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1. (WO2018221952) LED PACKAGE SET AND LED BULB INCLUDING SAME
Latest bibliographic data on file with the International Bureau    Submit observation

Pub. No.: WO/2018/221952 International Application No.: PCT/KR2018/006137
Publication Date: 06.12.2018 International Filing Date: 30.05.2018
IPC:
H01L 25/075 (2006.01) ,H01L 33/62 (2010.01) ,H01L 33/36 (2010.01) ,H01L 33/50 (2010.01) ,F21K 9/00 (2016.01)
H ELECTRICITY
01
BASIC ELECTRIC ELEMENTS
L
SEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
25
Assemblies consisting of a plurality of individual semiconductor or other solid state devices
03
all the devices being of a type provided for in the same subgroup of groups H01L27/-H01L51/128
04
the devices not having separate containers
075
the devices being of a type provided for in group H01L33/78
H ELECTRICITY
01
BASIC ELECTRIC ELEMENTS
L
SEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
33
Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
48
characterised by the semiconductor body packages
62
Arrangements for conducting electric current to or from the semiconductor body, e.g. leadframe, wire-bond or solder balls
H ELECTRICITY
01
BASIC ELECTRIC ELEMENTS
L
SEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
33
Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
36
characterised by the electrodes
H ELECTRICITY
01
BASIC ELECTRIC ELEMENTS
L
SEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
33
Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
48
characterised by the semiconductor body packages
50
Wavelength conversion elements
[IPC code unknown for F21K 9]
Applicants:
서울반도체주식회사 SEOUL SEMICONDUCTOR CO., LTD [KR/KR]; 경기도 안산시 단원구 산단로163번길 97-11 97-11, Sandan-ro 163beon-gil, Danwon-gu, Ansan-si, Gyeonggi-do 15429, KR
Inventors:
이성진 LEE, Seong Jin; KR
이종국 LEE, Jong Kook; KR
Agent:
특허법인에이아이피 AIP PATENT & LAW FIRM; 서울시 강남구 테헤란로14길 30-1 30-1, Teheran-ro 14-gil, Gangnam-gu, Seoul 06239, KR
Priority Data:
10-2017-006799231.05.2017KR
Title (EN) LED PACKAGE SET AND LED BULB INCLUDING SAME
(FR) ENSEMBLE DE BOÎTIERS À DEL ET AMPOULE À DEL COMPRENANT CE DERNIER
(KO) 엘이디 패키지 세트 및 이를 포함하는 엘이디 벌브
Abstract:
(EN) The present invention relates to an LED package set and an LED bulb including the same. According to one embodiment of the present invention, provided is an LED package set comprising: a substrate; a first LED package arranged on the substrate and including at least one first LED chip; a second LED package arranged on the substrate and including at least one second LED chip; and a resistor arranged on the substrate, connected with the first LED package in series, and connected with the second LED package in parallel. In addition, the second LED package is connected with the first LED package and the resistor in parallel. Moreover, the first LED package and the second LED package emit lights having different color temperatures from each other.
(FR) La présente invention se rapporte à un ensemble de boîtiers à DEL et à une ampoule à DEL comprenant ce dernier. Selon un mode de réalisation de la présente invention, l'invention porte sur un ensemble de boîtiers à DEL comprenant : un substrat ; un premier boîtier à DEL disposé sur le substrat et comprenant au moins une première puce de DEL ; un second boîtier à DEL disposé sur le substrat et comprenant au moins une seconde puce de DEL ; et une résistance disposée sur le substrat, raccordée au premier boîtier à DEL en série et raccordée au second boîtier à DEL en parallèle. De plus, le second boîtier à DEL est raccordé au premier boîtier à DEL et à la résistance en parallèle. En outre, le premier boîtier à DEL et le second boîtier à DEL émettent des lumières ayant des températures de couleur différentes les unes des autres.
(KO) 본 발명은 엘이디 패키지 세트 및 이를 포함하는 엘이디 벌브에 관한 것이다. 본 발명의 실시 예에 따르면, 기판, 기판에 배치되며, 적어도 하나의 제1 엘이디 칩을 포함하는 제1 엘이디 패키지, 기판에 배치되고, 적어도 하나의 제2 엘이디 칩을 포함하는 제2 엘이디 패키지, 및 기판에 배치되며, 제1 엘이디 패키지와 직렬 연결되며, 제2 엘이디 패키지와 병렬 연결되는 저항을 포함하는 엘이디 패키지 세트가 제공된다. 또한, 제2 엘이디 패키지는 제1 엘이디 패키지 및 저항과 병렬 연결된다. 또한, 제1 엘이디 패키지와 제2 엘이디 패키지는 서로 다른 색온도의 광을 방출한다.
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Designated States: AE, AG, AL, AM, AO, AT, AU, AZ, BA, BB, BG, BH, BN, BR, BW, BY, BZ, CA, CH, CL, CN, CO, CR, CU, CZ, DE, DJ, DK, DM, DO, DZ, EC, EE, EG, ES, FI, GB, GD, GE, GH, GM, GT, HN, HR, HU, ID, IL, IN, IR, IS, JO, JP, KE, KG, KH, KN, KP, KW, KZ, LA, LC, LK, LR, LS, LU, LY, MA, MD, ME, MG, MK, MN, MW, MX, MY, MZ, NA, NG, NI, NO, NZ, OM, PA, PE, PG, PH, PL, PT, QA, RO, RS, RU, RW, SA, SC, SD, SE, SG, SK, SL, SM, ST, SV, SY, TH, TJ, TM, TN, TR, TT, TZ, UA, UG, US, UZ, VC, VN, ZA, ZM, ZW
African Regional Intellectual Property Organization (ARIPO) (BW, GH, GM, KE, LR, LS, MW, MZ, NA, RW, SD, SL, ST, SZ, TZ, UG, ZM, ZW)
Eurasian Patent Office (AM, AZ, BY, KG, KZ, RU, TJ, TM)
European Patent Office (EPO) (AL, AT, BE, BG, CH, CY, CZ, DE, DK, EE, ES, FI, FR, GB, GR, HR, HU, IE, IS, IT, LT, LU, LV, MC, MK, MT, NL, NO, PL, PT, RO, RS, SE, SI, SK, SM, TR)
African Intellectual Property Organization (BF, BJ, CF, CG, CI, CM, GA, GN, GQ, GW, KM, ML, MR, NE, SN, TD, TG)
Publication Language: Korean (KO)
Filing Language: Korean (KO)