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1. (WO2018225323) FILM-LIKE ADHESIVE FOR SEMICONDUCTORS, SEMICONDUCTOR DEVICE PRODUCTION METHOD, AND SEMICONDUCTOR DEVICE
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Pub. No.: WO/2018/225323 International Application No.: PCT/JP2018/009996
Publication Date: 13.12.2018 International Filing Date: 14.03.2018
IPC:
C09J 7/10 (2018.01) ,C09J 4/02 (2006.01) ,C09J 7/35 (2018.01) ,C09J 11/06 (2006.01) ,C09J 201/00 (2006.01) ,H01L 21/60 (2006.01)
[IPC code unknown for C09J 7/10]
C CHEMISTRY; METALLURGY
09
DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
J
ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
4
Adhesives based on organic non-macromolecular compounds having at least one polymerisable carbon-to-carbon unsaturated bond
02
Acrylmonomers
[IPC code unknown for C09J 7/35]
C CHEMISTRY; METALLURGY
09
DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
J
ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
11
Features of adhesives not provided for in group C09J9/76
02
Non-macromolecular additives
06
organic
C CHEMISTRY; METALLURGY
09
DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
J
ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
201
Adhesives based on unspecified macromolecular compounds
H ELECTRICITY
01
BASIC ELECTRIC ELEMENTS
L
SEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
21
Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
02
Manufacture or treatment of semiconductor devices or of parts thereof
04
the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer, carrier concentration layer
50
Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the groups H01L21/06-H01L21/326162
60
Attaching leads or other conductive members, to be used for carrying current to or from the device in operation
Applicants:
日立化成株式会社 HITACHI CHEMICAL COMPANY, LTD. [JP/JP]; 東京都千代田区丸の内一丁目9番2号 9-2, Marunouchi 1-chome, Chiyoda-ku, Tokyo 1006606, JP
Inventors:
秋吉 利泰 AKIYOSHI Toshiyasu; JP
菅原 丈博 SUGAWARA Takehiro; JP
Agent:
長谷川 芳樹 HASEGAWA Yoshiki; JP
清水 義憲 SHIMIZU Yoshinori; JP
平野 裕之 HIRANO Hiroyuki; JP
Priority Data:
PCT/JP2017/02114307.06.2017JP
Title (EN) FILM-LIKE ADHESIVE FOR SEMICONDUCTORS, SEMICONDUCTOR DEVICE PRODUCTION METHOD, AND SEMICONDUCTOR DEVICE
(FR) ADHÉSIF SOUS FORME DE FILM POUR SEMI-CONDUCTEUR, ET DISPOSITIF À SEMI-CONDUCTEURS AINSI QUE PROCÉDÉ DE FABRICATION DE CELUI-CI
(JA) 半導体用フィルム状接着剤、半導体装置の製造方法及び半導体装置
Abstract:
(EN) This film-like adhesive for semiconductors is provided with a first adhesive layer and a second adhesive layer provided upon the first adhesive layer, and the modulus of elasticity at 35°C of the film-like adhesive after curing is 3.0–5.0 GPa.
(FR) L’adhésif sous forme de film pour semi-conducteur de l’invention est équipé d’une première couche adhésive, et d’une seconde couche adhésive agencée sur cette première couche adhésive, et présente un module d’élasticité à 35°C après durcissement compris entre 3,0 et 5,0GPa.
(JA) 本発明の半導体用フィルム状接着剤は、第一の接着層と、該第一の接着層上に設けられた第二の接着層を備え、硬化後の35℃における弾性率が3.0~5.0GPaである。
Designated States: AE, AG, AL, AM, AO, AT, AU, AZ, BA, BB, BG, BH, BN, BR, BW, BY, BZ, CA, CH, CL, CN, CO, CR, CU, CZ, DE, DJ, DK, DM, DO, DZ, EC, EE, EG, ES, FI, GB, GD, GE, GH, GM, GT, HN, HR, HU, ID, IL, IN, IR, IS, JO, JP, KE, KG, KH, KN, KP, KR, KW, KZ, LA, LC, LK, LR, LS, LU, LY, MA, MD, ME, MG, MK, MN, MW, MX, MY, MZ, NA, NG, NI, NO, NZ, OM, PA, PE, PG, PH, PL, PT, QA, RO, RS, RU, RW, SA, SC, SD, SE, SG, SK, SL, SM, ST, SV, SY, TH, TJ, TM, TN, TR, TT, TZ, UA, UG, US, UZ, VC, VN, ZA, ZM, ZW
African Regional Intellectual Property Organization (ARIPO) (BW, GH, GM, KE, LR, LS, MW, MZ, NA, RW, SD, SL, ST, SZ, TZ, UG, ZM, ZW)
Eurasian Patent Office (AM, AZ, BY, KG, KZ, RU, TJ, TM)
European Patent Office (EPO) (AL, AT, BE, BG, CH, CY, CZ, DE, DK, EE, ES, FI, FR, GB, GR, HR, HU, IE, IS, IT, LT, LU, LV, MC, MK, MT, NL, NO, PL, PT, RO, RS, SE, SI, SK, SM, TR)
African Intellectual Property Organization (BF, BJ, CF, CG, CI, CM, GA, GN, GQ, GW, KM, ML, MR, NE, SN, TD, TG)
Publication Language: Japanese (JA)
Filing Language: Japanese (JA)