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1. (WO2018224511) POWER SEMICONDUCTOR MODULE
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Pub. No.: WO/2018/224511 International Application No.: PCT/EP2018/064799
Publication Date: 13.12.2018 International Filing Date: 05.06.2018
IPC:
H05K 7/14 (2006.01)
H ELECTRICITY
05
ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
K
PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
7
Constructional details common to different types of electric apparatus
14
Mounting supporting structure in casing or on frame or rack
Applicants:
ABB SCHWEIZ AG [CH/CH]; Brown Boveri Strasse 6 5400 Baden, CH
Inventors:
TRUESSEL, Dominik; CH
HARTMANN, Samuel; CH
FISCHER, Fabian; CH
BEYER, Harald; CH
Agent:
ABB PATENT ATTORNEYS; ABB Schweiz AG, Intellectual Property (CH-IP) Brown Boveri Strasse 6 5400 Baden, CH
Priority Data:
17174651.407.06.2017EP
Title (EN) POWER SEMICONDUCTOR MODULE
(FR) MODULE À SEMI-CONDUCTEUR DE PUISSANCE
Abstract:
(EN) A power semiconductor module (60) comprises a housing (58) accommodating a power circuit (62) with at least one power semiconductor chip (64), the housing providing at least two power terminals (68); a printed circuit board (10) mounted to the housing (58) and electrically connected to the power circuit (62) for distributing auxiliary signals; and at least one auxiliary terminal (16) mounted to the printed circuit board (10) with a press-fit connection (26) provided by a body (24) of the auxiliary terminal (16).
(FR) Cette invention concerne un module à semi-conducteur de puissance (60), comprenant un boîtier (58) logeant un circuit d'alimentation (62) avec au moins une puce à semi-conducteur de puissance (64), le boîtier fournissant au moins deux bornes d'alimentation (68) ; une carte de circuit imprimé (10) montée sur le boîtier (58) et connectée électriquement au circuit d'alimentation (62) pour distribuer des signaux auxiliaires ; et au moins une borne auxiliaire (16) montée sur la carte de circuit imprimé (10) au moyen d'une connexion par ajustement par pression (26) fournie par un corps (24) de la borne auxiliaire (16).
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Designated States: AE, AG, AL, AM, AO, AT, AU, AZ, BA, BB, BG, BH, BN, BR, BW, BY, BZ, CA, CH, CL, CN, CO, CR, CU, CZ, DE, DJ, DK, DM, DO, DZ, EC, EE, EG, ES, FI, GB, GD, GE, GH, GM, GT, HN, HR, HU, ID, IL, IN, IR, IS, JO, JP, KE, KG, KH, KN, KP, KR, KW, KZ, LA, LC, LK, LR, LS, LU, LY, MA, MD, ME, MG, MK, MN, MW, MX, MY, MZ, NA, NG, NI, NO, NZ, OM, PA, PE, PG, PH, PL, PT, QA, RO, RS, RU, RW, SA, SC, SD, SE, SG, SK, SL, SM, ST, SV, SY, TH, TJ, TM, TN, TR, TT, TZ, UA, UG, US, UZ, VC, VN, ZA, ZM, ZW
African Regional Intellectual Property Organization (ARIPO) (BW, GH, GM, KE, LR, LS, MW, MZ, NA, RW, SD, SL, ST, SZ, TZ, UG, ZM, ZW)
Eurasian Patent Office (AM, AZ, BY, KG, KZ, RU, TJ, TM)
European Patent Office (EPO) (AL, AT, BE, BG, CH, CY, CZ, DE, DK, EE, ES, FI, FR, GB, GR, HR, HU, IE, IS, IT, LT, LU, LV, MC, MK, MT, NL, NO, PL, PT, RO, RS, SE, SI, SK, SM, TR)
African Intellectual Property Organization (BF, BJ, CF, CG, CI, CM, GA, GN, GQ, GW, KM, ML, MR, NE, SN, TD, TG)
Publication Language: English (EN)
Filing Language: English (EN)