type N (NMOS), et des procédés et des dispositifs associés. Une couche semi-conductrice à titre d'exemple ayant un profil de dopage modifié comprend une pluralité de régions ayant différentes concentrations de dopant, la pluralité de régions comprenant une région de puits N, une région de puits P, une région tampon faiblement dopée et une région de connexion. La région tampon faiblement dopée sépare la région de puits P et la région de puits N et présente des dopants de type P ayant une concentration de dopant inférieure à celle de la région de puits P. La région de connexion comprend des dopants de type N et est disposée sur la région tampon faiblement dopée, entre la région de type P et la région de puits N, reliant la région de puits P et la région de puits N. La fourniture de la région tampon faiblement dopée conjointement avec la région de connexion peut réduire significativement le courant de fuite dans les finfet NMOS.
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Designated States: AE, AG, AL, AM, AO, AT, AU, AZ, BA, BB, BG, BH, BN, BR, BW, BY, BZ, CA, CH, CL, CN, CO, CR, CU, CZ, DE, DJ, DK, DM, DO, DZ, EC, EE, EG, ES, FI, GB, GD, GE, GH, GM, GT, HN, HR, HU, ID, IL, IN, IR, IS, JO, JP, KE, KG, KH, KN, KP, KR, KW, KZ, LA, LC, LK, LR, LS, LU, LY, MA, MD, ME, MG, MK, MN, MW, MX, MY, MZ, NA, NG, NI, NO, NZ, OM, PA, PE, PG, PH, PL, PT, QA, RO, RS, RU, RW, SA, SC, SD, SE, SG, SK, SL, SM, ST, SV, SY, TH, TJ, TM, TN, TR, TT, TZ, UA, UG, US, UZ, VC, VN, ZA, ZM, ZW
African Regional Intellectual Property Organization (ARIPO) (BW, GH, GM, KE, LR, LS, MW, MZ, NA, RW, SD, SL, ST, SZ, TZ, UG, ZM, ZW)
Eurasian Patent Office (AM, AZ, BY, KG, KZ, RU, TJ, TM)
European Patent Office (EPO) (AL, AT, BE, BG, CH, CY, CZ, DE, DK, EE, ES, FI, FR, GB, GR, HR, HU, IE, IS, IT, LT, LU, LV, MC, MK, MT, NL, NO, PL, PT, RO, RS, SE, SI, SK, SM, TR)
African Intellectual Property Organization (BF, BJ, CF, CG, CI, CM, GA, GN, GQ, GW, KM, ML, MR, NE, SN, TD, TG)
Publication Language: English (EN)
Filing Language: English (EN)