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1. (WO2018221856) MEMS DEVICE
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Pub. No.: WO/2018/221856 International Application No.: PCT/KR2018/004619
Publication Date: 06.12.2018 International Filing Date: 20.04.2018
IPC:
B81B 3/00 (2006.01) ,B81B 7/02 (2006.01)
[IPC code unknown for B81B 3][IPC code unknown for B81B 7/02]
Applicants:
서울대학교산학협력단 SEOUL NATIONAL UNIVERSITY R&DB FOUNDATION [KR/KR]; 서울시 관악구 관악로 1 940-311 940-311 1, Gwanak-ro Gwanak-gu Seoul 08826, KR
Inventors:
김수환 KIM, Suhwan; KR
Agent:
김선종 KIM, Sunjong; KR
Priority Data:
10-2017-006666730.05.2017KR
Title (EN) MEMS DEVICE
(FR) DISPOSITIF MEMS
(KO) 멤스 장치
Abstract:
(EN) A MEMS device according to the present technology comprises: a MEMS transducer and a semiconductor chip which are attached to a substrate and are electrically connected; and a case which is attached to the substrate and covers the MEMS transducer and the semiconductor chip, wherein the substrate comprises a first path formed below the MEMS transducer, the case comprises a second path, and the MEMS transducer comprises a plate having a third path.
(FR) Un dispositif MEMS selon la présente technologie comprend : un transducteur MEMS et une puce semi-conductrice qui sont fixés à un substrat et sont connectés électriquement ; et un boîtier qui est fixé au substrat et recouvre le transducteur MEMS et la puce semi-conductrice, le substrat comprenant un premier trajet formé au-dessous du transducteur MEMS, le boîtier comprenant un deuxième trajet, et le transducteur MEMS comprenant une plaque ayant un troisième trajet.
(KO) 본 기술에 의한 멤스 장치는 기판에 부착되어 전기적으로 연결된 멤스 트랜스듀서와 반도체 칩; 및 기판에 부착되어 멤스 트랜스듀서와 상기 반도체 칩을 덮는 케이스를 포함하되, 기판은 멤스 트랜스듀서의 하부에 형성된 제 1 통로를 포함하고, 케이스는 제 2 통로를 포함하고, 멤스 트랜스듀서는 제 3 통로가 형성된 판을 포함한다.
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Designated States: AE, AG, AL, AM, AO, AT, AU, AZ, BA, BB, BG, BH, BN, BR, BW, BY, BZ, CA, CH, CL, CN, CO, CR, CU, CZ, DE, DJ, DK, DM, DO, DZ, EC, EE, EG, ES, FI, GB, GD, GE, GH, GM, GT, HN, HR, HU, ID, IL, IN, IR, IS, JO, JP, KE, KG, KH, KN, KP, KW, KZ, LA, LC, LK, LR, LS, LU, LY, MA, MD, ME, MG, MK, MN, MW, MX, MY, MZ, NA, NG, NI, NO, NZ, OM, PA, PE, PG, PH, PL, PT, QA, RO, RS, RU, RW, SA, SC, SD, SE, SG, SK, SL, SM, ST, SV, SY, TH, TJ, TM, TN, TR, TT, TZ, UA, UG, US, UZ, VC, VN, ZA, ZM, ZW
African Regional Intellectual Property Organization (ARIPO) (BW, GH, GM, KE, LR, LS, MW, MZ, NA, RW, SD, SL, ST, SZ, TZ, UG, ZM, ZW)
Eurasian Patent Office (AM, AZ, BY, KG, KZ, RU, TJ, TM)
European Patent Office (EPO) (AL, AT, BE, BG, CH, CY, CZ, DE, DK, EE, ES, FI, FR, GB, GR, HR, HU, IE, IS, IT, LT, LU, LV, MC, MK, MT, NL, NO, PL, PT, RO, RS, SE, SI, SK, SM, TR)
African Intellectual Property Organization (BF, BJ, CF, CG, CI, CM, GA, GN, GQ, GW, KM, ML, MR, NE, SN, TD, TG)
Publication Language: Korean (KO)
Filing Language: Korean (KO)