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|1. (WO2018221976) ORAL SENSOR MANUFACTURING METHOD USING BUILD-UP MULTILAYER PRINTED CIRCUIT BOARD, AND INTRA-ORAL SENSOR MANUFACTURED THEREFROM|
|Applicants:||PICOPACK CO., LTD.
|Inventors:||OH, Guen Young
HONG, Sam Pyo
PARK, Byung Eun
YANG, Jin Gyu
|Title:||ORAL SENSOR MANUFACTURING METHOD USING BUILD-UP MULTILAYER PRINTED CIRCUIT BOARD, AND INTRA-ORAL SENSOR MANUFACTURED THEREFROM|
A multilayer printed circuit board according to the present invention comprises: a plurality of laminated plates having one or a plurality of through-holes; and one or a plurality of coupling pins inserted into the through-holes so as to bond the plurality of laminated plates, thereby enabling the thickness of the board to be more miniaturized than that of a conventional multilayer printed circuit board, minimizing a via hole according thereto, diversifying bump size, improving insulation, dimensional stability, strength, and hardness, and achieving excellent processability by preventing cracks caused by drill processing and the like.