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1. (WO2018222399) CURABLE SILICONE COMPOSITION WITH REDUCED MOLD FOULING

Pub. No.:    WO/2018/222399    International Application No.:    PCT/US2018/033123
Publication Date: Fri Dec 07 00:59:59 CET 2018 International Filing Date: Fri May 18 01:59:59 CEST 2018
IPC: C08L 83/04
Applicants: DOW SILICONES CORPORATION
Inventors: BEUKEMA, Martin
DENT, Stanton
DESCAMPS, Pierre
LEADLEY, Stuart
MCDONALD, Joel
VAN TIGGELEN, Kevin
Title: CURABLE SILICONE COMPOSITION WITH REDUCED MOLD FOULING
Abstract:
A curable silicone composition comprising (A) an alkenyl-containing organopolysiloxane comprising (A-1) a dialkylpolysiloxane that has an average of at least two alkenyl groups in each molecule), and (A-2) an alkenyl-containing, resin-form organopolysiloxane that comprises the SiO4/2 unit, R12R2SiO1/2 unit, and R13SiO1/2 unit; (B) an organopolysiloxane that has an average of at least three silicon-bonded hydrogen atoms in each molecule, wherein component (B) is an organopolysiloxane comprising (B-1) an organopolysiloxane that contains at least 0.7 mass % silicon-bonded hydrogen and that comprises SiO4/2 units and HR32SiO1/2 units in a ratio ranging from 1.50 to 2.50 moles of HR32SiO1/2 units per 1 mole of SiO4/2 units, at 50 to 100 mass % of component (B), and (B-2) a straight-chain organopolysiloxane that contains at least 0.3 mass % silicon-bonded hydrogen, at 0 to 50 mass % of component (B); and (C) a hydrosilylation reaction catalyst.