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1. (WO2019003111) FLEXIBLE CIRCUIT WITH METAL AND METAL OXIDE LAYERS HAVING THE SAME METAL
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Pub. No.: WO/2019/003111 International Application No.: PCT/IB2018/054709
Publication Date: 03.01.2019 International Filing Date: 26.06.2018
IPC:
H01L 23/15 (2006.01) ,H01L 23/498 (2006.01)
H ELECTRICITY
01
BASIC ELECTRIC ELEMENTS
L
SEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
23
Details of semiconductor or other solid state devices
12
Mountings, e.g. non-detachable insulating substrates
14
characterised by the material or its electrical properties
15
Ceramic or glass substrates
H ELECTRICITY
01
BASIC ELECTRIC ELEMENTS
L
SEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
23
Details of semiconductor or other solid state devices
48
Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads or terminal arrangements
488
consisting of soldered or bonded constructions
498
Leads on insulating substrates
Applicants:
3M INNOVATIVE PROPERTIES COMPANY [US/US]; 3M Center Post Office Box 33427 Saint Paul, Minnesota 55133-3427, US
Inventors:
PALANISWAMY, Ravi; SG
NARAG, Alejandro Aldrin II; SG
GAO, Jianxia; SG
TAN, Vincent; SG
Agent:
MOSHREFZADEH, Robert S.; US
BLANK, Colene H.,; US
HARTS, Dean M. ,; US
LEVINSON, Eric D.,; US
MAKI, Eloise J.,; US
NOWAK, Sandra K.,; US
OLSON, Peter L.,; US
RHODES, Kevin H.; US
RINGSRED, Ted K.,; US
Priority Data:
62/526,40929.06.2017US
Title (EN) FLEXIBLE CIRCUIT WITH METAL AND METAL OXIDE LAYERS HAVING THE SAME METAL
(FR) CIRCUIT FLEXIBLE AVEC DES COUCHES DE MÉTAL ET D'OXYDE MÉTALLIQUE CONTENANT LE MÊME MÉTAL
Abstract:
(EN) A multilayer construction includes a dielectric metal oxide layer having a first metal and opposing top and bottom major surfaces. The construction also includes a conductive via that extends through at least a portion of the oxide layer and includes a second metal different than the first metal. The construction also includes a conductive terminal that is disposed on the oxide layer, makes electrical and physical contact with the conductive via and includes the first metal.
(FR) Cette invention concerne une structure multicouches comprenant une couche d'oxyde métallique diélectrique ayant un premier métal et des surfaces principales supérieure et inférieure opposées. La structure comprend en outre un trou d'interconnexion conducteur qui s'étend à travers au moins une partie de la couche d'oxyde et comprend un second métal différent du premier métal. La structure comprend en outre une borne conductrice qui est disposée sur la couche d'oxyde, établit un contact électrique et physique avec le trou d'interconnexion conducteur et comprend le premier métal.
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Designated States: AE, AG, AL, AM, AO, AT, AU, AZ, BA, BB, BG, BH, BN, BR, BW, BY, BZ, CA, CH, CL, CN, CO, CR, CU, CZ, DE, DJ, DK, DM, DO, DZ, EC, EE, EG, ES, FI, GB, GD, GE, GH, GM, GT, HN, HR, HU, ID, IL, IN, IR, IS, JO, JP, KE, KG, KH, KN, KP, KR, KW, KZ, LA, LC, LK, LR, LS, LU, LY, MA, MD, ME, MG, MK, MN, MW, MX, MY, MZ, NA, NG, NI, NO, NZ, OM, PA, PE, PG, PH, PL, PT, QA, RO, RS, RU, RW, SA, SC, SD, SE, SG, SK, SL, SM, ST, SV, SY, TH, TJ, TM, TN, TR, TT, TZ, UA, UG, US, UZ, VC, VN, ZA, ZM, ZW
African Regional Intellectual Property Organization (ARIPO) (BW, GH, GM, KE, LR, LS, MW, MZ, NA, RW, SD, SL, ST, SZ, TZ, UG, ZM, ZW)
Eurasian Patent Office (AM, AZ, BY, KG, KZ, RU, TJ, TM)
European Patent Office (EPO) (AL, AT, BE, BG, CH, CY, CZ, DE, DK, EE, ES, FI, FR, GB, GR, HR, HU, IE, IS, IT, LT, LU, LV, MC, MK, MT, NL, NO, PL, PT, RO, RS, SE, SI, SK, SM, TR)
African Intellectual Property Organization (BF, BJ, CF, CG, CI, CM, GA, GN, GQ, GW, KM, ML, MR, NE, SN, TD, TG)
Publication Language: English (EN)
Filing Language: English (EN)