Some content of this application is unavailable at the moment.
If this situation persist, please contact us atFeedback&Contact
1. (WO2018227973) DISPLAY PANEL AND MANUFACTURING METHOD THEREFOR, AND DISPLAY DEVICE
Latest bibliographic data on file with the International Bureau    Submit observation

Pub. No.: WO/2018/227973 International Application No.: PCT/CN2018/073430
Publication Date: 20.12.2018 International Filing Date: 19.01.2018
IPC:
H01L 23/485 (2006.01) ,H01L 23/488 (2006.01) ,H01L 21/60 (2006.01)
H ELECTRICITY
01
BASIC ELECTRIC ELEMENTS
L
SEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
23
Details of semiconductor or other solid state devices
48
Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads or terminal arrangements
482
consisting of lead-in layers inseparably applied to the semiconductor body
485
consisting of layered constructions comprising conductive layers and insulating layers, e.g. planar contacts
H ELECTRICITY
01
BASIC ELECTRIC ELEMENTS
L
SEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
23
Details of semiconductor or other solid state devices
48
Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads or terminal arrangements
488
consisting of soldered or bonded constructions
H ELECTRICITY
01
BASIC ELECTRIC ELEMENTS
L
SEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
21
Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
02
Manufacture or treatment of semiconductor devices or of parts thereof
04
the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer, carrier concentration layer
50
Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the groups H01L21/06-H01L21/326162
60
Attaching leads or other conductive members, to be used for carrying current to or from the device in operation
Applicants:
京东方科技集团股份有限公司 BOE TECHNOLOGY GROUP CO., LTD. [CN/CN]; 中国北京市 朝阳区酒仙桥路10号 No.10 Jiuxianqiao Rd., Chaoyang District Beijing 100015, CN
成都京东方光电科技有限公司 CHENGDU BOE OPTOELECTRONICS TECHNOLOGY CO., LTD. [CN/CN]; 中国四川省成都市 高新区(西区)合作路1188号 No.1188, Hezuo Rd., (West Zone) Hi-Tech Development Zone Chengdu, Sichuan 611731, CN
Inventors:
王本莲 WANG, Benlian; CN
董向丹 DONG, Xiangdan; CN
黄炜赟 HUANG, Weiyun; CN
高永益 KO, Young Yik; CN
Agent:
北京市柳沈律师事务所 LIU, SHEN & ASSOCIATES; 中国北京市 海淀区彩和坊路10号1号楼10层 10th Floor, Building 1 10 Caihefang Road, Haidian District Beijing 100080, CN
Priority Data:
201710456618.216.06.2017CN
Title (EN) DISPLAY PANEL AND MANUFACTURING METHOD THEREFOR, AND DISPLAY DEVICE
(FR) PANNEAU D'AFFICHAGE ET SON PROCÉDÉ DE FABRICATION, ET DISPOSITIF D'AFFICHAGE
(ZH) 显示面板、其制作方法及显示装置
Abstract:
(EN) A display panel and a manufacturing method therefor, and a display device. The display panel comprises: a display substrate (201); a chip on film (202) disposed at one side of the display substrate (201); a plurality of signal lines (205) at the other side of the display substrate (201); an insulating layer (206) between the signal lines (205) and the display substrate (201); a plurality of connecting holes (207) at least passing through the display substrate (201), the signal lines (205), and the insulating layer (206); and a conductive material (208) that fills the connecting holes (207). The signal lines 205 are connected, by means of the conductive material (208), to a connecting terminal (209) disposed on the chip on film (202), and the insulating layer (206) is provided with recessed portions (a) surrounding the connecting holes (207). For the display panel, a bending process of the connecting terminal is omitted, so that the frame of the display panel is narrower. Moreover, contact areas between the conductive material (208) and the signal lines (205) are increased by providing the plurality of recessed portions (a) surrounding the connecting holes (207) on the insulating layer (206).
