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1. (WO2018221789) LIGHT-EMITTING DEVICE PACKAGE AND LIGHT SOURCE DEVICE
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Pub. No.: WO/2018/221789 International Application No.: PCT/KR2017/011077
Publication Date: 06.12.2018 International Filing Date: 29.09.2017
IPC:
H01L 33/20 (2010.01) ,H01L 33/48 (2010.01) ,H01L 33/36 (2010.01) ,H01L 33/62 (2010.01)
H ELECTRICITY
01
BASIC ELECTRIC ELEMENTS
L
SEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
33
Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
02
characterised by the semiconductor bodies
20
with a particular shape, e.g. curved or truncated substrate
H ELECTRICITY
01
BASIC ELECTRIC ELEMENTS
L
SEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
33
Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
48
characterised by the semiconductor body packages
H ELECTRICITY
01
BASIC ELECTRIC ELEMENTS
L
SEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
33
Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
36
characterised by the electrodes
H ELECTRICITY
01
BASIC ELECTRIC ELEMENTS
L
SEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
33
Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
48
characterised by the semiconductor body packages
62
Arrangements for conducting electric current to or from the semiconductor body, e.g. leadframe, wire-bond or solder balls
Applicants:
엘지이노텍 주식회사 LG INNOTEK CO., LTD. [KR/KR]; 서울시 중구 후암로 98 98, Huam-ro Jung-gu Seoul 04637, KR
Inventors:
이태성 LEE, Tae Sung; KR
송준오 SONG, June O; KR
임창만 LIM, Chang Man; KR
Agent:
김기문 KIM, Ki Moon; KR
Priority Data:
10-2017-006718730.05.2017KR
10-2017-008234829.06.2017KR
Title (EN) LIGHT-EMITTING DEVICE PACKAGE AND LIGHT SOURCE DEVICE
(FR) BOÎTIER DE DISPOSITIF ÉLECTROLUMINESCENT ET DISPOSITIF DE SOURCE DE LUMIÈRE
(KO) 발광소자 패키지 및 광원 장치
Abstract:
(EN) According to an embodiment, a light-emitting device package can comprise: a body; a light-emitting device disposed on the body; and an adhesive disposed between the body and the light-emitting device. According to an embodiment, the body can comprise: first and second through-holes penetrating from the upper surface of the body to the lower surface of the body; and a first recess concave in a direction from the upper surface of the body toward the lower surface of the body, wherein the first recess can be disposed between the first and second through-holes, and the adhesive can be disposed in the first recess. According to an embodiment, the light-emitting device can comprise first and second electrodes overlapping the first and second through-holes, respectively, in a first direction from the lower surface of the body toward the upper surface of the body.
(FR) La présente invention porte, selon un mode de réalisation, sur un boîtier de dispositif électroluminescent qui peut comprendre : un corps ; un dispositif électroluminescent disposé sur le corps ; et un adhésif disposé entre le corps et le dispositif électroluminescent. Selon un mode de réalisation, le corps peut comprendre : des premier et second trous traversants pénétrant depuis la surface supérieure du corps dans la surface inférieure du corps ; et un premier renfoncement concave dans une direction allant de la surface supérieure du corps vers la surface inférieure du corps, le premier renfoncement pouvant être disposé entre les premier et second trous traversants et l'adhésif pouvant être disposé dans le premier renfoncement. Selon un mode de réalisation, le dispositif électroluminescent peut comprendre des première et seconde électrodes chevauchant les premier et second trous traversants, respectivement, dans une première direction allant de la surface inférieure du corps à la surface supérieure du corps.
(KO) 실시 예에 따른 발광소자 패키지는, 몸체, 몸체 상에 배치되는 발광소자, 및 몸체와 발광소자 사이에 배치되는 접착제를 포함할 수 있다. 실시 예에 의하면, 몸체는 몸체의 상면에서 몸체의 하면을 관통하는 제1 및 제2 관통홀과, 몸체의 상면에서 몸체의 하면으로 향하는 방향으로 오목한 제1 리세스를 포함하고, 제1 리세스는 제1 및 제2 관통홀 사이에 배치되고, 접착제는 제1 리세스 내에 배치될 수 있다. 실시 예에 의하면, 발광소자는 몸체의 하면에서 상면으로 향하는 제1 방향을 기준으로, 제1 및 제2 관통홀 각각과 중첩되는 제1 및 제2 전극을 포함할 수 있다.
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Designated States: AE, AG, AL, AM, AO, AT, AU, AZ, BA, BB, BG, BH, BN, BR, BW, BY, BZ, CA, CH, CL, CN, CO, CR, CU, CZ, DE, DJ, DK, DM, DO, DZ, EC, EE, EG, ES, FI, GB, GD, GE, GH, GM, GT, HN, HR, HU, ID, IL, IN, IR, IS, JO, JP, KE, KG, KH, KN, KP, KW, KZ, LA, LC, LK, LR, LS, LU, LY, MA, MD, ME, MG, MK, MN, MW, MX, MY, MZ, NA, NG, NI, NO, NZ, OM, PA, PE, PG, PH, PL, PT, QA, RO, RS, RU, RW, SA, SC, SD, SE, SG, SK, SL, SM, ST, SV, SY, TH, TJ, TM, TN, TR, TT, TZ, UA, UG, US, UZ, VC, VN, ZA, ZM, ZW
African Regional Intellectual Property Organization (ARIPO) (BW, GH, GM, KE, LR, LS, MW, MZ, NA, RW, SD, SL, ST, SZ, TZ, UG, ZM, ZW)
Eurasian Patent Office (AM, AZ, BY, KG, KZ, RU, TJ, TM)
European Patent Office (EPO) (AL, AT, BE, BG, CH, CY, CZ, DE, DK, EE, ES, FI, FR, GB, GR, HR, HU, IE, IS, IT, LT, LU, LV, MC, MK, MT, NL, NO, PL, PT, RO, RS, SE, SI, SK, SM, TR)
African Intellectual Property Organization (BF, BJ, CF, CG, CI, CM, GA, GN, GQ, GW, KM, ML, MR, NE, SN, TD, TG)
Publication Language: Korean (KO)
Filing Language: Korean (KO)