Some content of this application is unavailable at the moment.
If this situation persist, please contact us atFeedback&Contact
1. (WO2018226284) ULTRA-LOW POWER MAGNETOELECTRIC MAGNETIC FIELD SENSOR
Note: Text based on automatic Optical Character Recognition processes. Please use the PDF version for legal matters

CLAIMS

What is claimed as new and desired to be protected by Letters Patent of the United

States is:

1. An on-chip micro-resonator magnetic sensor, comprising:

a doubly clamped magnetoelectric micro-beam resonator that generates a

magnetically driven resonance shift;

a piezoelectric layer; and

a magnetostrictive layer;

wherein the magnetostrictive layer is strain coupled to the piezoelectric layer to form a micro-beam for the on-chip micro-resonator magnetic sensor.

2. The magnetic sensor of claim 1, wherein the piezoelectric layer comprises A1N, PMN-PT, BTO, or any combination thereof.

3. The magnetic sensor of claim 1, wherein the magnetostrictive layer comprises, Fe, Co, Ni, FeCo, FeCoV, FeGa, or any combination thereof.

4. The magnetic sensor of claim 1, wherein the magnetic sensor has a sensitivity 10"10 Tesla/Hz½ or less.

5. The magnetic sensor of claim 1, wherein the magnetic sensor has a power dissipation of less than 10 mW.

6. The magnetic sensor of claim 1, wherein the magnetic sensor has a power dissipation of about 0.1 mW.

7. A method for making an on-chip micro-resonator magnetic sensor, comprising: depositing a low-stress thermal nitride on a top side and a bottom side of a wafer; depositing a bottom contact serving as a seed layer for a piezoelectric on the low-stress thermal nitride on the top side of the wafer;

depositing a piezoelectric layer on the bottom contact serving as a seed layer;

patterning a first photoresist or lift-off layer to define a geometry for a beam on the piezoelectric layer;

applying a metallic buffer layer to the piezoelectric layer and the patterned photoresist or lift-off layer;

applying a magnetostrictive layer to the piezoelectric layer and the patterned photoresist or lift-off layer;

removing the portion of the magnetostrictive layer from the patterned photoresist or lift-off layer;

patterning a second photoresist layer on the piezoelectric layer for a first electrode; etching the piezoelectric layer to define the first electrode;

patterning a third photoresist layer on the magnetostrictive layer for a second electrode;

metallizing the first and second electrodes;

performing a chemical lift off process to define the first electrode;

patterning a fourth photoresist layer of expanded openings on the low-stress thermal nitride on the bottom side of the wafer;

etching openings in the low-stress thermal nitride on the bottom side of the wafer to form windows to the wafer;

forming a smaller opening at the top side of the wafer; and

performing a bottom side RJE etch on the low-stress thermal nitride to release a multilayer beam;

resulting in a magnetoelectric micro-beam resonator that generates a magnetically driven resonance shift.

8. The method of claim 7, wherein the bottom contact serving as a seed layer comprises Pt, HE, Ta, or any combination thereof.

9. The method of claim 7, wherein the low-stress thermal nitride comprises low-stress LPCVD silicon nitride, low-stress CVD silicon nitride, low-stress PECVD silicon nitride, or low-stress ALD silicon nitride.

10. The method of claim 7, wherein the low-stress thermal nitride has a tensile stress in the range of 0-100 MPa.

11. The method of claim 7, wherein the low-stress thermal nitride comprises silicon nitride.

12. The method of claim 11, wherein the forming a smaller opening at the top side of the wafer comprises opening windows in the silicon nitride by CF4 plasma followed by isotropically etching the silicon using XeF2.

13. The method of claim 7, wherein the piezoelectric layer comprises A1N, PMN-PT, BTO, or any combination thereof.

14. The method of claim 7, wherein the magnetostrictive layer comprises, Fe, Co, Ni, FeCo, FeCoV, FeGa, or any combination thereof.

15. The method of claim 7, wherein the magnetic sensor has a sensitivity 10"10 Tesla/Hz½ or less.

16. The method of claim 7, wherein the magnetic sensor has a power dissipation of less than 10 mW.

17. The method of claim 7, wherein the magnetic sensor has a power dissipation of about

0.1 mW.

18. The method of claim 7, wherein the forming a smaller opening at the top side of the wafer comprises performing a KOH etch on the bottom side of the wafer following crystalline angles, opening windows from the top side with a CF4 plasma, or a combination thereof.

19. The method of claim 7, wherein the piezoelectric layer is deposited at a temperature between 450 and 550 °C