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1. (WO2019003600) SEALING RESIN COMPOSITION, ELECTRONIC COMPONENT, AND ELECTRONIC COMPONENT MANUFACTURING METHOD
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Pub. No.: WO/2019/003600 International Application No.: PCT/JP2018/016120
Publication Date: 03.01.2019 International Filing Date: 19.04.2018
IPC:
C08L 63/00 (2006.01) ,C08G 59/18 (2006.01) ,C08K 3/013 (2018.01) ,C08K 3/36 (2006.01) ,C08K 5/09 (2006.01) ,C08K 7/24 (2006.01) ,C08K 7/26 (2006.01) ,H01G 2/10 (2006.01) ,H01G 4/32 (2006.01)
C CHEMISTRY; METALLURGY
08
ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
L
COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
63
Compositions of epoxy resins; Compositions of derivatives of epoxy resins
C CHEMISTRY; METALLURGY
08
ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
G
MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
59
Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by reaction of epoxy polycondensates with monofunctional low-molecular-weight compounds; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
18
Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
[IPC code unknown for C08K 3/013]
C CHEMISTRY; METALLURGY
08
ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
K
USE OF INORGANIC OR NON-MACROMOLECULAR ORGANIC SUBSTANCES AS COMPOUNDING INGREDIENTS
3
Use of inorganic ingredients
34
Silicon-containing compounds
36
Silica
C CHEMISTRY; METALLURGY
08
ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
K
USE OF INORGANIC OR NON-MACROMOLECULAR ORGANIC SUBSTANCES AS COMPOUNDING INGREDIENTS
5
Use of organic ingredients
04
Oxygen-containing compounds
09
Carboxylic acids; Metal salts thereof; Anhydrides thereof
C CHEMISTRY; METALLURGY
08
ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
K
USE OF INORGANIC OR NON-MACROMOLECULAR ORGANIC SUBSTANCES AS COMPOUNDING INGREDIENTS
7
Use of ingredients characterised by shape
22
Expanded, porous or hollow particles
24
inorganic
C CHEMISTRY; METALLURGY
08
ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
K
USE OF INORGANIC OR NON-MACROMOLECULAR ORGANIC SUBSTANCES AS COMPOUNDING INGREDIENTS
7
Use of ingredients characterised by shape
22
Expanded, porous or hollow particles
24
inorganic
26
Silicon-containing compounds
H ELECTRICITY
01
BASIC ELECTRIC ELEMENTS
G
CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
2
Details of capacitors not covered by a single one of groups H01G4/-H01G11/112
10
Housing; Encapsulation
H ELECTRICITY
01
BASIC ELECTRIC ELEMENTS
G
CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
4
Fixed capacitors; Processes of their manufacture
32
Wound capacitors
Applicants:
京セラ株式会社 KYOCERA CORPORATION [JP/JP]; 京都府京都市伏見区竹田鳥羽殿町6番地 6, Takeda Tobadono-cho, Fushimi-ku, Kyoto-shi, Kyoto 6128501, JP
Inventors:
峯岸 悠香里 MINEGISHI Yukari; JP
Agent:
特許業務法人サクラ国際特許事務所 SAKURA PATENT OFFICE, P.C.; 東京都千代田区内神田一丁目18番14号 ヨシザワビル Yoshizawa Bldg., 18-14, Uchikanda 1-chome, Chiyoda-ku, Tokyo 1010047, JP
Priority Data:
2017-12602428.06.2017JP
Title (EN) SEALING RESIN COMPOSITION, ELECTRONIC COMPONENT, AND ELECTRONIC COMPONENT MANUFACTURING METHOD
(FR) COMPOSITION DE RÉSINE D'ÉTANCHÉITÉ, COMPOSANT ÉLECTRONIQUE ET PROCÉDÉ DE FABRICATION DE COMPOSANT ÉLECTRONIQUE
(JA) 封止用樹脂組成物、電子部品及び電子部品の製造方法
Abstract:
(EN) Provided are: a resin composition that has a good external appearance without the occurrence of voids, that exhibits low moisture permeability as a cured product, that exhibits a low rate of change of capacitance, and that is suitable for manufacturing an electronic component that has superior reliability; and an electronic component employing said resin composition. A film capacitor 11 includes: a sealing resin composition that contains, as essential components, (A) a liquid epoxy resin, (B) a curing agent, (C) a curing accelerator, (D) a porous filler, and (E) an inorganic filler other than the porous filler (D); a film capacitor element 3; and a cured product 12 of the sealing resin composition which seals the film capacitor element 3.
