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1. (WO2019004906) METHOD FOR MANUFACTURING A FINGERPRINT SENSOR MODULE
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Pub. No.: WO/2019/004906 International Application No.: PCT/SE2018/050674
Publication Date: 03.01.2019 International Filing Date: 21.06.2018
IPC:
G06K 9/00 (2006.01) ,H01L 21/768 (2006.01) ,H01L 23/48 (2006.01)
G PHYSICS
06
COMPUTING; CALCULATING; COUNTING
K
RECOGNITION OF DATA; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
9
Methods or arrangements for reading or recognising printed or written characters or for recognising patterns, e.g. fingerprints
H ELECTRICITY
01
BASIC ELECTRIC ELEMENTS
L
SEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
21
Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
70
Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in or on a common substrate or of specific parts thereof; Manufacture of integrated circuit devices or of specific parts thereof
71
Manufacture of specific parts of devices defined in group H01L21/7086
768
Applying interconnections to be used for carrying current between separate components within a device
H ELECTRICITY
01
BASIC ELECTRIC ELEMENTS
L
SEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
23
Details of semiconductor or other solid state devices
48
Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads or terminal arrangements
Applicants:
FINGERPRINT CARDS AB [SE/SE]; Box 2412 403 16 Göteborg, SE
Inventors:
JIANG, Di; SE
Agent:
KRANSELL & WENNBORG KB; P.O. Box 2096 403 12 GÖTEBORG, SE
Priority Data:
1750834-228.06.2017SE
Title (EN) METHOD FOR MANUFACTURING A FINGERPRINT SENSOR MODULE
(FR) PROCÉDÉ DE FABRICATION D'UN MODULE DE CAPTEUR D'EMPREINTE DIGITALE
Abstract:
(EN) There is provided a method for manufacturing a fingerprint sensor module (310, 400). The method comprises providing (100) a fingerprint sensor wafer (200) comprising a plurality of fingerprint sensor chips (201), wherein each sensor chip is configured to acquire an image of a finger placed on a sensing surface of the fingerprint sensor module; forming (102) at least one via connection opening (302) through the fingerprint sensor chip; performing (104) chip singulation, dividing the wafer into separate fingerprint sensor chips such that edges (304) of each fingerprint sensor chip are exposed after singulation; depositing (106) an electrically conductive material (306) in the at least one via connection opening, thereby forming an electrically conductive via connection reaching through the fingerprint sensor chip; and in one and the same process step, depositing (108) a protective material (308) on the electrically conductive material, on the backside of the fingerprint sensor chip, and on the chip edges.
(FR) L'invention concerne un procédé de fabrication d'un module de capteur d'empreinte digitale (310, 400). Le procédé consiste à fournir (100) une tranche de capteur d'empreinte digitale (200) comprenant une pluralité de puces de capteur d'empreinte digitale (201), chaque puce de capteur étant configurée pour acquérir une image d'un doigt placé sur une surface de détection du module de capteur d'empreinte digitale ; à former (102) au moins une ouverture de connexion de trou d'interconnexion (302) à travers la puce de capteur d'empreinte digitale ; à effectuer (104) une séparation de puces, par division de la tranche en puces de capteur d'empreinte digitale distinctes de sorte que des bords (304) de chaque puce de capteur d'empreinte digitale sont rendues visibles après la séparation ; à déposer (106) un matériau électroconducteur (306) dans ladite ouverture de connexion de trou d'interconnexion, ce qui permet de former une connexion de trou d'interconnexion électroconductrice passant par la puce de capteur d'empreinte digitale ; et dans une seule et même étape de processus, à déposer (108) un matériau de protection (308) sur le matériau électroconducteur, sur la face arrière de la puce de capteur d'empreinte digitale et sur les bords de puce.
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Designated States: AE, AG, AL, AM, AO, AT, AU, AZ, BA, BB, BG, BH, BN, BR, BW, BY, BZ, CA, CH, CL, CN, CO, CR, CU, CZ, DE, DJ, DK, DM, DO, DZ, EC, EE, EG, ES, FI, GB, GD, GE, GH, GM, GT, HN, HR, HU, ID, IL, IN, IR, IS, JO, JP, KE, KG, KH, KN, KP, KR, KW, KZ, LA, LC, LK, LR, LS, LU, LY, MA, MD, ME, MG, MK, MN, MW, MX, MY, MZ, NA, NG, NI, NO, NZ, OM, PA, PE, PG, PH, PL, PT, QA, RO, RS, RU, RW, SA, SC, SD, SE, SG, SK, SL, SM, ST, SV, SY, TH, TJ, TM, TN, TR, TT, TZ, UA, UG, US, UZ, VC, VN, ZA, ZM, ZW
African Regional Intellectual Property Organization (ARIPO) (BW, GH, GM, KE, LR, LS, MW, MZ, NA, RW, SD, SL, ST, SZ, TZ, UG, ZM, ZW)
Eurasian Patent Office (AM, AZ, BY, KG, KZ, RU, TJ, TM)
European Patent Office (EPO) (AL, AT, BE, BG, CH, CY, CZ, DE, DK, EE, ES, FI, FR, GB, GR, HR, HU, IE, IS, IT, LT, LU, LV, MC, MK, MT, NL, NO, PL, PT, RO, RS, SE, SI, SK, SM, TR)
African Intellectual Property Organization (BF, BJ, CF, CG, CI, CM, GA, GN, GQ, GW, KM, ML, MR, NE, SN, TD, TG)
Publication Language: English (EN)
Filing Language: English (EN)