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1. (WO2019004150) HEAT-CONDUCTIVE SHEET
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Pub. No.: WO/2019/004150 International Application No.: PCT/JP2018/024062
Publication Date: 03.01.2019 International Filing Date: 25.06.2018
IPC:
C09K 5/14 (2006.01) ,C08K 3/013 (2018.01) ,C08K 5/541 (2006.01) ,C08L 83/04 (2006.01) ,H01L 23/36 (2006.01) ,H01L 23/373 (2006.01) ,H05K 7/20 (2006.01)
C CHEMISTRY; METALLURGY
09
DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
K
MATERIALS FOR APPLICATIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
5
Heat-transfer, heat-exchange or heat-storage materials, e.g. refrigerants; Materials for the production of heat or cold by chemical reactions other than by combustion
08
Materials not undergoing a change of physical state when used
14
Solid materials, e.g. powdery or granular
[IPC code unknown for C08K 3/013]
C CHEMISTRY; METALLURGY
08
ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
K
USE OF INORGANIC OR NON-MACROMOLECULAR ORGANIC SUBSTANCES AS COMPOUNDING INGREDIENTS
5
Use of organic ingredients
54
Silicon-containing compounds
541
containing oxygen
C CHEMISTRY; METALLURGY
08
ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
L
COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
83
Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon with or without sulfur, nitrogen, oxygen, or carbon only; Compositions of derivatives of such polymers
04
Polysiloxanes
H ELECTRICITY
01
BASIC ELECTRIC ELEMENTS
L
SEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
23
Details of semiconductor or other solid state devices
34
Arrangements for cooling, heating, ventilating or temperature compensation
36
Selection of materials, or shaping, to facilitate cooling or heating, e.g. heat sinks
H ELECTRICITY
01
BASIC ELECTRIC ELEMENTS
L
SEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
23
Details of semiconductor or other solid state devices
34
Arrangements for cooling, heating, ventilating or temperature compensation
36
Selection of materials, or shaping, to facilitate cooling or heating, e.g. heat sinks
373
Cooling facilitated by selection of materials for the device
H ELECTRICITY
05
ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
K
PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
7
Constructional details common to different types of electric apparatus
20
Modifications to facilitate cooling, ventilating, or heating
Applicants:
積水ポリマテック株式会社 SEKISUI POLYMATECH CO., LTD. [JP/JP]; 埼玉県さいたま市桜区田島八丁目10番1号 8-10-1 Tajima, Sakura-ku, Saitama-city, Saitama 3380837, JP
Inventors:
工藤 大希 KUDOH, Hiroki; JP
Agent:
田口 昌浩 TAGUCHI, Masahiro; JP
虎山 滋郎 TORAYAMA, Jiro; JP
Priority Data:
2017-12510427.06.2017JP
Title (EN) HEAT-CONDUCTIVE SHEET
(FR) FEUILLE THERMOCONDUCTRICE
(JA) 熱伝導性シート
Abstract:
(EN) This heat-conductive sheet comprises: a matrix composed of an organopolysiloxane having a cross-linked structure; a heat-conductive filler dispersed in the matrix; and a silicon compound. The silicon compound is at least one selected from alkoxysilane compounds and alkoxysiloxane compounds.
(FR) Cette feuille thermoconductrice comprend : une matrice composée d'un organopolysiloxane ayant une structure réticulée; une charge thermoconductrice dispersée dans la matrice; et un composé de silicium. Le composé de silicium est au moins un composé choisi parmi des composés alcoxysilanes et des composés alcoxysiloxanes.
(JA) 熱伝導性シートは、架橋構造を有するオルガノポリシロキサンから構成されるマトリクスと、マトリクス中に分散した熱伝導性充填材と、ケイ素化合物とを含有する。ケイ素化合物は、アルコキシシラン化合物及びアルコキシシロキサン化合物から選ばれる少なくとも一種である。
Designated States: AE, AG, AL, AM, AO, AT, AU, AZ, BA, BB, BG, BH, BN, BR, BW, BY, BZ, CA, CH, CL, CN, CO, CR, CU, CZ, DE, DJ, DK, DM, DO, DZ, EC, EE, EG, ES, FI, GB, GD, GE, GH, GM, GT, HN, HR, HU, ID, IL, IN, IR, IS, JO, JP, KE, KG, KH, KN, KP, KR, KW, KZ, LA, LC, LK, LR, LS, LU, LY, MA, MD, ME, MG, MK, MN, MW, MX, MY, MZ, NA, NG, NI, NO, NZ, OM, PA, PE, PG, PH, PL, PT, QA, RO, RS, RU, RW, SA, SC, SD, SE, SG, SK, SL, SM, ST, SV, SY, TH, TJ, TM, TN, TR, TT, TZ, UA, UG, US, UZ, VC, VN, ZA, ZM, ZW
African Regional Intellectual Property Organization (ARIPO) (BW, GH, GM, KE, LR, LS, MW, MZ, NA, RW, SD, SL, ST, SZ, TZ, UG, ZM, ZW)
Eurasian Patent Office (AM, AZ, BY, KG, KZ, RU, TJ, TM)
European Patent Office (EPO) (AL, AT, BE, BG, CH, CY, CZ, DE, DK, EE, ES, FI, FR, GB, GR, HR, HU, IE, IS, IT, LT, LU, LV, MC, MK, MT, NL, NO, PL, PT, RO, RS, SE, SI, SK, SM, TR)
African Intellectual Property Organization (BF, BJ, CF, CG, CI, CM, GA, GN, GQ, GW, KM, ML, MR, NE, SN, TD, TG)
Publication Language: Japanese (JA)
Filing Language: Japanese (JA)