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1. (WO2018221792) PLATING HANGER DEVICE HAVING SHOCK-ABSORBING STRUCTURE
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Pub. No.: WO/2018/221792 International Application No.: PCT/KR2017/011296
Publication Date: 06.12.2018 International Filing Date: 13.10.2017
IPC:
C25D 17/16 (2006.01) ,H05K 3/24 (2006.01)
C CHEMISTRY; METALLURGY
25
ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
D
PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; JOINING WORKPIECES BY ELECTROLYSIS; APPARATUS THEREFOR
17
Constructional parts, or assemblies thereof, of cells for electrolytic coating
16
Apparatus for electrolytic coating of small objects in bulk
H ELECTRICITY
05
ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
K
PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
3
Apparatus or processes for manufacturing printed circuits
22
Secondary treatment of printed circuits
24
Reinforcing of the conductive pattern
Applicants:
배민수 BAE, Min-Su [KR/KR]; KR
(주)네오피엠씨 NEOPMC CO., LTD. [KR/KR]; 경기도 안산시 단원구 번영1로 40(성곡동) (Seonggok-dong) 40, Beonnyeong 1-ro, Ansan-si Danwon-gu, Gyeonggi-do 15415, KR
Inventors:
배민수 BAE, Min-Su; KR
Agent:
이정현 LEE, Jung Hyun; KR
Priority Data:
10-2017-006687830.05.2017KR
Title (EN) PLATING HANGER DEVICE HAVING SHOCK-ABSORBING STRUCTURE
(FR) DISPOSITIF DE SUSPENSION DE PLACAGE POURVU D'UNE STRUCTURE D'ABSORPTION DES CHOCS
(KO) 충격완충구조를 갖는 도금용 행거장치
Abstract:
(EN) The present invention relates to a plating hanger device having a shock-absorbing structure and, more specifically, to a plating hanger device having a shock-absorbing structure, the device allowing a hanger to be transferred at a uniform speed and reducing noise and shock, which are generated during transferring, so as to enable a uniform plated layer to be formed on a substrate. According to the plating hanger device having the shock-absorbing structure, of the present invention, an elastic spring is pressed by the load of the plating hanger device and a jig, and sequentially, the elastic spring presses a connection shaft and the connection shaft presses a transfer housing so as to improve adhesion between the transfer housing and a driving gear, thereby enabling transferring at uniform speed, and reducing the noise and shock generated during transferring by means of the elastic spring.
(FR) La présente invention concerne un dispositif de suspension de placage pourvu d'une structure d'absorption des chocs et, plus particulièrement, un dispositif de suspension de placage pourvu d'une structure d'absorption des chocs, le dispositif permettant à un élément de suspension d'être transféré à une vitesse uniforme et de réduire le bruit et les chocs, qui sont produits pendant le transfert, de façon à permettre la formation d'une couche plaquée uniforme sur un substrat. Selon le dispositif de suspension de placage pourvu de la structure d'absorption des chocs selon la présente invention, un ressort élastique est soumis à une pression par la charge du dispositif de suspension de placage et d'un gabarit, et, successivement, le ressort élastique exerce une pression sur un arbre de liaison et l'arbre de liaison exerce une pression sur un boîtier de transfert de façon à améliorer l'adhérence entre le boîtier de transfert et un engrenage d'entraînement, ce qui permet d'effectuer un transfert à vitesse uniforme, et de réduire le bruit et les chocs produits pendant le transfert au moyen du ressort élastique.
(KO) 본 발명은 충격완충구조를 갖는 도금용 행거장치에 관한 것으로서, 보다 상세하게는 행거가 균일한 속도로 이송되고, 이송중 발생되는 소음 및 충격을 감소시켜 기판에 균일한 도금층이 형성될도록 할 수 있는 충격완충구조를 갖는 도금용 행거장치에 관한 것이다. 본 발명은 충격완충구조를 갖는 도금용 행거장치는, 도금용 행거장치와 지그의 하중에 의해 탄성스프링을 가압되고, 순차적으로 탄성스프링이 연결축을 가압하고 연결축이 이송하우징을 가압함으로서, 이송하우징과 구동기어와의 밀착력을 향상시켜 균일한 속도로 이송이 가능하게 되고, 탄성스프링에 의해 이송중 발생하는 소음과 충격을 감소시킨다.
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Designated States: AE, AG, AL, AM, AO, AT, AU, AZ, BA, BB, BG, BH, BN, BR, BW, BY, BZ, CA, CH, CL, CN, CO, CR, CU, CZ, DE, DJ, DK, DM, DO, DZ, EC, EE, EG, ES, FI, GB, GD, GE, GH, GM, GT, HN, HR, HU, ID, IL, IN, IR, IS, JO, JP, KE, KG, KH, KN, KP, KW, KZ, LA, LC, LK, LR, LS, LU, LY, MA, MD, ME, MG, MK, MN, MW, MX, MY, MZ, NA, NG, NI, NO, NZ, OM, PA, PE, PG, PH, PL, PT, QA, RO, RS, RU, RW, SA, SC, SD, SE, SG, SK, SL, SM, ST, SV, SY, TH, TJ, TM, TN, TR, TT, TZ, UA, UG, US, UZ, VC, VN, ZA, ZM, ZW
African Regional Intellectual Property Organization (ARIPO) (BW, GH, GM, KE, LR, LS, MW, MZ, NA, RW, SD, SL, ST, SZ, TZ, UG, ZM, ZW)
Eurasian Patent Office (AM, AZ, BY, KG, KZ, RU, TJ, TM)
European Patent Office (EPO) (AL, AT, BE, BG, CH, CY, CZ, DE, DK, EE, ES, FI, FR, GB, GR, HR, HU, IE, IS, IT, LT, LU, LV, MC, MK, MT, NL, NO, PL, PT, RO, RS, SE, SI, SK, SM, TR)
African Intellectual Property Organization (BF, BJ, CF, CG, CI, CM, GA, GN, GQ, GW, KM, ML, MR, NE, SN, TD, TG)
Publication Language: Korean (KO)
Filing Language: Korean (KO)