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1. (WO2019003677) GRINDING APPARATUS AND GRINDING METHOD
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Pub. No.: WO/2019/003677 International Application No.: PCT/JP2018/018732
Publication Date: 03.01.2019 International Filing Date: 15.05.2018
IPC:
H01L 21/205 (2006.01) ,B24B 7/18 (2006.01) ,B24B 27/033 (2006.01) ,C23C 16/44 (2006.01)
H ELECTRICITY
01
BASIC ELECTRIC ELEMENTS
L
SEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
21
Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
02
Manufacture or treatment of semiconductor devices or of parts thereof
04
the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer, carrier concentration layer
18
the devices having semiconductor bodies comprising elements of the fourth group of the Periodic System or AIIIBV compounds with or without impurities, e.g. doping materials
20
Deposition of semiconductor materials on a substrate, e.g. epitaxial growth
205
using reduction or decomposition of a gaseous compound yielding a solid condensate, i.e. chemical deposition
B PERFORMING OPERATIONS; TRANSPORTING
24
GRINDING; POLISHING
B
MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
7
Machines or devices designed for grinding plane surfaces on work, including polishing plane glass surfaces; Accessories therefor
10
Single-purpose machines or devices
18
for grinding floorings, walls, ceilings or the like
B PERFORMING OPERATIONS; TRANSPORTING
24
GRINDING; POLISHING
B
MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
27
Other grinding machines or devices
033
for grinding a surface for cleaning purposes, e.g. for descaling or for grinding off flaws in the surface
C CHEMISTRY; METALLURGY
23
COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
C
COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
16
Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition (CVD) processes
44
characterised by the method of coating
Applicants:
昭和電工株式会社 SHOWA DENKO K.K. [JP/JP]; 東京都港区芝大門一丁目13番9号 13-9, Shibadaimon 1-chome, Minato-ku, Tokyo 1058518, JP
Inventors:
深田 啓介 FUKADA Keisuke; JP
石橋 直人 ISHIBASHI Naoto; JP
Agent:
及川 周 OIKAWA Shu; JP
荒 則彦 ARA Norihiko; JP
勝俣 智夫 KATSUMATA Tomoo; JP
Priority Data:
2017-12927830.06.2017JP
Title (EN) GRINDING APPARATUS AND GRINDING METHOD
(FR) APPAREIL DE MEULAGE ET PROCÉDÉ DE MEULAGE
(JA) 研削装置および研削方法
Abstract:
(EN) A grinding apparatus (100) of the present invention has: a susceptor (101) for a film-forming substrate arranged inside a film formation chamber (11); a grinding member (102) configured by a flat plate-shaped base (102A) and a protruding part (102B) formed on the surface thereof; a conveyance means (103) for conveying the grinding member (102) to be mounted on the susceptor (101); and a rotation means (104) for rotating the susceptor (101) around a central axis (101c). So that one main surface of the base (102A) faces opposite the susceptor (101), in a state with the grinding member (102) mounted on the susceptor (101), when the susceptor (101) and the grinding member (102) are seen in plan view, the outermost peripheral part of the grinding member (102) is at the outside of the outermost peripheral part of the susceptor (101).
(FR) Un appareil de meulage (100) de la présente invention comprend : un suscepteur (101) pour un substrat de formation de film disposé à l'intérieur d'une chambre de formation de film (11); un élément de meulage (102) configuré par une base en forme de plaque plate (102A) et une partie en saillie (102B) formée sur sa surface; un moyen de transport (103) pour transporter l'élément de meulage (102) à monter sur le suscepteur (101); et un moyen de rotation (104) pour faire tourner le suscepteur (101) autour d'un axe central (101c). De telle sorte qu'une surface principale de la base (102A) fait face au suscepteur (101), dans un état avec l'élément de meulage (102) monté sur le suscepteur (101), lorsque le suscepteur (101) et l'élément de meulage (102) sont vus en vue en plan, la partie périphérique la plus à l'extérieur de l'élément de meulage (102) se trouve à l'extérieur de la partie périphérique la plus à l'extérieur du suscepteur (101).
(JA) 本発明の研削装置(100)は、成膜室(11)内に配される被成膜基板用のサセプタ(101)と、平板状の基部(102A)とその表面に形成された凸部(102B)とで構成される研削部材(102)と、研削部材(102)を、サセプタ(101)に載置されるように搬送する搬送手段(103)と、サセプタ(101)を中心軸(101c)の周りに回転させる回転手段(104)と、を有し、基部(102A)の片方の主面がサセプタ(101)と対向するように、研削部材(102)がサセプタ(101)に載置された状態において、サセプタ(101)および研削部材(102)を平面視した場合に、研削部材(102)の最外周部が、サセプタ(101)の最外周部の外側にある。
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Designated States: AE, AG, AL, AM, AO, AT, AU, AZ, BA, BB, BG, BH, BN, BR, BW, BY, BZ, CA, CH, CL, CN, CO, CR, CU, CZ, DE, DJ, DK, DM, DO, DZ, EC, EE, EG, ES, FI, GB, GD, GE, GH, GM, GT, HN, HR, HU, ID, IL, IN, IR, IS, JO, KE, KG, KH, KN, KP, KR, KW, KZ, LA, LC, LK, LR, LS, LU, LY, MA, MD, ME, MG, MK, MN, MW, MX, MY, MZ, NA, NG, NI, NO, NZ, OM, PA, PE, PG, PH, PL, PT, QA, RO, RS, RU, RW, SA, SC, SD, SE, SG, SK, SL, SM, ST, SV, SY, TH, TJ, TM, TN, TR, TT, TZ, UA, UG, US, UZ, VC, VN, ZA, ZM, ZW
African Regional Intellectual Property Organization (ARIPO) (BW, GH, GM, KE, LR, LS, MW, MZ, NA, RW, SD, SL, ST, SZ, TZ, UG, ZM, ZW)
Eurasian Patent Office (AM, AZ, BY, KG, KZ, RU, TJ, TM)
European Patent Office (EPO) (AL, AT, BE, BG, CH, CY, CZ, DE, DK, EE, ES, FI, FR, GB, GR, HR, HU, IE, IS, IT, LT, LU, LV, MC, MK, MT, NL, NO, PL, PT, RO, RS, SE, SI, SK, SM, TR)
African Intellectual Property Organization (BF, BJ, CF, CG, CI, CM, GA, GN, GQ, GW, KM, ML, MR, NE, SN, TD, TG)
Publication Language: Japanese (JA)
Filing Language: Japanese (JA)