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1. (WO2018225825) METHOD FOR PRODUCING SUBSTRATE FOR FLEXIBLE DEVICE
Latest bibliographic data on file with the International Bureau    Submit observation

Pub. No.: WO/2018/225825 International Application No.: PCT/JP2018/021885
Publication Date: 13.12.2018 International Filing Date: 07.06.2018
IPC:
B29C 41/22 (2006.01) ,B32B 27/20 (2006.01) ,B32B 27/34 (2006.01) ,C08G 73/10 (2006.01)
B PERFORMING OPERATIONS; TRANSPORTING
29
WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
C
SHAPING OR JOINING OF PLASTICS; SHAPING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL; AFTER- TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
41
Shaping by coating a mould, core or other substrate, i.e. by depositing material and stripping-off the shaped article; Apparatus therefor
02
for making articles of definite length, i.e. discrete articles
22
Making multilayered or multicoloured articles
B PERFORMING OPERATIONS; TRANSPORTING
32
LAYERED PRODUCTS
B
LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
27
Layered products essentially comprising synthetic resin
18
characterised by the use of special additives
20
using fillers, pigments, thixotroping agents
B PERFORMING OPERATIONS; TRANSPORTING
32
LAYERED PRODUCTS
B
LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
27
Layered products essentially comprising synthetic resin
34
comprising polyamides
C CHEMISTRY; METALLURGY
08
ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
G
MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
73
Macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing nitrogen, with or without oxygen or carbon, not provided for in groups C08G12/-C08G71/238
06
Polycondensates having nitrogen-containing heterocyclic rings in the main chain of the macromolecule; Polyhydrazides; Polyamide acids or similar polyimide precursors
10
Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
Applicants:
日産化学株式会社 NISSAN CHEMICAL CORPORATION [JP/JP]; 東京都中央区日本橋二丁目5番1号 5-1, Nihonbashi 2-chome, Chuo-ku, Tokyo 1036119, JP
Inventors:
江原 和也 EBARA, Kazuya; JP
葉 鎮嘉 YE, Chen Jia; TW
Agent:
特許業務法人はなぶさ特許商標事務所 HANABUSA PATENT & TRADEMARK OFFICE; 東京都千代田区神田駿河台3丁目2番地 新御茶ノ水アーバントリニティ Shin-Ochanomizu Urban Trinity, 2, Kandasurugadai 3-chome, Chiyoda-ku, Tokyo 1010062, JP
Priority Data:
2017-11359408.06.2017JP
Title (EN) METHOD FOR PRODUCING SUBSTRATE FOR FLEXIBLE DEVICE
(FR) PROCÉDÉ DE FABRICATION DE SUBSTRAT POUR DISPOSITIF FLEXIBLE
(JA) フレキシブルデバイス用基板の製造方法
Abstract:
(EN) The purpose of the present invention is to provide a method for forming a resin thin film laminate that makes it possible to preserve the exceptional performance attributes of exceptional heat resistance, low retardation, exceptional flexibility, and exceptional transparency, said resin thin film laminate being applied to a plastic thin film having exceptional performance as a base film of a flexible device substrate such as a flexible display substrate that can be easily peeled from a glass carrier. A method for producing a resin thin film laminate, said resin thin film laminate being characterized in that after a peeling layer is formed on a support substrate using a peeling-layer-forming composition containing a heat resistant polymer and an organic solvent, a resin thin film is formed on the peeling layer using a resin thin film-forming composition containing a heat resistant polymer and an organic solvent, and the peeling layer and the resin thin film are subsequently peeled from the support substrate as a single entity, said method being further characterized in that silicon dioxide particles having an average particle diameter of 100 nm or less as calculated from the specific surface area measured by nitrogen adsorption are incorporated in substantially only the resin thin film-forming composition.
