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1. (WO2018222706) ELECTRICAL VIA PROVIDING ELECTRODE PAIR ACCESS ON A SINGLE SIDE OF A DEVICE
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Pub. No.: WO/2018/222706 International Application No.: PCT/US2018/035117
Publication Date: 06.12.2018 International Filing Date: 30.05.2018
IPC:
H01L 41/047 (2006.01) ,H01L 41/08 (2006.01)
H ELECTRICITY
01
BASIC ELECTRIC ELEMENTS
L
SEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
41
Piezo-electric devices in general; Electrostrictive devices in general; Magnetostrictive devices in general; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
02
Details
04
of piezo-electric or electrostrictive elements
047
Electrodes
H ELECTRICITY
01
BASIC ELECTRIC ELEMENTS
L
SEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
41
Piezo-electric devices in general; Electrostrictive devices in general; Magnetostrictive devices in general; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
08
Piezo-electric or electrostrictive elements
Applicants:
METIS DESIGN CORPORATION [US/US]; 205 Portland Street 4th Floor Boston, MA 02114, US
Inventors:
KESSLER, Seth S.; US
DUNN, Christopher T.; US
Agent:
BURNS, David R.; US
BLAZESKI, George; US
BROWN, Ronald, E.; US
BAI, Mei; US
BOWLES, Anita, M.; US
Priority Data:
62/512,33930.05.2017US
Title (EN) ELECTRICAL VIA PROVIDING ELECTRODE PAIR ACCESS ON A SINGLE SIDE OF A DEVICE
(FR) INTERCONNEXION ÉLECTRIQUE FOURNISSANT UN ACCÈS DE PAIRE D'ÉLECTRODES SUR UN SEUL CÔTÉ D'UN DISPOSITIF
Abstract:
(EN) Devices and methods described herein provide electrode pair access from a single side of a device by using one or more via holes (112) through the device (100). The via hole can pass through or near the center of the device. By creating a conductive path (120b) through the via hole of the device, devices and methods of the present disclosure advantageously provide access to a pair of electrodes (110, 120), each of which contacts a different side of a device layer, on a single side of the device while enabling a greater active device area than is possible using conventional techniques. In addition, the central location of the via hole provides favorable mechanical properties by avoiding radial constriction of the device layers in applications such as piezoelectric devices.
(FR) Les dispositifs et les procédés décrits dans l'invention fournissent un accès de paire d'électrodes à partir d'un seul côté d'un dispositif en utilisant un ou plusieurs trous d'interconnexion (112) à travers le dispositif (100). Le trou d'interconnexion peut passer à travers ou à proximité du centre du dispositif. En créant un trajet conducteur (120b) à travers le trou d'interconnexion du dispositif, des dispositifs et des procédés de la présente invention fournissent avantageusement un accès à une paire d'électrodes (110, 120), chacune d'elles entrant en contact avec un côté différent d'une couche de dispositif, sur un seul côté du dispositif tout en permettant une plus grande surface de dispositif actif que ce qui est possible avec les techniques classiques. De plus, l'emplacement central du trou d'interconnexion fournit des propriétés mécaniques favorables en évitant la constriction radiale des couches de dispositif dans des applications telles que des dispositifs piézoélectriques.
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Designated States: AE, AG, AL, AM, AO, AT, AU, AZ, BA, BB, BG, BH, BN, BR, BW, BY, BZ, CA, CH, CL, CN, CO, CR, CU, CZ, DE, DJ, DK, DM, DO, DZ, EC, EE, EG, ES, FI, GB, GD, GE, GH, GM, GT, HN, HR, HU, ID, IL, IN, IR, IS, JO, JP, KE, KG, KH, KN, KP, KR, KW, KZ, LA, LC, LK, LR, LS, LU, LY, MA, MD, ME, MG, MK, MN, MW, MX, MY, MZ, NA, NG, NI, NO, NZ, OM, PA, PE, PG, PH, PL, PT, QA, RO, RS, RU, RW, SA, SC, SD, SE, SG, SK, SL, SM, ST, SV, SY, TH, TJ, TM, TN, TR, TT, TZ, UA, UG, US, UZ, VC, VN, ZA, ZM, ZW
African Regional Intellectual Property Organization (ARIPO) (BW, GH, GM, KE, LR, LS, MW, MZ, NA, RW, SD, SL, ST, SZ, TZ, UG, ZM, ZW)
Eurasian Patent Office (AM, AZ, BY, KG, KZ, RU, TJ, TM)
European Patent Office (EPO) (AL, AT, BE, BG, CH, CY, CZ, DE, DK, EE, ES, FI, FR, GB, GR, HR, HU, IE, IS, IT, LT, LU, LV, MC, MK, MT, NL, NO, PL, PT, RO, RS, SE, SI, SK, SM, TR)
African Intellectual Property Organization (BF, BJ, CF, CG, CI, CM, GA, GN, GQ, GW, KM, ML, MR, NE, SN, TD, TG)
Publication Language: English (EN)
Filing Language: English (EN)