Some content of this application is unavailable at the moment.
If this situation persist, please contact us atFeedback&Contact
1. (WO2018221876) METHOD FOR MANUFACTURING FLEXIBLE PRINTED CIRCUIT BOARD AND FLEXIBLE PRINTED CIRCUIT BOARD MANUFACTURED BY SAME
Latest bibliographic data on file with the International Bureau    Submit observation

Pub. No.: WO/2018/221876 International Application No.: PCT/KR2018/005637
Publication Date: 06.12.2018 International Filing Date: 16.05.2018
IPC:
H05K 3/28 (2006.01) ,H05K 3/42 (2006.01) ,H05K 3/46 (2006.01) ,H05K 3/40 (2006.01) ,B32B 15/08 (2006.01)
H ELECTRICITY
05
ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
K
PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
3
Apparatus or processes for manufacturing printed circuits
22
Secondary treatment of printed circuits
28
Applying non-metallic protective coatings
H ELECTRICITY
05
ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
K
PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
3
Apparatus or processes for manufacturing printed circuits
40
Forming printed elements for providing electric connections to or between printed circuits
42
Plated through-holes
H ELECTRICITY
05
ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
K
PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
3
Apparatus or processes for manufacturing printed circuits
46
Manufacturing multi-layer circuits
H ELECTRICITY
05
ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
K
PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
3
Apparatus or processes for manufacturing printed circuits
40
Forming printed elements for providing electric connections to or between printed circuits
B PERFORMING OPERATIONS; TRANSPORTING
32
LAYERED PRODUCTS
B
LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
15
Layered products essentially comprising metal
04
comprising metal as the main or only constituent of a layer, next to another layer of a specific substance
08
of synthetic resin
Applicants:
주식회사 아모그린텍 AMOGREENTECH CO., LTD. [KR/KR]; 경기도 김포시 통진읍 김포대로1950번길 91 91, Gimpo-daero 1950beon-gil, Tongjin-eup Gimpo-si, Gyeonggi-do 10014, KR
Inventors:
단성백 DAN, Sung-Baek; KR
Agent:
특허법인 정안 HONESTY & JR PARTNERS INTELLECTUAL PROPERTY LAW GROUP; 서울시 강남구 선릉로 615, 5층 5F, 615 Sunreung-ro, Gangnam-gu, Seoul 06103, KR
Priority Data:
10-2017-006710130.05.2017KR
10-2017-006710230.05.2017KR
10-2017-006710330.05.2017KR
Title (EN) METHOD FOR MANUFACTURING FLEXIBLE PRINTED CIRCUIT BOARD AND FLEXIBLE PRINTED CIRCUIT BOARD MANUFACTURED BY SAME
(FR) PROCÉDÉ DE FABRICATION DE CARTE À CIRCUIT IMPRIMÉ SOUPLE ET CARTE À CIRCUIT IMPRIMÉ SOUPLE FABRIQUÉE AU MOYEN DE CE PROCÉDÉ
(KO) 연성인쇄회로기판 제조 방법 및 이에 의해 제조된 연성인쇄회로기판
Abstract:
(EN) A method for manufacturing a flexible printed circuit board in which base sheets composed of Teflon film having heat resistance and a low dielectric constant are stacked to prevent loss of a high frequency signal while minimizing dielectric loss due to the high frequency signal and a flexible printed circuit board manufactured by the same are disclosed. The proposed method for manufacturing a flexible printed circuit board comprises a step of preparing a base sheet which is a Teflon film having a thin film pattern formed on one surface thereof, a step of preparing an adhesive sheet, a step of stacking a plurality of base sheets and adhesive sheets, and a step of heating, pressing, and adhering a stacked body in which the plurality of base sheets and adhesive sheets are stacked.
(FR) L'invention concerne un procédé de fabrication d'une carte à circuit imprimé souple dans laquelle des feuilles de base composées d'un film de Téflon, possédant une résistance à la chaleur et une faible constante diélectrique, sont empilées pour empêcher la perte d'un signal haute fréquence tout en réduisant au minimum la perte diélectrique due au signal haute fréquence ; ainsi qu'une carte à circuit imprimé souple fabriquée au moyen de ce procédé. Le procédé proposé de fabrication d'une carte à circuit imprimé souple comprend une étape de préparation d'une feuille de base qui est constituée d'un film de Téflon possédant un motif de film mince formé sur une surface de celui-ci, une étape de préparation d'une feuille adhésive, une étape d'empilement d'une pluralité de feuilles de base et de feuilles adhésives, et une étape de chauffage, de pressage et d'adhérence d'un corps à empilement dans lequel la pluralité de feuilles de base et de feuilles adhésives sont empilées.
(KO) 내열성 및 저유전율의 테플론(Teflon) 필름으로 구성된 베이스 시트들을 적층하여 고주파 신호에 의한 유전 손실을 최소화하면서 고주파 신호의 손실을 방지하도록 한 연성인쇄회로기판 제조 방법 및 이에 의해 제조된 연성인쇄회로기판을 제시한다. 제시된 연성인쇄회로기판 제조 방법은 일면에 박막 패턴이 형성된 테플론 필름인 베이스 시트를 준비하는 단계, 접착 시트를 준비하는 단계, 복수의 베이스 시트 및 접착 시트를 적층하는 단계 및 복수의 베이스 시트 및 접착 시트가 적층된 적층체를 가열 가압하여 접착하는 단계를 포함한다.
front page image
Designated States: AE, AG, AL, AM, AO, AT, AU, AZ, BA, BB, BG, BH, BN, BR, BW, BY, BZ, CA, CH, CL, CN, CO, CR, CU, CZ, DE, DJ, DK, DM, DO, DZ, EC, EE, EG, ES, FI, GB, GD, GE, GH, GM, GT, HN, HR, HU, ID, IL, IN, IR, IS, JO, JP, KE, KG, KH, KN, KP, KW, KZ, LA, LC, LK, LR, LS, LU, LY, MA, MD, ME, MG, MK, MN, MW, MX, MY, MZ, NA, NG, NI, NO, NZ, OM, PA, PE, PG, PH, PL, PT, QA, RO, RS, RU, RW, SA, SC, SD, SE, SG, SK, SL, SM, ST, SV, SY, TH, TJ, TM, TN, TR, TT, TZ, UA, UG, US, UZ, VC, VN, ZA, ZM, ZW
African Regional Intellectual Property Organization (ARIPO) (BW, GH, GM, KE, LR, LS, MW, MZ, NA, RW, SD, SL, ST, SZ, TZ, UG, ZM, ZW)
Eurasian Patent Office (AM, AZ, BY, KG, KZ, RU, TJ, TM)
European Patent Office (EPO) (AL, AT, BE, BG, CH, CY, CZ, DE, DK, EE, ES, FI, FR, GB, GR, HR, HU, IE, IS, IT, LT, LU, LV, MC, MK, MT, NL, NO, PL, PT, RO, RS, SE, SI, SK, SM, TR)
African Intellectual Property Organization (BF, BJ, CF, CG, CI, CM, GA, GN, GQ, GW, KM, ML, MR, NE, SN, TD, TG)
Publication Language: Korean (KO)
Filing Language: Korean (KO)