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1. (WO2018226274) PLASMA PROCESSING APPARATUS WITH POST PLASMA GAS INJECTION
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WHAT IS CLAIMED IS:

1. A plasma processing apparatus comprising:

a plasma chamber;

a processing chamber separated from the plasma chamber, the processing chamber comprising a substrate holder operable to support a substrate;

a plasma source configured to generate a plasma in the plasma chamber;

a separation grid separating the plasma chamber and the processing chamber, the separation grid configured to filter one or more ions generated in the plasma and allow the passage of neutral particles from the plasma chamber to the processing chamber; and

at least one gas port configured to inject a gas into neutral particles passing through the separation grid.

2. The plasma processing apparatus of claim 1, wherein the at least one gas port comprises a first gas port operable to inject a gas into neutral particles at a first portion of the separation grid and a second gas port operable to inject a gas into neutral particles at a second portion of the separation grid.

3. The plasma processing apparatus of claim 2, wherein the first portion is a peripheral portion of the separation grid and the second portion is a center portion of the separation grid.

4. The plasma processing apparatus of claim 1, wherein the separation grid comprises a first grid plate and a second grid plate disposed in spaced parallel relationship.

5. The plasma processing apparatus of claim 2, wherein the gas port is configured to inject a gas between the first grid plate and the second grid plate.

6. The plasma processing apparatus of claim 6, wherein the separation grid comprises a third grid plate disposed in spaced parallel relationship with the first grid plate and the second grid plate.

7. The plasma processing apparatus of claim 6, wherein the gas port is configured to inject a gas between the second grid plate and the third grid plate.

8. The plasma processing apparatus of claim 1, wherein the at least one gas port is configured to inject a gas beneath a bottom surface of the separation grid in one or more of a horizontal direction, vertical direction, or oblique direction.

9. The plasma processing apparatus of claim 4, wherein the at least one gas port comprises:

a first gas port configured to inject a gas between the first grid plate and the second grid plate; and

a second gas port configured to inject a gas between the second grid plate and the third grid plate.

10. The plasma processing apparatus of claim 2, wherein one or more of the first grid plate and the second grid plate are electrically conductive and grounded.

11. A separation grid for a plasma processing apparatus, the separation grid comprising:

a first grid plate comprising a plurality of holes arranged in a first pattern; a second grid plate disposed in spaced parallel relation with the first grid plate, the second grid plate having a plurality of holes arranged in a second pattern; and

at least one gas port configured to inject a gas into the separation grid.

12. The separation grid of claim 11, wherein the at least on gas port is configured to inject a gas between the first grid plate and the second grid plate.

13. The separation grid of claim 11, wherein one or more of the first grid plate and the second grid plate are electrically conductive and operable to be grounded.

14. The separation grid of claim 11, wherein the at least one gas port comprises a first gas port operable to inject a gas at a first portion of the separation grid and a second gas port operable to inject a gas at a second portion of the separation grid.

15. The separation grid of claim 11, wherein the separation grid further comprises a third grid plate disposed in spaced parallel relationship with the second grid plate.

16. The separation grid of claim 15, wherein the at least one gas port is configured to inject a gas between the second grid plate and the third grid plate.

17. A method for processing a workpiece in a plasma strip tool, the method comprising:

dissociating one or more molecules into one or more ions and one or more neutral particles in a mixture using a plasma generated in a plasma chamber of a plasma processing apparatus;

filtering the one or more ions generated by the plasma in the mixture using a separation grid disposed between the plasma chamber and a processing chamber of the plasma processing apparatus, the processing chamber being separated from the plasma chamber by the separation grid;

passing the one or more neutral particles generated in the plasma through the separation grid;

injecting a gas into the neutral particles at the separation grid; and exposing the workpiece to the neutral particles in the processing chamber.

18. The method of claim 17, wherein the gas is an inert gas.

19. The method of claim 17, wherein the gas is a cooling gas.

20. The method of claim 17, wherein injecting the gas into the neutral particles comprises injecting a gas into neutral particles at a first portion of the separation grid and a injecting a gas into neutral particles at a second portion of the separation grid.