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1. (WO2019003959) POLISHING LIQUID COMPOSITION
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Pub. No.: WO/2019/003959 International Application No.: PCT/JP2018/022874
Publication Date: 03.01.2019 International Filing Date: 15.06.2018
IPC:
C09K 3/14 (2006.01) ,B24B 37/00 (2012.01) ,C09G 1/02 (2006.01) ,G11B 5/84 (2006.01)
C CHEMISTRY; METALLURGY
09
DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
K
MATERIALS FOR APPLICATIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
3
Materials not provided for elsewhere
14
Anti-slip materials; Abrasives
B PERFORMING OPERATIONS; TRANSPORTING
24
GRINDING; POLISHING
B
MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
37
Lapping machines or devices; Accessories
C CHEMISTRY; METALLURGY
09
DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
G
POLISHING COMPOSITIONS OTHER THAN FRENCH POLISH; SKI WAXES
1
Polishing compositions
02
containing abrasives or grinding agents
G PHYSICS
11
INFORMATION STORAGE
B
INFORMATION STORAGE BASED ON RELATIVE MOVEMENT BETWEEN RECORD CARRIER AND TRANSDUCER
5
Recording by magnetisation or demagnetisation of a record carrier; Reproducing by magnetic means; Record carriers therefor
84
Processes or apparatus specially adapted for manufacturing record carriers
Applicants:
花王株式会社 KAO CORPORATION [JP/JP]; 東京都中央区日本橋茅場町一丁目14番10号 14-10, Nihonbashi Kayabacho 1-chome, Chuo-ku, Tokyo 1038210, JP
Inventors:
三浦穣史 MIURA Joji; --
Agent:
特許業務法人池内アンドパートナーズ IKEUCHI & PARTNERS; 大阪府大阪市北区天満橋1丁目8番30号OAPタワー26階 26th Floor, OAP TOWER, 8-30, Tenmabashi 1-chome, Kita-ku, Osaka-shi, Osaka 5306026, JP
Priority Data:
2017-12555127.06.2017JP
Title (EN) POLISHING LIQUID COMPOSITION
(FR) COMPOSITION LIQUIDE DE POLISSAGE
(JA) 研磨液組成物
Abstract:
(EN) An aspect of the present invention provides a polishing liquid composition capable of enhancing polishing speed and reducing short-wavelength undulation after polishing. An aspect of the present invention relates to a polishing liquid composition for rough polishing of a Ni-P-plated aluminum alloy substrate, the composition containing non-spherical silica particles, a water-soluble polymer, and an aqueous medium, wherein the surface tension of a 1 mass% aqueous solution of the water-soluble polymer at 25ºC and pH 1.5 is 52-71 mN/m.
(FR) Un aspect de la présente invention concerne une composition liquide de polissage susceptible d’augmenter la vitesse de polissage et de réduire l’ondulation de courte longueur d’onde après le polissage. Un aspect de la présente invention concerne une composition liquide de polissage permettant le polissage grossier d’un substrat d’alliage d’aluminium plaqué de Ni-P, la composition contenant des particules de silice non sphériques, un polymère soluble dans l’eau et un milieu aqueux, la tension superficielle d’une solution aqueuse représentant 1 % en masse du polymère soluble dans l’eau à 25 °C et au pH 1,5 étant de 52 à 71 mN/m.
(JA) 一態様において、研磨速度を向上させ、研磨後の短波長うねりを低減できる研磨液組成物の提供。 一態様において、非球状シリカ粒子、水溶性高分子及び水系媒体を含み、前記水溶性高分子の1質量%水溶液の25℃、pH1.5における表面張力が、52mN/m以上71mN/m以下である、Ni-Pメッキされたアルミニウム合金基板の粗研磨用の研磨液組成物に関する。
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Designated States: AE, AG, AL, AM, AO, AT, AU, AZ, BA, BB, BG, BH, BN, BR, BW, BY, BZ, CA, CH, CL, CN, CO, CR, CU, CZ, DE, DJ, DK, DM, DO, DZ, EC, EE, EG, ES, FI, GB, GD, GE, GH, GM, GT, HN, HR, HU, ID, IL, IN, IR, IS, JO, KE, KG, KH, KN, KP, KR, KW, KZ, LA, LC, LK, LR, LS, LU, LY, MA, MD, ME, MG, MK, MN, MW, MX, MY, MZ, NA, NG, NI, NO, NZ, OM, PA, PE, PG, PH, PL, PT, QA, RO, RS, RU, RW, SA, SC, SD, SE, SG, SK, SL, SM, ST, SV, SY, TH, TJ, TM, TN, TR, TT, TZ, UA, UG, US, UZ, VC, VN, ZA, ZM, ZW
African Regional Intellectual Property Organization (ARIPO) (BW, GH, GM, KE, LR, LS, MW, MZ, NA, RW, SD, SL, ST, SZ, TZ, UG, ZM, ZW)
Eurasian Patent Office (AM, AZ, BY, KG, KZ, RU, TJ, TM)
European Patent Office (EPO) (AL, AT, BE, BG, CH, CY, CZ, DE, DK, EE, ES, FI, FR, GB, GR, HR, HU, IE, IS, IT, LT, LU, LV, MC, MK, MT, NL, NO, PL, PT, RO, RS, SE, SI, SK, SM, TR)
African Intellectual Property Organization (BF, BJ, CF, CG, CI, CM, GA, GN, GQ, GW, KM, ML, MR, NE, SN, TD, TG)
Publication Language: Japanese (JA)
Filing Language: Japanese (JA)