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1. (WO2018221777) CONTACT FOR TESTING SEMICONDUCTOR DEVICE, AND TEST SOCKET DEVICE
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Pub. No.: WO/2018/221777 International Application No.: PCT/KR2017/006628
Publication Date: 06.12.2018 International Filing Date: 23.06.2017
IPC:
G01R 1/067 (2006.01) ,G01R 31/28 (2006.01) ,B21D 11/06 (2006.01)
G PHYSICS
01
MEASURING; TESTING
R
MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
1
Details of instruments or arrangements of the types covered by groups G01R5/-G01R13/122
02
General constructional details
06
Measuring leads; Measuring probes
067
Measuring probes
G PHYSICS
01
MEASURING; TESTING
R
MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
31
Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
28
Testing of electronic circuits, e.g. by signal tracer
B PERFORMING OPERATIONS; TRANSPORTING
21
MECHANICAL METAL-WORKING WITHOUT ESSENTIALLY REMOVING MATERIAL; PUNCHING METAL
D
WORKING OR PROCESSING OF SHEET METAL OR METAL TUBES, RODS OR PROFILES WITHOUT ESSENTIALLY REMOVING MATERIAL; PUNCHING
11
Bending not restricted to forms of material mentioned in only one of groups B21D5/, B21D7/, B21D9/164; Bending not provided for in groups B21D5/-B21D9/87; Twisting
06
Bending into helical or spiral form; Forming a succession of return bends, e.g. serpentine form
Applicants:
황재석 HWANG, Jae Suk [US/US]; US
황동원 HWANG, Dong Weon [KR/KR]; KR
하이콘 주식회사 HICON CO., LTD. [KR/KR]; 경기도 성남시 중원구 사기막골로 124, 에스케이엔테크노파트 메가센터동 1002호 #1002, Megacenterdong, SKn Techno Park 124, Sagimakgol-ro, Jungwon-gu Seongnam-si Gyeonggi-do 13207, KR
황재백 HWANG, Jae Baek [KR/KR]; KR
Inventors:
황재석 HWANG, Jae Suk; US
Agent:
이은철 LEE, Un Cheol; KR
Priority Data:
10-2017-006696030.05.2017KR
Title (EN) CONTACT FOR TESTING SEMICONDUCTOR DEVICE, AND TEST SOCKET DEVICE
(FR) CONTACT PERMETTANT LE TEST D'UN DISPOSITIF À SEMI-CONDUCTEUR ET DISPOSITIF DE PRISE DE VÉRIFICATION
(KO) 반도체 디바이스 테스트용 콘택트 및 테스트 소켓장치
Abstract:
(EN) The present invention relates to a contact and a socket device for testing a semiconductor device, and the contact of the present invention is a spring contact integrally formed by punching and bending a metal plate, and comprises an elastic part, which includes various strips of a predetermined pattern, and tip parts, which are respectively provided at both ends of the elastic part, and, preferably, is filled with a filler having conductivity and elasticity in a space volume, thereby having excellent durability and electrical characteristics. In addition,a test socket according to the present invention is a rubber type employing the contact and has an effect suitable for testing a fine-pitch device.
(FR) La présente invention concerne un contact et un dispositif de prise permettant de tester un dispositif à semi-conducteur et le contact de la présente invention constitue un contact à ressort formé d'un seul tenant par poinçonnage et pliage d'une plaque métallique, et comprend une partie élastique, qui comprend diverses bandes d'un motif prédéterminé, et des parties de pointe, qui sont respectivement situées aux deux extrémités de la partie élastique, et, de préférence, est remplie d'une matière de remplissage présentant une conductivité et une élasticité dans un volume d'espace, ce qui permet d'obtenir une durabilité et des caractéristiques électriques excellentes. De plus, une prise de vérification de la présente invention constitue un type en caoutchouc employant le contact et présentant un effet approprié pour le test d'un dispositif à pas fin.
(KO) 본 발명은 반도체 디바이스를 테스트하기 위한 콘택트 및 소켓장치에 관한 것으로서, 본 발명의 콘택트는 금속 판재를 타발하고 벤딩하여 일체로 이루어진 스프링 콘택트로서, 일정 패턴의 다양한 스트립으로 이루어진 탄성부과, 탄성부의 양단에 각각 마련된 첨단부를 포함하며, 바람직하게는, 공간 체적 내에 도전성과 탄성을 갖는 필러가 충전됨으로써 내구성과 전기적 특성이 우수하다. 또한, 본 발명에 따른 테스트 소켓은 상술한 콘택트를 채용한 러버 타입으로서 미세 피치용 디바이스의 테스트에 적합한 효과가 있다.
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Designated States: AE, AG, AL, AM, AO, AT, AU, AZ, BA, BB, BG, BH, BN, BR, BW, BY, BZ, CA, CH, CL, CN, CO, CR, CU, CZ, DE, DJ, DK, DM, DO, DZ, EC, EE, EG, ES, FI, GB, GD, GE, GH, GM, GT, HN, HR, HU, ID, IL, IN, IR, IS, JO, JP, KE, KG, KH, KN, KP, KW, KZ, LA, LC, LK, LR, LS, LU, LY, MA, MD, ME, MG, MK, MN, MW, MX, MY, MZ, NA, NG, NI, NO, NZ, OM, PA, PE, PG, PH, PL, PT, QA, RO, RS, RU, RW, SA, SC, SD, SE, SG, SK, SL, SM, ST, SV, SY, TH, TJ, TM, TN, TR, TT, TZ, UA, UG, US, UZ, VC, VN, ZA, ZM, ZW
African Regional Intellectual Property Organization (ARIPO) (BW, GH, GM, KE, LR, LS, MW, MZ, NA, RW, SD, SL, ST, SZ, TZ, UG, ZM, ZW)
Eurasian Patent Office (AM, AZ, BY, KG, KZ, RU, TJ, TM)
European Patent Office (EPO) (AL, AT, BE, BG, CH, CY, CZ, DE, DK, EE, ES, FI, FR, GB, GR, HR, HU, IE, IS, IT, LT, LU, LV, MC, MK, MT, NL, NO, PL, PT, RO, RS, SE, SI, SK, SM, TR)
African Intellectual Property Organization (BF, BJ, CF, CG, CI, CM, GA, GN, GQ, GW, KM, ML, MR, NE, SN, TD, TG)
Publication Language: Korean (KO)
Filing Language: Korean (KO)