(FR) L’invention a pour objet de fournir un procédé de formation de stratifié de film mince en résine qui permet d’obtenir un film mince de plastique, lequel film mince de plastique tout en préservant d’excellentes performances telles qu’une excellente résistance à la chaleur, un faible retard optique et une excellente souplesse, présente d’excellentes performances en tant que film de base pour un substrat de dispositif flexible tel qu’un écran flexible, ou similaire, permettant un retrait aisé d'un support de verre. Plus précisément, l’invention concerne un procédé de fabrication de stratifié de film mince en résine qui est caractéristique en ce qu’après formation sur un substrat de support d’une couche de retrait à l’aide d’une composition pour formation de couche de rertrait comprenant un polymère résistant à la chaleur et un solvant organique, un film mince en résine est formé sur cette couche de retrait à l’aide d’une composition pour formation de film mince en résine comprenant un polymère résistant à la chaleur et un solvant organique, puis la couche de retrait et le film mince en résine sont retirés ensemble du substrat de support. Le procédé de l’invention est également caractéristique en ce que de manière pratique des particules de dioxyde de silicium présentant un diamètre particulaire moyen inférieur ou égal à 100mm calculé à partir d’une surface spécifique mesurée selon une technique d’adsorption de nitrogène, sont également comprises exclusivement dans la composition pour formation de film mince en résine.
(JA) 耐熱性に優れ、リタデーションが低く、柔軟性に優れ、さらに透明性にも優れるという優れた性能を維持すると共に、ガラスキャリアから容易に剥離し得るフレキシブルディスプレイ基板等のフレキシブルデバイス基板のベースフィルムとして優れた性能を有するプラスチック薄膜を与える樹脂薄膜積層体の形成方法を提供することを目的とする。樹脂薄膜積層体の製造方法であって、支持基材上に耐熱性ポリマー及び有機溶媒を含有する剥離層形成用組成物を用いて剥離層を形成した後、耐熱性ポリマー及び有機溶媒を含有する樹脂薄膜形成用組成物を用いて、当該剥離層の上に樹脂薄膜を形成し、次いで、剥離層と樹脂薄膜を一体のものとして支持基材から剥離することを特徴とする方法において、窒素吸着法により測定された比表面積値から算出される平均粒子径が100nm以下である二酸化ケイ素粒子が、実質的に樹脂薄膜形成用組成物のみにさらに含有されることを特徴とする方法。
Designated States: AE, AG, AL, AM, AO, AT, AU, AZ, BA, BB, BG, BH, BN, BR, BW, BY, BZ, CA, CH, CL, CN, CO, CR, CU, CZ, DE, DJ, DK, DM, DO, DZ, EC, EE, EG, ES, FI, GB, GD, GE, GH, GM, GT, HN, HR, HU, ID, IL, IN, IR, IS, JO, JP, KE, KG, KH, KN, KP, KR, KW, KZ, LA, LC, LK, LR, LS, LU, LY, MA, MD, ME, MG, MK, MN, MW, MX, MY, MZ, NA, NG, NI, NO, NZ, OM, PA, PE, PG, PH, PL, PT, QA, RO, RS, RU, RW, SA, SC, SD, SE, SG, SK, SL, SM, ST, SV, SY, TH, TJ, TM, TN, TR, TT, TZ, UA, UG, US, UZ, VC, VN, ZA, ZM, ZW
African Regional Intellectual Property Organization (ARIPO) (BW, GH, GM, KE, LR, LS, MW, MZ, NA, RW, SD, SL, ST, SZ, TZ, UG, ZM, ZW)
Eurasian Patent Office (AM, AZ, BY, KG, KZ, RU, TJ, TM)
European Patent Office (EPO) (AL, AT, BE, BG, CH, CY, CZ, DE, DK, EE, ES, FI, FR, GB, GR, HR, HU, IE, IS, IT, LT, LU, LV, MC, MK, MT, NL, NO, PL, PT, RO, RS, SE, SI, SK, SM, TR)
African Intellectual Property Organization (BF, BJ, CF, CG, CI, CM, GA, GN, GQ, GW, KM, ML, MR, NE, SN, TD, TG)
Publication Language: Japanese (JA)
Filing Language: Japanese (JA)