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1. (WO2018221976) ORAL SENSOR MANUFACTURING METHOD USING BUILD-UP MULTILAYER PRINTED CIRCUIT BOARD, AND INTRA-ORAL SENSOR MANUFACTURED THEREFROM

Pub. No.:    WO/2018/221976    International Application No.:    PCT/KR2018/006207
Publication Date: Fri Dec 07 00:59:59 CET 2018 International Filing Date: Fri Jun 01 01:59:59 CEST 2018
IPC: A61B 6/14
A61B 6/00
Applicants: PICOPACK CO., LTD.
(주)피코팩
Inventors: OH, Guen Young
오근영
HONG, Sam Pyo
홍삼표
PARK, Byung Eun
박병은
YANG, Jin Gyu
양진규
Title: ORAL SENSOR MANUFACTURING METHOD USING BUILD-UP MULTILAYER PRINTED CIRCUIT BOARD, AND INTRA-ORAL SENSOR MANUFACTURED THEREFROM
Abstract:
A multilayer printed circuit board according to the present invention comprises: a plurality of laminated plates having one or a plurality of through-holes; and one or a plurality of coupling pins inserted into the through-holes so as to bond the plurality of laminated plates, thereby enabling the thickness of the board to be more miniaturized than that of a conventional multilayer printed circuit board, minimizing a via hole according thereto, diversifying bump size, improving insulation, dimensional stability, strength, and hardness, and achieving excellent processability by preventing cracks caused by drill processing and the like.