Search International and National Patent Collections

1. (WO2018222619) METHOD FOR TESTING ELECTRICAL CONNECTION TO MODULE CONNECTOR ON PRINTED CIRCUIT BOARD OR OTHER STRUCTURE AND RELATED APPARATUS

Pub. No.:    WO/2018/222619    International Application No.:    PCT/US2018/034950
Publication Date: Fri Dec 07 00:59:59 CET 2018 International Filing Date: Wed May 30 01:59:59 CEST 2018
IPC:
Applicants: MURATA MANUFACTURING CO., LTD.
MURATA ELECTRONICS NORTH AMERICA, INC.
Inventors: TETSUNO, Hiroyuki
Title: METHOD FOR TESTING ELECTRICAL CONNECTION TO MODULE CONNECTOR ON PRINTED CIRCUIT BOARD OR OTHER STRUCTURE AND RELATED APPARATUS
Abstract:
An apparatus includes a substrate (102) and a connector (110) mounted on or to the substrate. The connector is configured to be physically coupled to an external component. The apparatus also includes a first electrical path (108) electrically coupling one or more circuit components (104) to the connector. The apparatus further includes a second electrical path (114) electrically coupling the connector to a terminal pad (118). The second electrical path is physically separate from the first electrical path, and the second electrical path is electrically coupled to the first electrical path by the connector. The terminal pad may be configured to receive, over the second electrical path, a signal provided from the one or more circuit components to the connector over the first electrical path. A presence of the signal from the one or more circuit components at the terminal pad may be indicative of a proper electrical connection between the connector and the one or more circuit components.