Some content of this application is unavailable at the moment.
If this situation persist, please contact us atFeedback&Contact
1. (WO2019004561) HIGH HEAT DISSIPATING THIN FILM AND METHOD FOR MANUFACTURING SAME
Latest bibliographic data on file with the International Bureau    Submit observation

Pub. No.: WO/2019/004561 International Application No.: PCT/KR2018/002591
Publication Date: 03.01.2019 International Filing Date: 05.03.2018
IPC:
B32B 9/04 (2006.01) ,H05K 7/20 (2006.01) ,B32B 9/00 (2006.01) ,B32B 15/20 (2006.01) ,B32B 15/18 (2006.01) ,B32B 37/06 (2006.01)
B PERFORMING OPERATIONS; TRANSPORTING
32
LAYERED PRODUCTS
B
LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
9
Layered products essentially comprising a particular substance not covered by groups B32B11/-B32B29/137
04
comprising such substance as the main or only constituent of a layer, next to another layer of a specific substance
H ELECTRICITY
05
ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
K
PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
7
Constructional details common to different types of electric apparatus
20
Modifications to facilitate cooling, ventilating, or heating
B PERFORMING OPERATIONS; TRANSPORTING
32
LAYERED PRODUCTS
B
LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
9
Layered products essentially comprising a particular substance not covered by groups B32B11/-B32B29/137
B PERFORMING OPERATIONS; TRANSPORTING
32
LAYERED PRODUCTS
B
LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
15
Layered products essentially comprising metal
20
comprising aluminium or copper
B PERFORMING OPERATIONS; TRANSPORTING
32
LAYERED PRODUCTS
B
LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
15
Layered products essentially comprising metal
18
comprising iron or steel
B PERFORMING OPERATIONS; TRANSPORTING
32
LAYERED PRODUCTS
B
LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
37
Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding
06
characterised by the heating method
Applicants:
주식회사 솔루에타 SOLUETA [KR/KR]; 경기도 안산시 단원구 별망로519번길 27, 5블럭 8롯트 (원시동) (Wonsi-dong) 5B8L, 27, Byeolmang-ro 519beon-gil Danwon-gu, Ansan-si Gyeonggi-do 15600, KR
Inventors:
민의홍 MIN, Eui Hong; KR
조상호 CHO, Sang Ho; KR
최벽근 CHOI, Buck Keun; KR
Agent:
박상열 PARK, Sangyoul; KR
Priority Data:
10-2017-008374530.06.2017KR
Title (EN) HIGH HEAT DISSIPATING THIN FILM AND METHOD FOR MANUFACTURING SAME
(FR) FILM MINCE DE DISSIPATION DE CHALEUR ÉLEVÉE ET SON PROCÉDÉ DE FABRICATION
(KO) 고방열 박막 및 그 제조 방법
Abstract:
(EN) Provided is a high heat dissipating thin film. The high heat dissipating thin film may comprise: a metal substrate; and a carbon layer disposed on the metal substrate, wherein the carbon layer is thicker than 2.5 nm and thinner than 10 nm.
(FR) L'invention concerne un film mince de dissipation de chaleur élevée. Le film mince de dissipation de chaleur élevée peut comprendre : un substrat métallique; et une couche de carbone disposée sur le substrat métallique, la couche de carbone étant supérieure à 2,5 nm et inférieure à 10 nm.
(KO) 고방열 박막이 제공된다. 상기 고방열 박막은, 금속 기판, 및 상기 금속 기판 상에 배치되고, 2.5nm보다 두껍고 10nm보다 얇은 탄소층을 포함할 수 있다.
front page image
Designated States: AE, AG, AL, AM, AO, AT, AU, AZ, BA, BB, BG, BH, BN, BR, BW, BY, BZ, CA, CH, CL, CN, CO, CR, CU, CZ, DE, DJ, DK, DM, DO, DZ, EC, EE, EG, ES, FI, GB, GD, GE, GH, GM, GT, HN, HR, HU, ID, IL, IN, IR, IS, JO, JP, KE, KG, KH, KN, KP, KW, KZ, LA, LC, LK, LR, LS, LU, LY, MA, MD, ME, MG, MK, MN, MW, MX, MY, MZ, NA, NG, NI, NO, NZ, OM, PA, PE, PG, PH, PL, PT, QA, RO, RS, RU, RW, SA, SC, SD, SE, SG, SK, SL, SM, ST, SV, SY, TH, TJ, TM, TN, TR, TT, TZ, UA, UG, US, UZ, VC, VN, ZA, ZM, ZW
African Regional Intellectual Property Organization (ARIPO) (BW, GH, GM, KE, LR, LS, MW, MZ, NA, RW, SD, SL, ST, SZ, TZ, UG, ZM, ZW)
Eurasian Patent Office (AM, AZ, BY, KG, KZ, RU, TJ, TM)
European Patent Office (EPO) (AL, AT, BE, BG, CH, CY, CZ, DE, DK, EE, ES, FI, FR, GB, GR, HR, HU, IE, IS, IT, LT, LU, LV, MC, MK, MT, NL, NO, PL, PT, RO, RS, SE, SI, SK, SM, TR)
African Intellectual Property Organization (BF, BJ, CF, CG, CI, CM, GA, GN, GQ, GW, KM, ML, MR, NE, SN, TD, TG)
Publication Language: Korean (KO)
Filing Language: Korean (KO)