(FR) L’invention concerne un panneau d’affichage et son procédé de fabrication, et un dispositif d’affichage. Le panneau d'affichage comprend : un substrat d'affichage (201) ; une puce sur film (202) disposée sur un côté du substrat d'affichage (201) ; une pluralité de lignes de signal (205) sur l'autre côté du substrat d'affichage (201) ; une couche isolante (206) entre les lignes de signal (205) et le substrat d'affichage (201) ; une pluralité de trous de connexion (207) qui traversent au moins le substrat d'affichage (201), les lignes de signal (205) et la couche isolante (206) ; et un matériau conducteur (208) qui remplit les trous de connexion (207). Les lignes de signal (205) sont reliées, au moyen du matériau conducteur (208), à une borne de connexion (209) disposée sur la puce sur film (202), et la couche isolante (206) est pourvue de portions évidées (a) qui entourent les trous de connexion (207). Pour le panneau d'affichage, un processus de flexion de la borne de connexion est omis, de sorte que le cadre du panneau d'affichage est plus étroit. De plus, le surfaces de contact entre le matériau conducteur (208) et les lignes de signal (205) sont augmentées du fait de la réalisation de la pluralité de portions évidées (a) qui entourent les trous de connexion (207) sur la couche isolante (206).
(ZH) 一种显示面板、其制作方法及显示装置。该显示面板包括:显示基板(201),设置于所述显示基板(201)一侧的覆晶薄膜(202);位于所述显示基板(201)的另一侧的多条信号线(205),位于所述信号线(205)与所述显示基板(201)之间的绝缘层(206),至少贯穿所述显示基板(201)、所述信号线(205)和所述绝缘层(206)的多个连接孔(207),以及填充于所述连接孔(207)内的导电材料(208);所述信号线(205)通过所述导电材料(208)连接于设置在所述覆晶薄膜(202)上的连接端子(209);所述绝缘层(206)具有围绕所述连接孔(207)的凹陷部(a)。该显示面板省去了连接端子弯折工艺,从而使得显示面板的边框更窄;并且,由于在绝缘层(206)设置围绕各连接孔(207)的多个凹陷部(a),增大了导电材料(208)与信号线(205)的接触面积。
front page image
Designated States: AE, AG, AL, AM, AO, AT, AU, AZ, BA, BB, BG, BH, BN, BR, BW, BY, BZ, CA, CH, CL, CN, CO, CR, CU, CZ, DE, DJ, DK, DM, DO, DZ, EC, EE, EG, ES, FI, GB, GD, GE, GH, GM, GT, HN, HR, HU, ID, IL, IN, IR, IS, JO, JP, KE, KG, KH, KN, KP, KR, KW, KZ, LA, LC, LK, LR, LS, LU, LY, MA, MD, ME, MG, MK, MN, MW, MX, MY, MZ, NA, NG, NI, NO, NZ, OM, PA, PE, PG, PH, PL, PT, QA, RO, RS, RU, RW, SA, SC, SD, SE, SG, SK, SL, SM, ST, SV, SY, TH, TJ, TM, TN, TR, TT, TZ, UA, UG, US, UZ, VC, VN, ZA, ZM, ZW
African Regional Intellectual Property Organization (ARIPO) (BW, GH, GM, KE, LR, LS, MW, MZ, NA, RW, SD, SL, ST, SZ, TZ, UG, ZM, ZW)
Eurasian Patent Office (AM, AZ, BY, KG, KZ, RU, TJ, TM)
European Patent Office (EPO) (AL, AT, BE, BG, CH, CY, CZ, DE, DK, EE, ES, FI, FR, GB, GR, HR, HU, IE, IS, IT, LT, LU, LV, MC, MK, MT, NL, NO, PL, PT, RO, RS, SE, SI, SK, SM, TR)
African Intellectual Property Organization (BF, BJ, CF, CG, CI, CM, GA, GN, GQ, GW, KM, ML, MR, NE, SN, TD, TG)
Publication Language: Chinese (ZH)
Filing Language: Chinese (ZH)