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1. (WO2018225803) MOLD COMPONENT MANUFACTURING METHOD AND MOLD COMPONENT
Latest bibliographic data on file with the International Bureau    Submit observation

Pub. No.: WO/2018/225803 International Application No.: PCT/JP2018/021779
Publication Date: 13.12.2018 International Filing Date: 06.06.2018
IPC:
B23K 26/21 (2014.01) ,B21C 25/02 (2006.01) ,B23K 26/342 (2014.01)
[IPC code unknown for B23K 26/21]
B PERFORMING OPERATIONS; TRANSPORTING
21
MECHANICAL METAL-WORKING WITHOUT ESSENTIALLY REMOVING MATERIAL; PUNCHING METAL
C
MANUFACTURE OF METAL SHEETS, WIRE, RODS, TUBES, PROFILES OR LIKE SEMI-MANUFACTURED PRODUCTS OTHERWISE THAN BY ROLLING; AUXILIARY OPERATIONS USED IN CONNECTION WITH METAL-WORKING WITHOUT ESSENTIALLY REMOVING MATERIAL
25
Profiling tools for metal extruding
02
Dies
[IPC code unknown for B23K 26/342]
Applicants:
住友電工焼結合金株式会社 SUMITOMO ELECTRIC SINTERED ALLOY, LTD. [JP/JP]; 岡山県高梁市成羽町成羽2901番地 2901, Nariwa, Nariwa-cho, Takahashi-shi, Okayama 7160192, JP
Inventors:
大瀧 隆徳 OOTAKI, Takanori; JP
Agent:
山野 宏 YAMANO, Hiroshi; JP
Priority Data:
2017-11289907.06.2017JP
Title (EN) MOLD COMPONENT MANUFACTURING METHOD AND MOLD COMPONENT
(FR) PROCÉDÉ DE FABRICATION D'UN ÉLÉMENT DE MOULE ET ÉLÉMENT DE MOULE
(JA) 金型部品の製造方法、及び金型部品
Abstract:
(EN) A mold component manufacturing method provided with: a step of forming a first surface by removing from a worn mold component a predetermined region including a worn portion; and a step of overlaying steel material on the first surface.
(FR) L'invention concerne un procédé de fabrication d'un élément de moule comprenant : une étape consistant à former une première surface par retrait d'une région prédéterminée d'un élément de moule usé, ladite région comportant une partie usée ; et une étape consistant à recouvrir la première surface d'un matériau d'acier.
(JA) 摩耗した金型部品から摩耗箇所を含む所定領域を除去することにより第一面を形成する工程と、前記第一面に鋼材を肉盛りする工程と、を備える金型部品の製造方法。
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Designated States: AE, AG, AL, AM, AO, AT, AU, AZ, BA, BB, BG, BH, BN, BR, BW, BY, BZ, CA, CH, CL, CN, CO, CR, CU, CZ, DE, DJ, DK, DM, DO, DZ, EC, EE, EG, ES, FI, GB, GD, GE, GH, GM, GT, HN, HR, HU, ID, IL, IN, IR, IS, JO, JP, KE, KG, KH, KN, KP, KR, KW, KZ, LA, LC, LK, LR, LS, LU, LY, MA, MD, ME, MG, MK, MN, MW, MX, MY, MZ, NA, NG, NI, NO, NZ, OM, PA, PE, PG, PH, PL, PT, QA, RO, RS, RU, RW, SA, SC, SD, SE, SG, SK, SL, SM, ST, SV, SY, TH, TJ, TM, TN, TR, TT, TZ, UA, UG, US, UZ, VC, VN, ZA, ZM, ZW
African Regional Intellectual Property Organization (ARIPO) (BW, GH, GM, KE, LR, LS, MW, MZ, NA, RW, SD, SL, ST, SZ, TZ, UG, ZM, ZW)
Eurasian Patent Office (AM, AZ, BY, KG, KZ, RU, TJ, TM)
European Patent Office (EPO) (AL, AT, BE, BG, CH, CY, CZ, DE, DK, EE, ES, FI, FR, GB, GR, HR, HU, IE, IS, IT, LT, LU, LV, MC, MK, MT, NL, NO, PL, PT, RO, RS, SE, SI, SK, SM, TR)
African Intellectual Property Organization (BF, BJ, CF, CG, CI, CM, GA, GN, GQ, GW, KM, ML, MR, NE, SN, TD, TG)
Publication Language: Japanese (JA)
Filing Language: Japanese (JA)