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1. (WO2019004906) METHOD FOR MANUFACTURING A FINGERPRINT SENSOR MODULE
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CLAIMS

1 . Method for manufacturing a fingerprint sensor module (310, 400), the method comprising

providing (100) a fingerprint sensor wafer (200) comprising a plurality of fingerprint sensor chips (201 ), wherein each fingerprint sensor chip is configured to acquire an image of a finger placed on a sensing surface of the fingerprint sensor module;

forming (102) at least one via connection opening (302) through the fingerprint sensor chip;

performing (104) chip singulation, dividing the wafer into separate fingerprint sensor chips such that edges (304) of each fingerprint sensor chip are exposed after singulation;

depositing (106) an electrically conductive material (306) in the at least one via connection opening, thereby forming an electrically conductive via connection reaching through the fingerprint sensor chip; and

in one and the same process step, depositing (108) a protective material (308) on the electrically conductive material, on the backside of the fingerprint sensor chip, and on the chip edges.

2. The method according to claim 1 , wherein forming the at least one via connection opening and chip singulation is performed simultaneously in the same process step.

3. The method according to claim 1 or 2, wherein forming the at least one via connection opening and chip singulation is performed using a plasma etch process.

4. The method according to claim 3, wherein chip singulation comprises leaving a mechanical connection bridge (702) between adjacent fingerprint sensor chips.

5. The method according to any one of the preceding claims, wherein the protective material is deposited using spin or spray coating.

6. The method according to any one of claims 1 to 4, wherein the protective material is deposited using dry film lamination.

7. The method according to any one of the preceding claims, wherein the protective material is a polyimide or silicone based material.

8. The method according to any one of the preceding claims, wherein the protective material deposited on the chip edges has a thickness higher than 5pm.

9. The method according to any one of the preceding claims, further comprising performing secondary chip singulation by cutting through the protective material located between adjacent fingerprint sensor chips.

10. The method according to claim 9, wherein secondary chip singulation comprises saw cutting.

1 1 . The method according to claim 9 or 10, wherein secondary chip singulation comprises singulation of a carrier on which the fingerprint sensor wafer is arranged, wherein a sensing array of the fingerprint sensor chip faces the carrier.

12. The method according to claim 1 1 , wherein the carrier is a glass wafer.

13. The method according to claim 1 1 , wherein the carrier is an adhesive tape.

14. The method according to any one of the preceding claims, wherein depositing an electrically conductive material in the via connection opening is performed using a metal plating process.

15. The method according to claim 14, further comprising forming redistribution layer on the backside of the fingerprint sensor chip using the redistribution layer process.

16. A fingerprint sensor module (310, 400) manufactured using the method according to any one of the preceding claims.