(FR) L'invention concerne : une composition de résine qui a un bon aspect externe sans l'apparition de vides, qui présente une faible perméabilité à l'humidité en tant que produit durci, qui présente un faible taux de changement de capacité, et qui est appropriée pour la fabrication d'un composant électronique qui a une fiabilité supérieure ; et un composant électronique utilisant ladite composition de résine. Un condensateur à film 11 comprend : une composition de résine d'étanchéité qui contient, en tant que composants essentiels, (A) une résine époxyde liquide, (B) un agent de durcissement, (C) un accélérateur de durcissement, (D) une charge poreuse, et (E) une charge inorganique autre que la charge poreuse (D) ; un élément de condensateur à film 3 ; et un produit durci 12 de la composition de résine d'étanchéité qui scelle l'élément de condensateur à film 3.
(JA) ボイドの発生がなく外観が良好で、硬化物の透湿性が低く、静電容量の変化率の少ない、信頼性に優れた電子部品の製造に好適な樹脂組成物、該樹脂組成物を用いた電子部品を提供する。(A)液状エポキシ樹脂と、(B)硬化剤と、(C)硬化促進剤と、(D)多孔質フィラーと、(E)前記(D)多孔質フィラー以外の無機フィラーと、を必須成分として含有する封止用樹脂組成物及びフィルムコンデンサ素子3と、該フィルムコンデンサ素子3を封止している封止用樹脂組成物の硬化物12と、を有するフィルムコンデンサ11。
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Designated States: AE, AG, AL, AM, AO, AT, AU, AZ, BA, BB, BG, BH, BN, BR, BW, BY, BZ, CA, CH, CL, CN, CO, CR, CU, CZ, DE, DJ, DK, DM, DO, DZ, EC, EE, EG, ES, FI, GB, GD, GE, GH, GM, GT, HN, HR, HU, ID, IL, IN, IR, IS, JO, JP, KE, KG, KH, KN, KP, KR, KW, KZ, LA, LC, LK, LR, LS, LU, LY, MA, MD, ME, MG, MK, MN, MW, MX, MY, MZ, NA, NG, NI, NO, NZ, OM, PA, PE, PG, PH, PL, PT, QA, RO, RS, RU, RW, SA, SC, SD, SE, SG, SK, SL, SM, ST, SV, SY, TH, TJ, TM, TN, TR, TT, TZ, UA, UG, US, UZ, VC, VN, ZA, ZM, ZW
African Regional Intellectual Property Organization (ARIPO) (BW, GH, GM, KE, LR, LS, MW, MZ, NA, RW, SD, SL, ST, SZ, TZ, UG, ZM, ZW)
Eurasian Patent Office (AM, AZ, BY, KG, KZ, RU, TJ, TM)
European Patent Office (EPO) (AL, AT, BE, BG, CH, CY, CZ, DE, DK, EE, ES, FI, FR, GB, GR, HR, HU, IE, IS, IT, LT, LU, LV, MC, MK, MT, NL, NO, PL, PT, RO, RS, SE, SI, SK, SM, TR)
African Intellectual Property Organization (BF, BJ, CF, CG, CI, CM, GA, GN, GQ, GW, KM, ML, MR, NE, SN, TD, TG)
Publication Language: Japanese (JA)
Filing Language: Japanese (JA)