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1. (WO2019004608) LIGHT EMITTING DEVICE PACKAGE
Latest bibliographic data on file with the International Bureau    Submit observation

Pub. No.: WO/2019/004608 International Application No.: PCT/KR2018/006059
Publication Date: 03.01.2019 International Filing Date: 29.05.2018
IPC:
H01L 33/48 (2010.01) ,H01L 33/00 (2010.01) ,H01L 33/36 (2010.01) ,H01L 33/62 (2010.01) ,H01L 33/40 (2010.01) ,H01L 33/52 (2010.01) ,H01L 33/20 (2010.01) ,H01L 33/22 (2010.01) ,H01L 33/54 (2010.01)
H ELECTRICITY
01
BASIC ELECTRIC ELEMENTS
L
SEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
33
Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
48
characterised by the semiconductor body packages
H ELECTRICITY
01
BASIC ELECTRIC ELEMENTS
L
SEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
33
Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
H ELECTRICITY
01
BASIC ELECTRIC ELEMENTS
L
SEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
33
Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
36
characterised by the electrodes
H ELECTRICITY
01
BASIC ELECTRIC ELEMENTS
L
SEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
33
Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
48
characterised by the semiconductor body packages
62
Arrangements for conducting electric current to or from the semiconductor body, e.g. leadframe, wire-bond or solder balls
H ELECTRICITY
01
BASIC ELECTRIC ELEMENTS
L
SEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
33
Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
36
characterised by the electrodes
40
Materials therefor
H ELECTRICITY
01
BASIC ELECTRIC ELEMENTS
L
SEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
33
Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
48
characterised by the semiconductor body packages
52
Encapsulations
H ELECTRICITY
01
BASIC ELECTRIC ELEMENTS
L
SEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
33
Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
02
characterised by the semiconductor bodies
20
with a particular shape, e.g. curved or truncated substrate
H ELECTRICITY
01
BASIC ELECTRIC ELEMENTS
L
SEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
33
Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
02
characterised by the semiconductor bodies
20
with a particular shape, e.g. curved or truncated substrate
22
Roughened surfaces, e.g. at the interface between epitaxial layers
H ELECTRICITY
01
BASIC ELECTRIC ELEMENTS
L
SEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
33
Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
48
characterised by the semiconductor body packages
52
Encapsulations
54
having a particular shape
Applicants:
엘지이노텍 주식회사 LG INNOTEK CO., LTD. [KR/KR]; 서울시 중구 후암로 98 98, Huam-ro Jung-gu Seoul 04637, KR
Inventors:
이태성 LEE, Tae Sung; KR
임창만 LIM, Chang Man; KR
김기석 KIM, Ki Seok; KR
김영신 KIM, Young Shin; KR
김원중 KIM, Won Jung; KR
송준오 SONG, June O; KR
Agent:
허용록 HAW, Yong Noke; KR
Priority Data:
10-2017-008129527.06.2017KR
10-2017-009303221.07.2017KR
10-2017-010793625.08.2017KR
Title (EN) LIGHT EMITTING DEVICE PACKAGE
(FR) BOÎTIER DE DISPOSITIF ÉLECTROLUMINESCENT
(KO) 발광소자 패키지
Abstract:
(EN) A light emitting device package according to an embodiment may comprise: a first and a second frame; a body disposed between the first and the second frame and including a recess; a first adhesive agent disposed on the recess; a light emitting device disposed on the first adhesive agent; a second adhesive agent disposed between the first frame and the light emitting device and between the second frame and the light emitting device; and a resin part disposed to surround a partial area of the second adhesive agent and the light emitting device.
(FR) Un boîtier de dispositif électroluminescent selon un mode de réalisation peut comprendre : un premier et un second cadre ; un corps disposé entre le premier et le second cadre et comprenant un évidement ; un premier agent adhésif disposé sur l'évidement ; un dispositif électroluminescent disposé sur le premier agent adhésif ; un second agent adhésif disposé entre le premier cadre et le dispositif électroluminescent et entre le second cadre et le dispositif électroluminescent ; et une partie résine disposée de façon à entourer une zone partielle du second agent adhésif et du dispositif électroluminescent.
(KO) 실시 예에 따른 발광소자 패키지는, 제1 및 제2 프레임; 제1 및 제2 프레임 사이에 배치되며 리세스를 포함하는 몸체; 리세스 상에 배치되는 제1 접착제; 제1 접착제 상에 배치되는 발광소자; 제1 및 제2 프레임과 발광소자 사이에 배치된 제2 접착제; 및 제2 접착제 및 발광소자의 일부 영역을 감싸며 배치되는 수지부; 를 포함할 수 있다.
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Designated States: AE, AG, AL, AM, AO, AT, AU, AZ, BA, BB, BG, BH, BN, BR, BW, BY, BZ, CA, CH, CL, CN, CO, CR, CU, CZ, DE, DJ, DK, DM, DO, DZ, EC, EE, EG, ES, FI, GB, GD, GE, GH, GM, GT, HN, HR, HU, ID, IL, IN, IR, IS, JO, JP, KE, KG, KH, KN, KP, KW, KZ, LA, LC, LK, LR, LS, LU, LY, MA, MD, ME, MG, MK, MN, MW, MX, MY, MZ, NA, NG, NI, NO, NZ, OM, PA, PE, PG, PH, PL, PT, QA, RO, RS, RU, RW, SA, SC, SD, SE, SG, SK, SL, SM, ST, SV, SY, TH, TJ, TM, TN, TR, TT, TZ, UA, UG, US, UZ, VC, VN, ZA, ZM, ZW
African Regional Intellectual Property Organization (ARIPO) (BW, GH, GM, KE, LR, LS, MW, MZ, NA, RW, SD, SL, ST, SZ, TZ, UG, ZM, ZW)
Eurasian Patent Office (AM, AZ, BY, KG, KZ, RU, TJ, TM)
European Patent Office (EPO) (AL, AT, BE, BG, CH, CY, CZ, DE, DK, EE, ES, FI, FR, GB, GR, HR, HU, IE, IS, IT, LT, LU, LV, MC, MK, MT, NL, NO, PL, PT, RO, RS, SE, SI, SK, SM, TR)
African Intellectual Property Organization (BF, BJ, CF, CG, CI, CM, GA, GN, GQ, GW, KM, ML, MR, NE, SN, TD, TG)
Publication Language: Korean (KO)
Filing Language: Korean (KO)