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1. (WO2018235918) RESIN MATERIAL, METHOD FOR PRODUCING RESIN MATERIAL, AND LAMINATE
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Pub. No.: WO/2018/235918 International Application No.: PCT/JP2018/023689
Publication Date: 27.12.2018 International Filing Date: 21.06.2018
IPC:
C08L 63/00 (2006.01) ,B32B 27/18 (2006.01) ,C08J 5/18 (2006.01) ,C08K 3/00 (2018.01) ,C08K 3/22 (2006.01) ,C08K 3/38 (2006.01) ,C08K 7/00 (2006.01) ,C08L 63/02 (2006.01) ,H01B 3/00 (2006.01)
C CHEMISTRY; METALLURGY
08
ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
L
COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
63
Compositions of epoxy resins; Compositions of derivatives of epoxy resins
B PERFORMING OPERATIONS; TRANSPORTING
32
LAYERED PRODUCTS
B
LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
27
Layered products essentially comprising synthetic resin
18
characterised by the use of special additives
C CHEMISTRY; METALLURGY
08
ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
J
WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H142
5
Manufacture of articles or shaped materials containing macromolecular substances
18
Manufacture of films or sheets
C CHEMISTRY; METALLURGY
08
ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
K
USE OF INORGANIC OR NON-MACROMOLECULAR ORGANIC SUBSTANCES AS COMPOUNDING INGREDIENTS
3
Use of inorganic ingredients
C CHEMISTRY; METALLURGY
08
ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
K
USE OF INORGANIC OR NON-MACROMOLECULAR ORGANIC SUBSTANCES AS COMPOUNDING INGREDIENTS
3
Use of inorganic ingredients
18
Oxygen-containing compounds, e.g. metal carbonyls
20
Oxides; Hydroxides
22
of metals
C CHEMISTRY; METALLURGY
08
ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
K
USE OF INORGANIC OR NON-MACROMOLECULAR ORGANIC SUBSTANCES AS COMPOUNDING INGREDIENTS
3
Use of inorganic ingredients
38
Boron-containing compounds
C CHEMISTRY; METALLURGY
08
ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
K
USE OF INORGANIC OR NON-MACROMOLECULAR ORGANIC SUBSTANCES AS COMPOUNDING INGREDIENTS
7
Use of ingredients characterised by shape
C CHEMISTRY; METALLURGY
08
ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
L
COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
63
Compositions of epoxy resins; Compositions of derivatives of epoxy resins
02
Polyglycidyl ethers of bis-phenols
H ELECTRICITY
01
BASIC ELECTRIC ELEMENTS
B
CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
3
Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties
Applicants:
積水化学工業株式会社 SEKISUI CHEMICAL CO., LTD. [JP/JP]; 大阪府大阪市北区西天満2丁目4番4号 4-4, Nishitemma 2-chome, Kita-ku, Osaka-shi, Osaka 5308565, JP
Inventors:
川原 悠子 KAWAHARA, Yuko; JP
大鷲 圭吾 OOWASHI, Keigo; JP
足羽 剛児 ASHIBA, Kouji; JP
張 鋭 ZHANG, Rui; JP
乾 靖 INUI, Osamu; JP
前中 寛 MAENAKA, Hiroshi; JP
Agent:
特許業務法人 宮▲崎▼・目次特許事務所 MIYAZAKI & METSUGI; 大阪府大阪市中央区常盤町1丁目3番8号 中央大通FNビル Chuo Odori FN Bldg., 3-8, Tokiwamachi 1-chome, Chuo-ku, Osaka-shi, Osaka 5400028, JP
Priority Data:
2017-12350923.06.2017JP
Title (EN) RESIN MATERIAL, METHOD FOR PRODUCING RESIN MATERIAL, AND LAMINATE
(FR) MATÉRIAU DE RÉSINE, PROCÉDÉ DE PRODUCTION DE MATÉRIAU DE RÉSINE, ET STRATIFIÉ
(JA) 樹脂材料、樹脂材料の製造方法及び積層体
Abstract:
(EN) Provided is a resin material that makes it possible to effectively enhance adhesiveness and long-term insulating reliability. This resin material contains first inorganic particles having an average aspect ratio of 2 or less, second inorganic particles having an average aspect ratio greater than 2, and a binder resin. The absolute value of the difference between the average particle diameter of the first inorganic particles and the average longitudinal diameter of the second inorganic particles is 10 µm or less, the average particle diameter of the first inorganic particles is 1 µm or more and less than 20 µm, the average longitudinal diameter of the second inorganic particles is 2 µm or more, and the content of the second inorganic particles surpasses 40 vol% in a total of 100 vol% of the first inorganic particles and the second inorganic particles.
