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1. (WO2018225441) PHOTOSENSITIVE RESIN COMPOSITION, DRY FILM, AND PRINTED WIRING BOARD
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Pub. No.: WO/2018/225441 International Application No.: PCT/JP2018/017810
Publication Date: 13.12.2018 International Filing Date: 08.05.2018
IPC:
G03F 7/004 (2006.01) ,G03F 7/027 (2006.01) ,G03F 7/075 (2006.01) ,H05K 1/03 (2006.01) ,H05K 3/28 (2006.01)
G PHYSICS
03
PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
F
PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
7
Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printed surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
004
Photosensitive materials
04
Chromates
G PHYSICS
03
PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
F
PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
7
Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printed surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
004
Photosensitive materials
027
Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds
G PHYSICS
03
PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
F
PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
7
Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printed surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
004
Photosensitive materials
075
Silicon-containing compounds
H ELECTRICITY
05
ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
K
PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
1
Printed circuits
02
Details
03
Use of materials for the substrate
H ELECTRICITY
05
ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
K
PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
3
Apparatus or processes for manufacturing printed circuits
22
Secondary treatment of printed circuits
28
Applying non-metallic protective coatings
Applicants:
互応化学工業株式会社 GOO CHEMICAL CO., LTD. [JP/JP]; 京都府宇治市伊勢田町井尻58番地 58, Ijiri, Iseda-cho, Uji-shi, Kyoto 6110043, JP
日鉄ケミカル&マテリアル株式会社 NIPPON STEEL CHEMICAL & MATERIAL CO. LTD. [JP/JP]; 東京都千代田区外神田四丁目14番1号 14-1, Sotokanda 4-chome, Chiyoda-ku, Tokyo 1010021, JP
Inventors:
樋口 倫也 HIGUCHI, Michiya; --
藤原 勇佐 FUJIWARA, Yusuke; --
橋本 壯一 HASHIMOTO, Soichi; --
荒井 貴 ARAI, Takashi; --
川里 浩信 KAWASATO, Hironobu; --
稲葉 真司 INABA, Shinji; --
Agent:
特許業務法人北斗特許事務所 HOKUTO PATENT ATTORNEYS OFFICE; 大阪府大阪市北区梅田一丁目12-17梅田スクエアビル Umeda Square Bldg., 12-17, Umeda 1-chome, Kita-ku, Osaka-shi, Osaka 5300001, JP
Priority Data:
2017-11469509.06.2017JP
Title (EN) PHOTOSENSITIVE RESIN COMPOSITION, DRY FILM, AND PRINTED WIRING BOARD
(FR) COMPOSITION DE RÉSINE PHOTOSENSIBLE, FILM SEC, ET CARTE DE CIRCUIT IMPRIMÉ
(JA) 感光性樹脂組成物、ドライフィルム、及びプリント配線板
Abstract:
(EN) The present invention addresses the problem of providing a photosensitive resin composition which has high resolution and which is capable of forming a cured product having high copper-plating adhesiveness. This photosensitive resin composition is photocurable. The photosensitive resin composition contains: a carboxyl group-containing resin (A) that has an aromatic ring; an organic filler (B) that has an average primary particle size of 1 µm or less and has a carboxyl group; a coupling agent (C) that has at least one type of atom selected from the group consisting of a silicon atom, an aluminum atom, a titanium atom, and a zirconium atom, and that has two or more functional groups including at least one selected from the group consisting of alkoxy groups, acyloxy groups, and alkoxides; and a silica filler (D) that has an average primary particle size within the range of 1-150 nm.
(FR) La présente invention aborde le problème de la fourniture d'une composition de résine photosensible qui a une haute résolution et qui est apte à former un produit durci ayant une forte adhésivité de placage de cuivre. Cette composition de résine photosensible est photodurcissable. La composition de résine photosensible contient : une résine contenant un groupe carboxyle (A) qui a un cycle aromatique; une charge organique (B) qui a une taille de particule primaire moyenne de 1 µm ou moins et a un groupe carboxyle; un agent de couplage (C) qui a au moins un type d'atome choisi dans le groupe constitué par un atome de silicium, un atome d'aluminium, un atome de titane et un atome de zirconium, et qui a deux groupes fonctionnels ou plus comprenant au moins un groupe choisi dans le groupe constitué par des groupes alcoxy, des groupes acyloxy et des alcoxydes; et une charge de silice (D) qui a une taille de particule primaire moyenne dans la plage de 1 à 150 nm.
(JA) 本発明の課題は、高い銅めっき密着性を有する硬化物を形成しうるとともに、解像性に優れた感光性樹脂組成物を提供することである。本発明に係る感光性樹脂組成物は、光硬化性を有する。感光性樹脂組成物は、芳香環を有するカルボキシル基含有樹脂(A)と、平均一次粒子径が1μm以下であり、カルボキシル基を有する有機フィラー(B)と、ケイ素原子、アルミニウム原子、チタン原子、及びジルコニウム原子からなる群から選ばれる少なくとも一種の原子と、二つ以上の官能基とを有し、前記官能基は、アルコキシ基、アシルオキシ基及びアルコキシドからなる群から選ばれる少なくとも一種の基を含むカップリング剤(C)と、平均一次粒子径が1~150nmの範囲内であるシリカフィラー(D)と、を含有する。
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Designated States: AE, AG, AL, AM, AO, AT, AU, AZ, BA, BB, BG, BH, BN, BR, BW, BY, BZ, CA, CH, CL, CN, CO, CR, CU, CZ, DE, DJ, DK, DM, DO, DZ, EC, EE, EG, ES, FI, GB, GD, GE, GH, GM, GT, HN, HR, HU, ID, IL, IN, IR, IS, JO, JP, KE, KG, KH, KN, KP, KR, KW, KZ, LA, LC, LK, LR, LS, LU, LY, MA, MD, ME, MG, MK, MN, MW, MX, MY, MZ, NA, NG, NI, NO, NZ, OM, PA, PE, PG, PH, PL, PT, QA, RO, RS, RU, RW, SA, SC, SD, SE, SG, SK, SL, SM, ST, SV, SY, TH, TJ, TM, TN, TR, TT, TZ, UA, UG, US, UZ, VC, VN, ZA, ZM, ZW
African Regional Intellectual Property Organization (ARIPO) (BW, GH, GM, KE, LR, LS, MW, MZ, NA, RW, SD, SL, ST, SZ, TZ, UG, ZM, ZW)
Eurasian Patent Office (AM, AZ, BY, KG, KZ, RU, TJ, TM)
European Patent Office (EPO) (AL, AT, BE, BG, CH, CY, CZ, DE, DK, EE, ES, FI, FR, GB, GR, HR, HU, IE, IS, IT, LT, LU, LV, MC, MK, MT, NL, NO, PL, PT, RO, RS, SE, SI, SK, SM, TR)
African Intellectual Property Organization (BF, BJ, CF, CG, CI, CM, GA, GN, GQ, GW, KM, ML, MR, NE, SN, TD, TG)
Publication Language: Japanese (JA)
Filing Language: Japanese (JA)