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1. (WO2019004266) ELECTRONIC COMPONENT MODULE
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Pub. No.: WO/2019/004266 International Application No.: PCT/JP2018/024315
Publication Date: 03.01.2019 International Filing Date: 27.06.2018
IPC:
H01L 23/12 (2006.01) ,H01L 25/10 (2006.01) ,H01L 25/11 (2006.01) ,H01L 25/18 (2006.01)
H ELECTRICITY
01
BASIC ELECTRIC ELEMENTS
L
SEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
23
Details of semiconductor or other solid state devices
12
Mountings, e.g. non-detachable insulating substrates
H ELECTRICITY
01
BASIC ELECTRIC ELEMENTS
L
SEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
25
Assemblies consisting of a plurality of individual semiconductor or other solid state devices
03
all the devices being of a type provided for in the same subgroup of groups H01L27/-H01L51/128
10
the devices having separate containers
H ELECTRICITY
01
BASIC ELECTRIC ELEMENTS
L
SEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
25
Assemblies consisting of a plurality of individual semiconductor or other solid state devices
03
all the devices being of a type provided for in the same subgroup of groups H01L27/-H01L51/128
10
the devices having separate containers
11
the devices being of a type provided for in group H01L29/78
H ELECTRICITY
01
BASIC ELECTRIC ELEMENTS
L
SEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
25
Assemblies consisting of a plurality of individual semiconductor or other solid state devices
18
the devices being of types provided for in two or more different subgroups of the same main group of groups H01L27/-H01L51/160
Applicants:
株式会社村田製作所 MURATA MANUFACTURING CO., LTD. [JP/JP]; 京都府長岡京市東神足1丁目10番1号 10-1, Higashikotari 1-chome, Nagaokakyo-shi, Kyoto 6178555, JP
Inventors:
杣田 博史 SOMADA, Hiroshi; --
岩本 敬 IWAMOTO, Takashi; --
Agent:
特許業務法人北斗特許事務所 HOKUTO PATENT ATTORNEYS OFFICE; 大阪府大阪市北区梅田1‐12‐17 梅田スクエアビル9F Umeda Square Bldg., 9F., 1-12-17, Umeda, Kita-ku, Osaka-shi, Osaka 5300001, JP
Priority Data:
2017-12993230.06.2017JP
Title (EN) ELECTRONIC COMPONENT MODULE
(FR) MODULE DE COMPOSANT ÉLECTRONIQUE
(JA) 電子部品モジュール
Abstract:
(EN) Heat generated in an electronic component is dissipated more efficiently while maintaining electrical insulation between a through wire or a wiring layer and a structure. An electronic component module (1) comprises an electronic component (2), a structure (3), a through wire (4), and an insulator (6). The structure (3) covers at least a part of the electronic component (2) and has conductivity. The through wire (4) penetrates the structure (3). The insulator (6) is provided at least between the through wire (4) and the structure (3).
(FR) Selon la présente invention, la chaleur générée dans un composant électronique est dissipée plus efficacement tout en maintenant une isolation électrique entre un fil traversant ou une couche de câblage et une structure. Un module de composant électronique (1) comprend un composant électronique (2), une structure (3), un fil traversant (4) et un isolant (6). La structure (3) recouvre au moins une partie du composant électronique (2) et présente une conductivité. Le fil traversant (4) pénètre dans la structure (3). L'isolant (6) est disposé au moins entre le fil traversant (4) et la structure (3).
(JA) 貫通配線又は配線層と構造体との間の電気絶縁性を保ちながら、電子部品で発生した熱をより効率よく放熱する。電子部品モジュール(1)は、電子部品(2)と、構造体(3)と、貫通配線(4)と、絶縁体(6)とを備える。構造体(3)は、電子部品(2)の少なくとも一部を覆い、導電性を有する。貫通配線(4)は、構造体(3)を貫通している。絶縁体(6)は、少なくとも貫通配線(4)と構造体(3)との間に設けられている。
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Designated States: AE, AG, AL, AM, AO, AT, AU, AZ, BA, BB, BG, BH, BN, BR, BW, BY, BZ, CA, CH, CL, CN, CO, CR, CU, CZ, DE, DJ, DK, DM, DO, DZ, EC, EE, EG, ES, FI, GB, GD, GE, GH, GM, GT, HN, HR, HU, ID, IL, IN, IR, IS, JO, JP, KE, KG, KH, KN, KP, KR, KW, KZ, LA, LC, LK, LR, LS, LU, LY, MA, MD, ME, MG, MK, MN, MW, MX, MY, MZ, NA, NG, NI, NO, NZ, OM, PA, PE, PG, PH, PL, PT, QA, RO, RS, RU, RW, SA, SC, SD, SE, SG, SK, SL, SM, ST, SV, SY, TH, TJ, TM, TN, TR, TT, TZ, UA, UG, US, UZ, VC, VN, ZA, ZM, ZW
African Regional Intellectual Property Organization (ARIPO) (BW, GH, GM, KE, LR, LS, MW, MZ, NA, RW, SD, SL, ST, SZ, TZ, UG, ZM, ZW)
Eurasian Patent Office (AM, AZ, BY, KG, KZ, RU, TJ, TM)
European Patent Office (EPO) (AL, AT, BE, BG, CH, CY, CZ, DE, DK, EE, ES, FI, FR, GB, GR, HR, HU, IE, IS, IT, LT, LU, LV, MC, MK, MT, NL, NO, PL, PT, RO, RS, SE, SI, SK, SM, TR)
African Intellectual Property Organization (BF, BJ, CF, CG, CI, CM, GA, GN, GQ, GW, KM, ML, MR, NE, SN, TD, TG)
Publication Language: Japanese (JA)
Filing Language: Japanese (JA)