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1. (WO2019003111) FLEXIBLE CIRCUIT WITH METAL AND METAL OXIDE LAYERS HAVING THE SAME METAL
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CLAIMS

1. A flexible multilayer construction, comprising:

a flexible dielectric metal oxide layer comprising a first metal and opposing top and bottom major surfaces;

at least one electrically conductive via extending through at least a portion of the dielectric metal oxide layer and comprising a second metal different than the first metal; and

an electrically conductive terminal disposed on the top major surface of the dielectric metal oxide layer and making electrical and physical contact with the at least one electrically conductive via and comprising the first metal .

2. The flexible multilayer construction of claim 1, wherein the first metal is aluminum, the dielectric metal oxide layer is a dielectric aluminum oxide layer, and the second metal is copper.

3. The flexible multilayer construction of claim 1, wherein each electrically conductive via in the at least one electrically conductive via comprises a via extending through the at least a portion of the dielectric metal oxide layer and the second metal substantially filling the via.

4. The flexible multilayer construction of claim 1, wherein a maximum thickness of the flexible dielectric metal oxide layer is less than about 150 microns.

5. The flexible multilayer construction of claim 1, wherein the at least one electrically conductive via comprises a plurality of electrically conductive through vias, each electrically conductive through via extending at least between the top and bottom major surfaces of the dielectric metal oxide layer.

6. The flexible multilayer construction of claim 1, wherein the flexible dielectric metal oxide layer defines first and second recesses formed in the top major surface thereof, the first and second recesses having different average depths.

7. A flexible construction, comprising:

a flexible electrically continuous first metal layer comprising opposing top and bottom major surfaces; and

at least one second metal partial via extending from proximate the bottom major surface of the first metal layer partially through a thickness the first metal layer such that a bottom surface of the at least one second metal partial via is exposed from the bottom major surface side of the first metal layer and a top surface of the at least one second metal partial via is completely covered by and makes electrical and physical contact with the first metal layer, wherein in a cross-section perpendicular to a plane of the

construction, the first metal layer includes a recess on each side of the at least one second metal partial via.

8. The flexible construction of claim 7, wherein the bottom surface of the at least one second metal partial via extends beyond the bottom major surface of the first metal layer.

9. A method of making a multilayer construction, comprising the steps of:

providing a flexible electrically conductive layer comprising a first metal and opposing top and bottom major surfaces;

forming at least one via in the electrically conductive layer extending from the bottom major surface of the electrically conductive layer through only a portion of a thickness of the electrically conductive layer;

substantially filling the at least one via with a second metal different than the first metal to form at least one electrically conductive via;

patterning a top portion of the electrically conductive layer so that in a cross-section perpendicular to a plane of the conductive layer, the conductive layer includes a recess on each side of the at least one electrically conductive via; and

converting the first metal to an oxide of the first metal in a bottom, but not the top, portion of the electrically conductive layer, resulting in an unconverted electrically conductive layer comprising the first metal disposed on a dielectric metal oxide layer comprising an oxide of the first metal.

10. The method of claim 9, wherein the first metal is converted to the oxide of the first metal by electrolytic oxidation.