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1. (WO2018225687) LAMINATE FOR CIRCUIT BOARDS, METAL BASE CIRCUIT BOARD AND POWER MODULE
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Pub. No.: WO/2018/225687 International Application No.: PCT/JP2018/021378
Publication Date: 13.12.2018 International Filing Date: 04.06.2018
IPC:
H05K 1/05 (2006.01) ,B32B 15/08 (2006.01) ,C08L 33/08 (2006.01) ,C08L 63/00 (2006.01) ,C08L 79/00 (2006.01) ,C08L 101/00 (2006.01) ,C09J 7/00 (2018.01) ,H05K 1/03 (2006.01)
H ELECTRICITY
05
ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
K
PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
1
Printed circuits
02
Details
03
Use of materials for the substrate
05
Insulated metal substrate
B PERFORMING OPERATIONS; TRANSPORTING
32
LAYERED PRODUCTS
B
LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
15
Layered products essentially comprising metal
04
comprising metal as the main or only constituent of a layer, next to another layer of a specific substance
08
of synthetic resin
C CHEMISTRY; METALLURGY
08
ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
L
COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
33
Compositions of homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and only one being terminated by only one carboxyl radical, or of salts, anhydrides, esters, amides, imides, or nitriles thereof; Compositions of derivatives of such polymers
04
Homopolymers or copolymers of esters
06
of esters containing only carbon, hydrogen, and oxygen, the oxygen atom being present only as part of the carboxyl radical
08
Homopolymers or copolymers of acrylic acid esters
C CHEMISTRY; METALLURGY
08
ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
L
COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
63
Compositions of epoxy resins; Compositions of derivatives of epoxy resins
C CHEMISTRY; METALLURGY
08
ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
L
COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
79
Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing nitrogen with or without oxygen, or carbon only, not provided for in groups C08L61/-C08L77/259
C CHEMISTRY; METALLURGY
08
ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
L
COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
101
Compositions of unspecified macromolecular compounds
C CHEMISTRY; METALLURGY
09
DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
J
ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
7
Adhesives in the form of films or foils
H ELECTRICITY
05
ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
K
PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
1
Printed circuits
02
Details
03
Use of materials for the substrate
Applicants:
日本発條株式会社 NHK SPRING CO., LTD. [JP/JP]; 神奈川県横浜市金沢区福浦3丁目10番地 3-10, Fukuura, Kanazawa-ku, Yokohama-shi, Kanagawa 2360004, JP
Inventors:
水野 克美 MIZUNO, Katsumi; JP
木内 陽子 KIUCHI, Yoko; JP
Agent:
蔵田 昌俊 KURATA, Masatoshi; JP
野河 信久 NOGAWA, Nobuhisa; JP
河野 直樹 KOHNO, Naoki; JP
井上 正 INOUE, Tadashi; JP
Priority Data:
2017-11362408.06.2017JP
Title (EN) LAMINATE FOR CIRCUIT BOARDS, METAL BASE CIRCUIT BOARD AND POWER MODULE
(FR) STRATIFIÉ POUR CARTES DE CIRCUITS IMPRIMÉS, CARTE DE CIRCUITS IMPRIMÉS À BASE MÉTALLIQUE ET MODULE D'ALIMENTATION
(JA) 回路基板用積層板、金属ベース回路基板及びパワーモジュール
Abstract:
(EN) Provided is a laminate for circuit boards, which comprises a metal substrate, an insulating layer that is provided on at least one surface of the metal substrate, and a metal foil that is provided on the insulating layer. The insulating layer contains a resin component and an inorganic filler; and the resin component has a phase separation structure that comprises a discontinuous phase containing a thermosetting resin and a continuous phase containing a rubber.
(FR) L'invention concerne un stratifié pour cartes de circuits imprimés, qui comprend un substrat métallique, une couche isolante qui est disposée sur au moins une surface du substrat métallique, et une feuille métallique qui est disposée sur la couche isolante. La couche isolante contient un constituant de type résine et une charge minérale ; et le constituant de type résine a une structure de séparation de phases qui comprend une phase discontinue contenant une résine thermodurcissable et une phase continue contenant un caoutchouc.
(JA) 金属基板と、上記金属基板の少なくとも片面に設けられた絶縁層と、上記絶縁層上に設けられた金属箔とを具備する回路基板用積層板が提供される。上記絶縁層は、樹脂成分と無機充填材とを含有し、上記樹脂成分は、熱硬化性樹脂を含有する非連続相と、ゴムを含有する連続相とを含む相分離構造を有している。
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Designated States: AE, AG, AL, AM, AO, AT, AU, AZ, BA, BB, BG, BH, BN, BR, BW, BY, BZ, CA, CH, CL, CN, CO, CR, CU, CZ, DE, DJ, DK, DM, DO, DZ, EC, EE, EG, ES, FI, GB, GD, GE, GH, GM, GT, HN, HR, HU, ID, IL, IN, IR, IS, JO, KE, KG, KH, KN, KP, KR, KW, KZ, LA, LC, LK, LR, LS, LU, LY, MA, MD, ME, MG, MK, MN, MW, MX, MY, MZ, NA, NG, NI, NO, NZ, OM, PA, PE, PG, PH, PL, PT, QA, RO, RS, RU, RW, SA, SC, SD, SE, SG, SK, SL, SM, ST, SV, SY, TH, TJ, TM, TN, TR, TT, TZ, UA, UG, US, UZ, VC, VN, ZA, ZM, ZW
African Regional Intellectual Property Organization (ARIPO) (BW, GH, GM, KE, LR, LS, MW, MZ, NA, RW, SD, SL, ST, SZ, TZ, UG, ZM, ZW)
Eurasian Patent Office (AM, AZ, BY, KG, KZ, RU, TJ, TM)
European Patent Office (EPO) (AL, AT, BE, BG, CH, CY, CZ, DE, DK, EE, ES, FI, FR, GB, GR, HR, HU, IE, IS, IT, LT, LU, LV, MC, MK, MT, NL, NO, PL, PT, RO, RS, SE, SI, SK, SM, TR)
African Intellectual Property Organization (BF, BJ, CF, CG, CI, CM, GA, GN, GQ, GW, KM, ML, MR, NE, SN, TD, TG)
Publication Language: Japanese (JA)
Filing Language: Japanese (JA)