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1. (WO2018225957) METHOD OF TIN-PLATING COPPER ALLOY FOR ELECTRIC OR ELECTRONIC PARTS AND AUTOMOBILE PARTS AND TIN-PLATING MATERIAL OF COPPER ALLOY MANUFACTURED THEREFROM
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Pub. No.: WO/2018/225957 International Application No.: PCT/KR2018/005248
Publication Date: 13.12.2018 International Filing Date: 08.05.2018
IPC:
C25D 5/48 (2006.01) ,C25D 5/50 (2006.01) ,C25D 5/34 (2006.01) ,C25D 5/12 (2006.01) ,C25D 3/30 (2006.01) ,C25D 3/60 (2006.01) ,C25D 3/38 (2006.01) ,C25D 3/56 (2006.01) ,C25F 1/00 (2006.01) ,C23C 22/07 (2006.01)
C CHEMISTRY; METALLURGY
25
ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
D
PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; JOINING WORKPIECES BY ELECTROLYSIS; APPARATUS THEREFOR
5
Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
48
After-treatment of electroplated surfaces
C CHEMISTRY; METALLURGY
25
ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
D
PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; JOINING WORKPIECES BY ELECTROLYSIS; APPARATUS THEREFOR
5
Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
48
After-treatment of electroplated surfaces
50
by heat-treatment
C CHEMISTRY; METALLURGY
25
ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
D
PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; JOINING WORKPIECES BY ELECTROLYSIS; APPARATUS THEREFOR
5
Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
34
Pretreatment of metallic surfaces to be electroplated
C CHEMISTRY; METALLURGY
25
ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
D
PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; JOINING WORKPIECES BY ELECTROLYSIS; APPARATUS THEREFOR
5
Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
10
Electroplating with more than one layer of the same or of different metals
12
at least one layer being of nickel or chromium
C CHEMISTRY; METALLURGY
25
ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
D
PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; JOINING WORKPIECES BY ELECTROLYSIS; APPARATUS THEREFOR
3
Electroplating; Baths therefor
02
from solutions
30
of tin
C CHEMISTRY; METALLURGY
25
ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
D
PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; JOINING WORKPIECES BY ELECTROLYSIS; APPARATUS THEREFOR
3
Electroplating; Baths therefor
02
from solutions
56
of alloys
60
containing more than 50% by weight of tin
C CHEMISTRY; METALLURGY
25
ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
D
PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; JOINING WORKPIECES BY ELECTROLYSIS; APPARATUS THEREFOR
3
Electroplating; Baths therefor
02
from solutions
38
of copper
C CHEMISTRY; METALLURGY
25
ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
D
PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; JOINING WORKPIECES BY ELECTROLYSIS; APPARATUS THEREFOR
3
Electroplating; Baths therefor
02
from solutions
56
of alloys
C CHEMISTRY; METALLURGY
25
ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
F
PROCESSES FOR THE ELECTROLYTIC REMOVAL OF MATERIALS FROM OBJECTS; APPARATUS THEREFOR
1
Electrolytic cleaning, degreasing, pickling, or descaling
C CHEMISTRY; METALLURGY
23
COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
C
COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
22
Chemical surface treatment of metallic material by reaction of the surface with a reactive liquid, leaving reaction products of surface material in the coating, e.g. conversion coatings, passivation of metals
05
using aqueous solutions
06
using aqueous acidic solutions with pH 6
07
containing phosphates
Applicants:
주식회사 풍산 POONGSAN CORPORATION [KR/KR]; 경기도 평택시 포승읍 평택항로156번길 134 134, Pyeongtaekhang-ro 156beon-gil, Poseung-eup Pyeongtaek-si Gyeonggi-do 17960, KR
Inventors:
박철민 PARK, Cheol Min; KR
남효문 NAM, Hyo Moon; KR
이범재 LEE, Buem Jae; KR
김효영 KIM, Hyo Young; KR
Agent:
김용인 KIM, Yong In; KR
방해철 BAHNG, Hae Cheol; KR
Priority Data:
10-2017-007179408.06.2017KR
Title (EN) METHOD OF TIN-PLATING COPPER ALLOY FOR ELECTRIC OR ELECTRONIC PARTS AND AUTOMOBILE PARTS AND TIN-PLATING MATERIAL OF COPPER ALLOY MANUFACTURED THEREFROM
(FR) PROCÉDÉ D'ÉTAMAGE D'ALLIAGE DE CUIVRE POUR PIÈCES ÉLECTRIQUES OU ÉLECTRONIQUES ET PIÈCES AUTOMOBILES ET MATÉRIAU D'ÉTAMAGE D'ALLIAGE DE CUIVRE FABRIQUÉ À PARTIR DE CELUI-CI
(KO) 전기·전자, 자동차 부품용 동합금의 주석 도금 방법 및 이로부터 제조된 동합금의 주석 도금재
Abstract:
(EN) The present invention provides a method of tin-plating a copper alloy for electric or electronic parts and automobile parts which has an excellent insertion force, heat-resistant peeling, and solderability, and a tin-plating material of a copper alloy manufactured therefrom.
(FR) La présente invention concerne un procédé d'étamage d'un alliage de cuivre pour des pièces électriques ou électroniques et des pièces automobiles, qui présente une excellente force d'insertion, un écaillage résistant à la chaleur et une aptitude au soudage, et un matériau d'étamage d'un alliage de cuivre fabriqué à partir de celui-ci.
(KO) 본 발명은 삽입력, 내열박리성, 납땜성이 우수한 전기·전자 및 자동차 부품용 동합금을 주석 도금하는 방법 및 이로부터 제조된 동합금의 주석 도금재를 제공한다.
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Designated States: AE, AG, AL, AM, AO, AT, AU, AZ, BA, BB, BG, BH, BN, BR, BW, BY, BZ, CA, CH, CL, CN, CO, CR, CU, CZ, DE, DJ, DK, DM, DO, DZ, EC, EE, EG, ES, FI, GB, GD, GE, GH, GM, GT, HN, HR, HU, ID, IL, IN, IR, IS, JO, JP, KE, KG, KH, KN, KP, KW, KZ, LA, LC, LK, LR, LS, LU, LY, MA, MD, ME, MG, MK, MN, MW, MX, MY, MZ, NA, NG, NI, NO, NZ, OM, PA, PE, PG, PH, PL, PT, QA, RO, RS, RU, RW, SA, SC, SD, SE, SG, SK, SL, SM, ST, SV, SY, TH, TJ, TM, TN, TR, TT, TZ, UA, UG, US, UZ, VC, VN, ZA, ZM, ZW
African Regional Intellectual Property Organization (ARIPO) (BW, GH, GM, KE, LR, LS, MW, MZ, NA, RW, SD, SL, ST, SZ, TZ, UG, ZM, ZW)
Eurasian Patent Office (AM, AZ, BY, KG, KZ, RU, TJ, TM)
European Patent Office (EPO) (AL, AT, BE, BG, CH, CY, CZ, DE, DK, EE, ES, FI, FR, GB, GR, HR, HU, IE, IS, IT, LT, LU, LV, MC, MK, MT, NL, NO, PL, PT, RO, RS, SE, SI, SK, SM, TR)
African Intellectual Property Organization (BF, BJ, CF, CG, CI, CM, GA, GN, GQ, GW, KM, ML, MR, NE, SN, TD, TG)
Publication Language: Korean (KO)
Filing Language: Korean (KO)