Search International and National Patent Collections

1. (WO2018222857) POLISHING/LAPPING FILM WITH MICRO-ENCAPSULATED CHEMISTRIES PREVENTING DEBRIS ENTRAINMENT

Pub. No.:    WO/2018/222857    International Application No.:    PCT/US2018/035370
Publication Date: Fri Dec 07 00:59:59 CET 2018 International Filing Date: Fri Jun 01 01:59:59 CEST 2018
IPC: B24B 37/24
B24D 3/34
B24D 11/00
C09K 3/14
Applicants: CORNING RESEARCH & DEVELOPMENT CORPORATION
Inventors: BOOKBINDER, Dana Craig
EKWEJUNOR-ETCHIE, Ogbemi Joseph
HAMILTON, Karen Ann
HUZINEC, Gary Michael
Title: POLISHING/LAPPING FILM WITH MICRO-ENCAPSULATED CHEMISTRIES PREVENTING DEBRIS ENTRAINMENT
Abstract:
Embodiments of a polishing film are provided. The polishing film includes a substrate having a surface. Abrasive particles are attached to the surface of the substrate, and microcapsules are attached to the surface of the substrate at locations between the abrasive particles. Each of the microcapsules comprises at least one of a lubricant, a surfactant, a silane, a silicon-containing cationic ammonium compound, or a siloxane. Further, methods of forming the polishing film and using the polishing film to polish an optical fiber connector are provided.