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1. (WO2018222492) METHODS AND APPARATUSES FOR WIRELESS COMMUNICATION WITH A BRUSH
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Pub. No.: WO/2018/222492 International Application No.: PCT/US2018/034360
Publication Date: 06.12.2018 International Filing Date: 24.05.2018
IPC:
H01L 21/67 (2006.01)
H ELECTRICITY
01
BASIC ELECTRIC ELEMENTS
L
SEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
21
Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
67
Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components
Applicants:
ILLINOIS TOOL WORKS INC. [US/US]; 155 Harlem Avenue Glenview, Illinois 60025, US
Inventors:
WITHERS, Bradley Scott; US
HUGHES, Corey Alan; US
NELSON, Erik Scott; US
CHRISTIE, Steven Kenneth; US
BEST, Brent Allan; US
Agent:
PAHNKE, Chad A.; US
Priority Data:
15/607,84930.05.2017US
Title (EN) METHODS AND APPARATUSES FOR WIRELESS COMMUNICATION WITH A BRUSH
(FR) PROCÉDÉS ET APPAREILS DE COMMUNICATION SANS FIL AVEC UNE BROSSE
Abstract:
(EN) Provided is a disclosure for embodiments for a brush with communication capabilities, which is configured to clean a surface of, for example, a semiconductor wafer, as well as an offline brush conditioning system and a CMP system that can communicate with the brush.
(FR) L'invention concerne, dans des modes de réalisation, une brosse ayant des capacités de communication qui est conçue pour nettoyer une surface de, par exemple, une plaquette à semi-conducteurs, ainsi qu'un système de conditionnement de brosse hors ligne et un système CMP qui peut communiquer avec la brosse.
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Designated States: AE, AG, AL, AM, AO, AT, AU, AZ, BA, BB, BG, BH, BN, BR, BW, BY, BZ, CA, CH, CL, CN, CO, CR, CU, CZ, DE, DJ, DK, DM, DO, DZ, EC, EE, EG, ES, FI, GB, GD, GE, GH, GM, GT, HN, HR, HU, ID, IL, IN, IR, IS, JO, JP, KE, KG, KH, KN, KP, KR, KW, KZ, LA, LC, LK, LR, LS, LU, LY, MA, MD, ME, MG, MK, MN, MW, MX, MY, MZ, NA, NG, NI, NO, NZ, OM, PA, PE, PG, PH, PL, PT, QA, RO, RS, RU, RW, SA, SC, SD, SE, SG, SK, SL, SM, ST, SV, SY, TH, TJ, TM, TN, TR, TT, TZ, UA, UG, US, UZ, VC, VN, ZA, ZM, ZW
African Regional Intellectual Property Organization (ARIPO) (BW, GH, GM, KE, LR, LS, MW, MZ, NA, RW, SD, SL, ST, SZ, TZ, UG, ZM, ZW)
Eurasian Patent Office (AM, AZ, BY, KG, KZ, RU, TJ, TM)
European Patent Office (EPO) (AL, AT, BE, BG, CH, CY, CZ, DE, DK, EE, ES, FI, FR, GB, GR, HR, HU, IE, IS, IT, LT, LU, LV, MC, MK, MT, NL, NO, PL, PT, RO, RS, SE, SI, SK, SM, TR)
African Intellectual Property Organization (BF, BJ, CF, CG, CI, CM, GA, GN, GQ, GW, KM, ML, MR, NE, SN, TD, TG)
Publication Language: English (EN)
Filing Language: English (EN)