Some content of this application is unavailable at the moment.
If this situation persist, please contact us atFeedback&Contact
1. (WO2018227756) POLYMER RESIN COMPOSITION AND APPLICATION THEREOF IN HIGH FREQUENCY CIRCUIT BOARD
Latest bibliographic data on file with the International Bureau    Submit observation

Pub. No.: WO/2018/227756 International Application No.: PCT/CN2017/098524
Publication Date: 20.12.2018 International Filing Date: 22.08.2017
IPC:
C08L 25/18 (2006.01) ,C08L 83/07 (2006.01) ,C08K 5/14 (2006.01) ,C08K 7/14 (2006.01) ,C08K 3/36 (2006.01) ,C08F 8/00 (2006.01) ,C08F 212/04 (2006.01) ,C08F 212/08 (2006.01) ,C08G 77/20 (2006.01) ,B32B 17/02 (2006.01) ,B32B 17/12 (2006.01) ,B32B 15/20 (2006.01)
C CHEMISTRY; METALLURGY
08
ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
L
COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
25
Compositions of homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by an aromatic carbocyclic ring; Compositions of derivatives of such polymers
18
Homopolymers or copolymers of aromatic monomers containing elements other than carbon and hydrogen
C CHEMISTRY; METALLURGY
08
ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
L
COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
83
Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon with or without sulfur, nitrogen, oxygen, or carbon only; Compositions of derivatives of such polymers
04
Polysiloxanes
07
containing silicon bound to unsaturated aliphatic groups
C CHEMISTRY; METALLURGY
08
ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
K
USE OF INORGANIC OR NON-MACROMOLECULAR ORGANIC SUBSTANCES AS COMPOUNDING INGREDIENTS
5
Use of organic ingredients
04
Oxygen-containing compounds
14
Peroxides
C CHEMISTRY; METALLURGY
08
ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
K
USE OF INORGANIC OR NON-MACROMOLECULAR ORGANIC SUBSTANCES AS COMPOUNDING INGREDIENTS
7
Use of ingredients characterised by shape
02
Fibres or whiskers
04
inorganic
14
Glass
C CHEMISTRY; METALLURGY
08
ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
K
USE OF INORGANIC OR NON-MACROMOLECULAR ORGANIC SUBSTANCES AS COMPOUNDING INGREDIENTS
3
Use of inorganic ingredients
34
Silicon-containing compounds
36
Silica
C CHEMISTRY; METALLURGY
08
ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
F
MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
8
Chemical modification by after-treatment
C CHEMISTRY; METALLURGY
08
ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
F
MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
212
Copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by an aromatic carbocyclic ring
02
Monomers containing only one unsaturated aliphatic radical
04
containing one ring
C CHEMISTRY; METALLURGY
08
ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
F
MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
212
Copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by an aromatic carbocyclic ring
02
Monomers containing only one unsaturated aliphatic radical
04
containing one ring
06
Hydrocarbons
08
Styrene
C CHEMISTRY; METALLURGY
08
ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
G
MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
77
Macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon, with or without sulfur, nitrogen, oxygen, or carbon
04
Polysiloxanes
20
containing silicon bound to unsaturated aliphatic groups
B PERFORMING OPERATIONS; TRANSPORTING
32
LAYERED PRODUCTS
B
LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
17
Layered products essentially comprising sheet glass, or fibres of glass, slag or the like
02
in the form of fibres or filaments
B PERFORMING OPERATIONS; TRANSPORTING
32
LAYERED PRODUCTS
B
LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
17
Layered products essentially comprising sheet glass, or fibres of glass, slag or the like
12
next to a fibrous or filamentary layer
B PERFORMING OPERATIONS; TRANSPORTING
32
LAYERED PRODUCTS
B
LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
15
Layered products essentially comprising metal
20
comprising aluminium or copper
Applicants:
广东生益科技股份有限公司 SHENGYI TECHNOLOGY CO., LTD. [CN/CN]; 中国广东省东莞市 松山湖高新技术产业开发区工业西路5号 No.5 Western Industry Road, Songshan Lake National High-Tech Industrial Development Zone Dongguan, Guangdong 523808, CN
Inventors:
陈广兵 CHEN, Guangbing; CN
曾宪平 ZENG, Xianping; CN
徐浩晟 XU, Haosheng; CN
关迟记 GUAN, Chiji; CN
Agent:
北京品源专利代理有限公司 BEYOND ATTORNEYS AT LAW; 中国北京市 海淀区莲花池东路39号西金大厦6层 F6, Xijin Centre 39 Lianhuachi East Rd., Haidian District Beijing 100036, CN
Priority Data:
201710444087.513.06.2017CN
Title (EN) POLYMER RESIN COMPOSITION AND APPLICATION THEREOF IN HIGH FREQUENCY CIRCUIT BOARD
(FR) COMPOSITION DE RÉSINE POLYMÈRE ET SON APPLICATION DANS UNE CARTE DE CIRCUIT IMPRIMÉ HAUTE FRÉQUENCE
(ZH) 聚合物树脂组合物及其在高频电路板中的应用
Abstract:
(EN) The present invention relates to a vinyl benzyl ether modified poly(p-hydroxystyryl-styrene) polymer resin composition, comprising: (1) a vinyl benzyl ether modified poly(p-hydroxystyryl-styrene) polymer resin; (2) a vinyl silicone resin. The present invention also relates to a prepreg comprising the resin composition and an application thereof in a high frequency circuit board; a substrate prepared by using the resin composition has a low dielectric constant, low dielectric loss, a low thermal expansion coefficient and like comprehensive properties, and the area of a "+"-shaped drop mark formed on the substrate under a falling weight impact load is small, while the substrate has good toughness, and may satisfy the requirements for toughness of a copper-clad board.
