Some content of this application is unavailable at the moment.
If this situation persist, please contact us atFeedback&Contact
1. (WO2019003995) CURABLE SILICONE COMPOSITION FOR DIE BONDING USE
Latest bibliographic data on file with the International Bureau    Submit observation

Pub. No.: WO/2019/003995 International Application No.: PCT/JP2018/023212
Publication Date: 03.01.2019 International Filing Date: 19.06.2018
IPC:
H01L 21/52 (2006.01) ,C08K 3/36 (2006.01) ,C08K 5/05 (2006.01) ,C08L 83/05 (2006.01) ,C08L 83/07 (2006.01)
H ELECTRICITY
01
BASIC ELECTRIC ELEMENTS
L
SEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
21
Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
02
Manufacture or treatment of semiconductor devices or of parts thereof
04
the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer, carrier concentration layer
50
Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the groups H01L21/06-H01L21/326162
52
Mounting semiconductor bodies in containers
C CHEMISTRY; METALLURGY
08
ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
K
USE OF INORGANIC OR NON-MACROMOLECULAR ORGANIC SUBSTANCES AS COMPOUNDING INGREDIENTS
3
Use of inorganic ingredients
34
Silicon-containing compounds
36
Silica
C CHEMISTRY; METALLURGY
08
ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
K
USE OF INORGANIC OR NON-MACROMOLECULAR ORGANIC SUBSTANCES AS COMPOUNDING INGREDIENTS
5
Use of organic ingredients
04
Oxygen-containing compounds
05
Alcohols; Metal alcoholates
C CHEMISTRY; METALLURGY
08
ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
L
COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
83
Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon with or without sulfur, nitrogen, oxygen, or carbon only; Compositions of derivatives of such polymers
04
Polysiloxanes
05
containing silicon bound to hydrogen
C CHEMISTRY; METALLURGY
08
ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
L
COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
83
Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon with or without sulfur, nitrogen, oxygen, or carbon only; Compositions of derivatives of such polymers
04
Polysiloxanes
07
containing silicon bound to unsaturated aliphatic groups
Applicants:
東レ・ダウコーニング株式会社 DOW CORNING TORAY CO., LTD. [JP/JP]; 東京都千代田区大手町一丁目5番1号 1-5-1, Otemachi, Chiyoda-ku, Tokyo 1000004, JP
Inventors:
山▲崎▼ 亮介 YAMAZAKI, Ryosuke; JP
山本 真一 YAMAMOTO, Shinichi; JP
Agent:
村山 靖彦 MURAYAMA Yasuhiko; 東京都千代田区丸の内一丁目9番2号 1-9-2, Marunouchi, Chiyoda-ku, Tokyo 1006620, JP
Priority Data:
2017-12437726.06.2017JP
Title (EN) CURABLE SILICONE COMPOSITION FOR DIE BONDING USE
(FR) COMPOSITION DE SILICONE DURCISSABLE SERVANT AU COLLAGE DE PUCES
(JA) ダイボンディング用硬化性シリコーン組成物
Abstract:
(EN) A curable silicone composition for die bonding use according to the present invention contains at least (A) an organopolysiloxane having at least two alkenyl groups per molecule, (B) an organopolysiloxane having at least two siloxane units each represented by the formula: RHSiO (wherein R represents a monovalent hydrocarbon group having 1 to 12 carbon atoms and having no aliphatic unsaturated bond) per molecule, (C) a platinum-group metal-based catalyst for hydrosilylation reactions, (D) a hydrosilylation reaction inhibitor and (E) an adhesiveness-imparting agent, wherein the scorch time (ts1), which is defined in JIS K 6300-2, at a die bonding temperature is 20 to 60 seconds, and the 90% vulcanization time [tc(90)] with respect to the maximum torque value during the vulcanization time of 600 seconds is 300 to 500 seconds. The curable silicone composition for die bonding use according to the present invention can adhere a semiconductor chip to a support strongly.
(FR) La présente invention concerne une composition de silicone durcissable servant au collage de puces, contenant au moins (A) un organopolysiloxane comprenant au moins deux groupes alcényle par molécule, (B) un organopolysiloxane comprenant au moins deux unités siloxane représentées chacune par la formule : RHSiO (dans laquelle R représente un groupe hydrocarboné monovalent qui comprend 1 à 12 atomes de carbone et ne comprend pas de liaison insaturée aliphatique) par molécule, (C) un catalyseur à base de métal du groupe platine de réactions d'hydrosilylation, (D) un inhibiteur de réaction d'hydrosilylation et (E) un agent d'adhésivité, le temps de grillage (ts1), défini dans JIS K 6300-2, à une température de collage de puce étant de 20 à 60 secondes, et le temps de vulcanisation de 90 % [tc (90)] par rapport à la valeur de couple maximale pendant le temps de vulcanisation de 600 secondes étant de 300 à 500 secondes. La composition de silicone durcissable de l'invention servant au collage de puces permet une forte adhérence d'une puce semi-conductrice à un support.
(JA) 本発明のダイボンディング用硬化性シリコーン組成物は、(A)一分子中にアルケニル基を少なくとも2個有するオルガノポリシロキサン、(B)一分子中に、式:RHSiO(式中、Rは脂肪族不飽和結合を有さない炭素数1~12の一価炭化水素基である。)で表されるシロキサン単位を少なくとも2個有するオルガノポリシロキサン、(C)ヒドロシリル化反応用白金族金属系触媒、(D)ヒドロシリル化反応抑制剤、および(E)接着性付与剤から少なくともなり、JIS K 6300-2で規定される、ダイボンディング温度におけるスコーチタイム(ts1)が20~60秒であり、加硫時間600秒までの最大トルク値に対する90%加硫時間[tc(90)]が300~500秒である。本発明のダイボンディング用硬化性シリコーン組成物は、半導体チップを支持体に強固に接着することができる。
front page image
Designated States: AE, AG, AL, AM, AO, AT, AU, AZ, BA, BB, BG, BH, BN, BR, BW, BY, BZ, CA, CH, CL, CN, CO, CR, CU, CZ, DE, DJ, DK, DM, DO, DZ, EC, EE, EG, ES, FI, GB, GD, GE, GH, GM, GT, HN, HR, HU, ID, IL, IN, IR, IS, JO, JP, KE, KG, KH, KN, KP, KR, KW, KZ, LA, LC, LK, LR, LS, LU, LY, MA, MD, ME, MG, MK, MN, MW, MX, MY, MZ, NA, NG, NI, NO, NZ, OM, PA, PE, PG, PH, PL, PT, QA, RO, RS, RU, RW, SA, SC, SD, SE, SG, SK, SL, SM, ST, SV, SY, TH, TJ, TM, TN, TR, TT, TZ, UA, UG, US, UZ, VC, VN, ZA, ZM, ZW
African Regional Intellectual Property Organization (ARIPO) (BW, GH, GM, KE, LR, LS, MW, MZ, NA, RW, SD, SL, ST, SZ, TZ, UG, ZM, ZW)
Eurasian Patent Office (AM, AZ, BY, KG, KZ, RU, TJ, TM)
European Patent Office (EPO) (AL, AT, BE, BG, CH, CY, CZ, DE, DK, EE, ES, FI, FR, GB, GR, HR, HU, IE, IS, IT, LT, LU, LV, MC, MK, MT, NL, NO, PL, PT, RO, RS, SE, SI, SK, SM, TR)
African Intellectual Property Organization (BF, BJ, CF, CG, CI, CM, GA, GN, GQ, GW, KM, ML, MR, NE, SN, TD, TG)
Publication Language: Japanese (JA)
Filing Language: Japanese (JA)