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1. (WO2018230189) THERMALLY-CONDUCTIVE SILICONE COMPOSITION
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Pub. No.: WO/2018/230189 International Application No.: PCT/JP2018/017750
Publication Date: 20.12.2018 International Filing Date: 08.05.2018
IPC:
C08L 83/07 (2006.01) ,C08K 5/29 (2006.01) ,C08K 5/3472 (2006.01) ,C08K 5/5465 (2006.01) ,C08L 83/05 (2006.01) ,C08L 83/06 (2006.01)
C CHEMISTRY; METALLURGY
08
ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
L
COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
83
Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon with or without sulfur, nitrogen, oxygen, or carbon only; Compositions of derivatives of such polymers
04
Polysiloxanes
07
containing silicon bound to unsaturated aliphatic groups
C CHEMISTRY; METALLURGY
08
ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
K
USE OF INORGANIC OR NON-MACROMOLECULAR ORGANIC SUBSTANCES AS COMPOUNDING INGREDIENTS
5
Use of organic ingredients
16
Nitrogen-containing compounds
29
Compounds containing carbon-to-nitrogen double bonds
C CHEMISTRY; METALLURGY
08
ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
K
USE OF INORGANIC OR NON-MACROMOLECULAR ORGANIC SUBSTANCES AS COMPOUNDING INGREDIENTS
5
Use of organic ingredients
16
Nitrogen-containing compounds
34
Heterocyclic compounds having nitrogen in the ring
3467
having more than two nitrogen atoms in the ring
3472
Five-membered rings
C CHEMISTRY; METALLURGY
08
ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
K
USE OF INORGANIC OR NON-MACROMOLECULAR ORGANIC SUBSTANCES AS COMPOUNDING INGREDIENTS
5
Use of organic ingredients
54
Silicon-containing compounds
544
containing nitrogen
5465
containing at least one CN bond
C CHEMISTRY; METALLURGY
08
ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
L
COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
83
Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon with or without sulfur, nitrogen, oxygen, or carbon only; Compositions of derivatives of such polymers
04
Polysiloxanes
05
containing silicon bound to hydrogen
C CHEMISTRY; METALLURGY
08
ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
L
COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
83
Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon with or without sulfur, nitrogen, oxygen, or carbon only; Compositions of derivatives of such polymers
04
Polysiloxanes
06
containing silicon bound to oxygen-containing groups
Applicants:
信越化学工業株式会社 SHIN-ETSU CHEMICAL CO., LTD. [JP/JP]; 東京都千代田区大手町二丁目6番1号 6-1, Ohtemachi 2-chome, Chiyoda-ku, Tokyo 1000004, JP
Inventors:
辻 謙一 TSUJI Kenichi; JP
加藤 野歩 KATO Nobu; JP
Agent:
特許業務法人英明国際特許事務所 PATENT PROFESSIONAL CORPORATION EI-MEI PATENT OFFICE; 東京都中央区銀座二丁目16番12号 銀座大塚ビル2階 GINZA OHTSUKA Bldg. 2F, 16-12, Ginza 2-chome, Chuo-ku, Tokyo 1040061, JP
Priority Data:
2017-11734715.06.2017JP
Title (EN) THERMALLY-CONDUCTIVE SILICONE COMPOSITION
(FR) COMPOSITION DE SILICONE THERMOCONDUCTRICE
(JA) 熱伝導性シリコーン組成物
Abstract:
(EN) This thermally-conductive silicone composition exhibits, after being cured, a small increase in hardness when being aged at a high temperature, and also any decrease in curing speed is constrained, wherein the composition contains (A) an organopolysiloxane having at least two alkenyl groups per molecule, and having a kinematic viscosity of 10-100,000 mm2/s at 25ºC, (B) a hydrolyzable methyl polysiloxane having three functional groups at one terminal thereof, (C) a thermally-conductive filler having a thermal conductivity of 10 W/m·ºC or higher, (D) an organohydrogenpolysiloxane having hydrogen atoms bonded directly to at least two silicon atoms per molecule, (E) a catalyst selected from the group consisting of platinum and platinum compounds, (F) a specific amount of a triazole compound, and (G) a specific amount of an isocyanate compound.
(FR) L'invention concerne une composition de silicone thermoconductrice qui présente, après durcissement, une faible augmentation de dureté lorsqu'elle est vieillie à une température élevée, toute diminution de la vitesse de durcissement étant également limitée, la composition contenant (A) un organopolysiloxane ayant au moins deux groupes alcényle par molécule, et ayant une viscosité cinématique de 10 à 100 000 mm2/s à 25 °C, (B) un polysiloxane méthyle hydrolysable ayant trois groupes fonctionnels à une de ses extrémités, (C) une charge thermoconductrice ayant une conductivité thermique de 10 W/m·°C ou plus, (D) un organohydrogénopolysiloxane ayant des atomes d'hydrogène liés directement à au moins deux atomes de silicium par molécule, (E) un catalyseur choisi dans le groupe constitué par le platine et les composés du platine, (F) une quantité spécifique d'un composé triazole, et (G) une quantité spécifique d'un composé isocyanate.
(JA) 硬化後の高温エージング時の硬度上昇が小さく、同時に硬化速度の低下を抑制した熱伝導性シリコーン組成物であって、 (A)1分子中に少なくとも2個のアルケニル基を有する、25℃の動粘度が10~100,000mm2/sのオルガノポリシロキサン (B)片末端3官能の加水分解性メチルポリシロキサン (C)10W/m・℃以上の熱伝導率を有する熱伝導性充填材 (D)1分子中に少なくとも2個のケイ素原子に直結した水素原子を含有するオルガノハイドロジェンポリシロキサン (E)白金及び白金化合物からなる群より選択される触媒 (F)特定量のトリアゾール系化合物 (G)特定量のイソシアネート系化合物 を含有する熱伝導性シリコーン組成物を提供する。
Designated States: AE, AG, AL, AM, AO, AT, AU, AZ, BA, BB, BG, BH, BN, BR, BW, BY, BZ, CA, CH, CL, CN, CO, CR, CU, CZ, DE, DJ, DK, DM, DO, DZ, EC, EE, EG, ES, FI, GB, GD, GE, GH, GM, GT, HN, HR, HU, ID, IL, IN, IR, IS, JO, KE, KG, KH, KN, KP, KR, KW, KZ, LA, LC, LK, LR, LS, LU, LY, MA, MD, ME, MG, MK, MN, MW, MX, MY, MZ, NA, NG, NI, NO, NZ, OM, PA, PE, PG, PH, PL, PT, QA, RO, RS, RU, RW, SA, SC, SD, SE, SG, SK, SL, SM, ST, SV, SY, TH, TJ, TM, TN, TR, TT, TZ, UA, UG, US, UZ, VC, VN, ZA, ZM, ZW
African Regional Intellectual Property Organization (ARIPO) (BW, GH, GM, KE, LR, LS, MW, MZ, NA, RW, SD, SL, ST, SZ, TZ, UG, ZM, ZW)
Eurasian Patent Office (AM, AZ, BY, KG, KZ, RU, TJ, TM)
European Patent Office (EPO) (AL, AT, BE, BG, CH, CY, CZ, DE, DK, EE, ES, FI, FR, GB, GR, HR, HU, IE, IS, IT, LT, LU, LV, MC, MK, MT, NL, NO, PL, PT, RO, RS, SE, SI, SK, SM, TR)
African Intellectual Property Organization (BF, BJ, CF, CG, CI, CM, GA, GN, GQ, GW, KM, ML, MR, NE, SN, TD, TG)
Publication Language: Japanese (JA)
Filing Language: Japanese (JA)