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1. (WO2019001847) LASER BEAM CUTTING
Latest bibliographic data on file with the International Bureau    Submit observation

Pub. No.: WO/2019/001847 International Application No.: PCT/EP2018/063307
Publication Date: 03.01.2019 International Filing Date: 22.05.2018
IPC:
B23K 26/0622 (2014.01) ,B23K 26/06 (2014.01) ,B23K 26/08 (2014.01) ,B23K 26/082 (2014.01) ,B23K 26/03 (2006.01) ,B23K 26/38 (2014.01) ,B23K 26/402 (2014.01) ,B23K 103/16 (2006.01)
[IPC code unknown for B23K 26/0622]
B PERFORMING OPERATIONS; TRANSPORTING
23
MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
K
SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
26
Working by laser beam, e.g. welding, cutting, boring
02
Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
06
Shaping the laser beam, e.g. by masks or multi-focusing
B PERFORMING OPERATIONS; TRANSPORTING
23
MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
K
SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
26
Working by laser beam, e.g. welding, cutting, boring
08
Devices involving relative movement between laser beam and workpiece
[IPC code unknown for B23K 26/082]
B PERFORMING OPERATIONS; TRANSPORTING
23
MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
K
SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
26
Working by laser beam, e.g. welding, cutting, boring
02
Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
03
Observing the workpiece
B PERFORMING OPERATIONS; TRANSPORTING
23
MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
K
SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
26
Working by laser beam, e.g. welding, cutting, boring
36
Removing material
38
by boring or cutting
[IPC code unknown for B23K 26/402]
B PERFORMING OPERATIONS; TRANSPORTING
23
MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
K
SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
103
Materials to be soldered, welded or cut
16
Composite materials
Applicants:
TECHNISCHE UNIVERSITÄT HAMBURG-HARBURG [DE/DE]; Am Schwarzenberg-Campus, 1 21073 Hamburg, DE
Inventors:
CANISIUS, Marten; DE
OBERLANDER, Max; DE
HERGOSS, Philipp; DE
EMMELMANN, Claus; DE
Agent:
KOPLIN PATENTANWALTSGESELLSCHAFT MBH; Anne-Conway-Str. 1 Bremen, 28359, DE
Priority Data:
10 2017 114 518.429.06.2017DE
Title (EN) LASER BEAM CUTTING
(FR) SYSTÈME DE COUPE AU LASER
(DE) LASERSTRAHLSCHNEIDEN
Abstract:
(EN) The invention relates to a laser beam cutting system (10). The laser beam cutting system (10) comprises a first focusing optics (16) which is adapted to focus the laser beam on points on a first spatial curve (26a) and a second focusing optics (16) which is adapted to focus the laser beam on points on a second spatial curve (26b), the laser beam cutting system (10) also being designed to perform a routine in order to secure a desired overlapping of the spatial curves (26a, 26b). The laser beam cutting system (10) is also designed to monitor, during the routine, a focusing of the laser beam on one or more of the points on the first spatial curve (26a) and a focusing of the laser beam on one or more of the points on the second spatial curve (26b) and if the desired overlapping of the spatial curve (26a) can not be verified, to determine data relating to an offset between the spatial curves (26a, 26b).
(FR) L'invention concerne un système de coupe au laser (10). Le système de coupe au laser (10) comprend une première optique de focalisation (16) qui est conçue pour focaliser un rayonnement laser sur des points situés sur une première courbe spatiale (26a) et une seconde optique de focalisation (16) qui est configurée pour focaliser un rayonnement laser sur des points situés sur une seconde courbe spatiale (26b), le système de coupe au laser (10) étant conçu pour exécuter une routine permettant d’assurer un chevauchement souhaité des courbes spatiales (26a, 26b). Le système de coupe au laser (10) est par ailleurs conçu pour surveiller pendant la routine une focalisation du rayonnement laser sur un ou plusieurs des points situés sur la première courbe spatiale (26a) et une focalisation du rayonnement laser sur un ou plusieurs points situés sur la seconde courbe spatiale (26b) et pour, si le chevauchement souhaité des courbes spatiales (26a, 26b) n’est pas confirmé, déterminer des données relatives à un décalage entre les courbes spatiales (26a, 26b).
(DE) Gezeigt wird ein Laserstrahlschneidsystem (10). Das Laserstrahlschneidsystem (10) umfasst eine erste Fokussieroptik (16), welche dazu eingerichtet ist, Laserstrahlung auf Punkte auf einer ersten Raumkurve 26a zu fokussieren und eine zweite Fokussieroptik (16), welche dazu eingerichtet ist, Laserstrahlung auf Punkte auf einer zweiten Raumkurve (26b) zu fokussieren, wobei das Laserstrahlschneidsystem (10) eingerichtet ist, eine Routine durchzuführen, um eine gewünschte Überlappung der Raumkurven (26a), (26b) sicherzustellen. Das Laserstrahlschneidsystem (10) ist ferner eingerichtet ist während der Routine ein Fokussieren von Laserstrahlung auf einen oder mehrere der Punkte auf der ersten Raumkurve (26a) und ein Fokussieren von Laserstrahlung auf einen oder mehrere Punkte auf der zweiten Raumkurve (26b) zu überwachen und wenn die gewünschte Überlappung der Raumkurven (26a), (26b) nicht bestätigt werden kann, Daten hinsichtlich eines Versatzes zwischen den Raumkurven (26a), (26b) zu ermitteln.
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Designated States: AE, AG, AL, AM, AO, AT, AU, AZ, BA, BB, BG, BH, BN, BR, BW, BY, BZ, CA, CH, CL, CN, CO, CR, CU, CZ, DE, DJ, DK, DM, DO, DZ, EC, EE, EG, ES, FI, GB, GD, GE, GH, GM, GT, HN, HR, HU, ID, IL, IN, IR, IS, JO, JP, KE, KG, KH, KN, KP, KR, KW, KZ, LA, LC, LK, LR, LS, LU, LY, MA, MD, ME, MG, MK, MN, MW, MX, MY, MZ, NA, NG, NI, NO, NZ, OM, PA, PE, PG, PH, PL, PT, QA, RO, RS, RU, RW, SA, SC, SD, SE, SG, SK, SL, SM, ST, SV, SY, TH, TJ, TM, TN, TR, TT, TZ, UA, UG, US, UZ, VC, VN, ZA, ZM, ZW
African Regional Intellectual Property Organization (ARIPO) (BW, GH, GM, KE, LR, LS, MW, MZ, NA, RW, SD, SL, ST, SZ, TZ, UG, ZM, ZW)
Eurasian Patent Office (AM, AZ, BY, KG, KZ, RU, TJ, TM)
European Patent Office (EPO) (AL, AT, BE, BG, CH, CY, CZ, DE, DK, EE, ES, FI, FR, GB, GR, HR, HU, IE, IS, IT, LT, LU, LV, MC, MK, MT, NL, NO, PL, PT, RO, RS, SE, SI, SK, SM, TR)
African Intellectual Property Organization (BF, BJ, CF, CG, CI, CM, GA, GN, GQ, GW, KM, ML, MR, NE, SN, TD, TG)
Publication Language: German (DE)
Filing Language: German (DE)