(FR) La présente invention concerne une composition de résine polymère poly(p-hydroxystyryl-styrène) modifiée par un éther de benzyle et de vinyle, comprenant : (1) une résine polymère poly(p-hydroxystyryl-styrène) modifiée par un éther de benzyle et de vinyle ; (2) une résine de silicone vinylique. La présente invention concerne également un préimprégné comprenant la composition de résine et son application dans une carte de circuit imprimé haute fréquence ; un substrat préparé en utilisant la composition de résine présente une faible constante diélectrique, une faible perte diélectrique, un faible coefficient de dilatation thermique et des propriétés globales similaires, et la surface d'une tache de goutte d'eau en forme de « + » formée sur le substrat sous une charge d'impact à masse tombante est petite, tandis que le substrat présente une bonne ténacité, et peut satisfaire aux exigences de ténacité d'une carte plaquée cuivre.
(ZH) 本发明涉及一种乙烯基苄基醚改性聚(对羟基苯乙烯基-苯乙烯)聚合物树脂组合物,其包括:(1)乙烯基苄基醚改性聚(对羟基苯乙烯基-苯乙烯)聚合物树脂;(2)乙烯基有机硅树脂;本发明还涉及包含该树脂组合物的预浸料及其在高频电路板中的应用;利用该树脂组合物制备的基材除了具有低介质常数、低介质损耗、低热膨胀系数等综合性能,且基材在落锤冲击载荷作用下,产生的"十"字状的落痕面积小,基材的韧性好,可满足覆铜板对韧性的要求。
front page image
Designated States: AE, AG, AL, AM, AO, AT, AU, AZ, BA, BB, BG, BH, BN, BR, BW, BY, BZ, CA, CH, CL, CN, CO, CR, CU, CZ, DE, DJ, DK, DM, DO, DZ, EC, EE, EG, ES, FI, GB, GD, GE, GH, GM, GT, HN, HR, HU, ID, IL, IN, IR, IS, JO, JP, KE, KG, KH, KN, KP, KR, KW, KZ, LA, LC, LK, LR, LS, LU, LY, MA, MD, ME, MG, MK, MN, MW, MX, MY, MZ, NA, NG, NI, NO, NZ, OM, PA, PE, PG, PH, PL, PT, QA, RO, RS, RU, RW, SA, SC, SD, SE, SG, SK, SL, SM, ST, SV, SY, TH, TJ, TM, TN, TR, TT, TZ, UA, UG, US, UZ, VC, VN, ZA, ZM, ZW
African Regional Intellectual Property Organization (ARIPO) (BW, GH, GM, KE, LR, LS, MW, MZ, NA, RW, SD, SL, ST, SZ, TZ, UG, ZM, ZW)
Eurasian Patent Office (AM, AZ, BY, KG, KZ, RU, TJ, TM)
European Patent Office (EPO) (AL, AT, BE, BG, CH, CY, CZ, DE, DK, EE, ES, FI, FR, GB, GR, HR, HU, IE, IS, IT, LT, LU, LV, MC, MK, MT, NL, NO, PL, PT, RO, RS, SE, SI, SK, SM, TR)
African Intellectual Property Organization (BF, BJ, CF, CG, CI, CM, GA, GN, GQ, GW, KM, ML, MR, NE, SN, TD, TG)
Publication Language: Chinese (ZH)
Filing Language: Chinese (ZH)