(FR) L'invention concerne un matériau de résine pouvant améliorer efficacement l'adhésivité et la fiabilité d'isolation à long terme. Ce matériau de résine contient des premières particules inorganiques ayant un rapport de forme moyen d'au plus 2, des secondes particules inorganiques ayant un rapport de forme moyen supérieur à 2, et une résine agglomérante. La valeur absolue de la différence entre le diamètre de particule moyen des premières particules inorganiques et le diamètre longitudinal moyen des secondes particules inorganiques est d'au plus 10 µm; le diamètre moyen de particule des premières particules inorganiques est supérieur ou égal à 1 µm et inférieur à 20 µm; le diamètre longitudinal moyen des secondes particules inorganiques est d'au moins 2 µm; et la teneur des secondes particules inorganiques dépasse 40% en volume sur un total de 100% en volume des premières particules inorganiques et des secondes particules inorganiques.
(JA) 接着性を効果的に高めることができ、長期絶縁信頼性を効果的に高めることができる樹脂材料を提供する。 本発明に係る樹脂材料は、平均アスペクト比が2以下である第1の無機粒子と、平均アスペクト比が2を超える第2の無機粒子と、バインダー樹脂とを含み、前記第1の無機粒子の平均粒子径と前記第2の無機粒子の平均長径との差の絶対値が、10μm以下であり、前記第1の無機粒子の平均粒子径が、1μm以上20μm未満であり、前記第2の無機粒子の平均長径が、2μm以上であり、前記第1の無機粒子と前記第2の無機粒子との合計100体積%中、前記第2の無機粒子の含有量が、40体積%を超える。
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Designated States: AE, AG, AL, AM, AO, AT, AU, AZ, BA, BB, BG, BH, BN, BR, BW, BY, BZ, CA, CH, CL, CN, CO, CR, CU, CZ, DE, DJ, DK, DM, DO, DZ, EC, EE, EG, ES, FI, GB, GD, GE, GH, GM, GT, HN, HR, HU, ID, IL, IN, IR, IS, JO, JP, KE, KG, KH, KN, KP, KR, KW, KZ, LA, LC, LK, LR, LS, LU, LY, MA, MD, ME, MG, MK, MN, MW, MX, MY, MZ, NA, NG, NI, NO, NZ, OM, PA, PE, PG, PH, PL, PT, QA, RO, RS, RU, RW, SA, SC, SD, SE, SG, SK, SL, SM, ST, SV, SY, TH, TJ, TM, TN, TR, TT, TZ, UA, UG, US, UZ, VC, VN, ZA, ZM, ZW
African Regional Intellectual Property Organization (ARIPO) (BW, GH, GM, KE, LR, LS, MW, MZ, NA, RW, SD, SL, ST, SZ, TZ, UG, ZM, ZW)
Eurasian Patent Office (AM, AZ, BY, KG, KZ, RU, TJ, TM)
European Patent Office (EPO) (AL, AT, BE, BG, CH, CY, CZ, DE, DK, EE, ES, FI, FR, GB, GR, HR, HU, IE, IS, IT, LT, LU, LV, MC, MK, MT, NL, NO, PL, PT, RO, RS, SE, SI, SK, SM, TR)
African Intellectual Property Organization (BF, BJ, CF, CG, CI, CM, GA, GN, GQ, GW, KM, ML, MR, NE, SN, TD, TG)
Publication Language: Japanese (JA)
Filing Language: Japanese (JA)