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1. (WO2018221753) MEMS DEVICE AND MANUFACTURING METHOD THEREFOR
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Pub. No.: WO/2018/221753 International Application No.: PCT/KR2017/005569
Publication Date: 06.12.2018 International Filing Date: 29.05.2017
IPC:
B81B 7/02 (2006.01) ,B81C 1/00 (2006.01)
[IPC code unknown for B81B 7/02][IPC code unknown for B81C 1]
Applicants:
한국과학기술원 KOREA ADVANCED INSTITUTE OF SCIENCE AND TECHNOLOGY [KR/KR]; 대전시 유성구 대학로 291 (구성동) (Guseong-dong) 291, Daehak-ro Yuseong-gu Daejeon 34141, KR
Inventors:
오재섭 OH, Jae Sub; KR
강민호 KANG, Min Ho; KR
이완규 LEE, Wan Gyu; KR
임성규 LIM, Sung Kyu; KR
김영수 KIM, Young Su; KR
황욱중 HWANG, Wook Jung; KR
Agent:
김남식 KIM, Nam Sik; KR
김한 KIM, Han; KR
이인행 LEE, In Haeng; KR
Priority Data:
Title (EN) MEMS DEVICE AND MANUFACTURING METHOD THEREFOR
(FR) DISPOSITIF MEMS ET SON PROCÉDÉ DE FABRICATION
(KO) 멤스 디바이스 및 그 제조방법
Abstract:
(EN) A MEMS device using an amorphous carbon film as a sacrificial layer and a manufacturing method therefor are provided. According to one embodiment of the present invention, provided is a MEMS device comprising: a lower structure; a MEMS structure disposed to be spaced apart from an upper part of the lower structure; an electrical connection structure electrically connecting the lower structure and the MEMS structure; and an optical absorption structure having a plate part disposed to be spaced apart from an upper part of the MEMS structure and a via connection part extending from the plate part to the MEMS structure.
(FR) La présente invention porte sur un dispositif MEMS utilisant un film de carbone amorphe comme couche sacrificielle et sur son procédé de fabrication. Selon un mode de réalisation de la présente invention, l'invention se rapporte à un dispositif MEMS comprenant : une structure inférieure ; une structure MEMS disposée de sorte à être espacée d'une partie supérieure de la structure inférieure ; une structure de raccordement électrique raccordant électriquement la structure inférieure et la structure MEMS ; et une structure d'absorption optique ayant une partie de plaque disposée de sorte à être espacée d'une partie supérieure de la structure MEMS et une partie de raccordement de trou d'interconnexion s'étendant depuis la partie de plaque jusqu'à la structure MEMS.
(KO) 비정질탄소막을 희생층으로 이용한 멤스 디바이스 및 그 제조 방법이 제공된다. 본 발명의 일 실시예에 따르면, 하부 구조체; 상기 하부 구조체의 상부로 이격되어 배치된 멤스 구조체; 상기 하부 구조체와 상기 멤스 구조체를 전기적으로 연결하는 전기적 연결 구조체; 및 상기 멤스 구조체의 상부로 이격되어 배치되는 플레이트부와 상기 플레이트부로부터 상기 멤스 구조체로 연장되는 비어 연결부를 구비하는 광흡수 구조체;를 포함하는, 멤스 디바이스를 제공한다.
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Designated States: AE, AG, AL, AM, AO, AT, AU, AZ, BA, BB, BG, BH, BN, BR, BW, BY, BZ, CA, CH, CL, CN, CO, CR, CU, CZ, DE, DJ, DK, DM, DO, DZ, EC, EE, EG, ES, FI, GB, GD, GE, GH, GM, GT, HN, HR, HU, ID, IL, IN, IR, IS, JP, KE, KG, KH, KN, KP, KR, KW, KZ, LA, LC, LK, LR, LS, LU, LY, MA, MD, ME, MG, MK, MN, MW, MX, MY, MZ, NA, NG, NI, NO, NZ, OM, PA, PE, PG, PH, PL, PT, QA, RO, RS, RU, RW, SA, SC, SD, SE, SG, SK, SL, SM, ST, SV, SY, TH, TJ, TM, TN, TR, TT, TZ, UA, UG, US, UZ, VC, VN, ZA, ZM, ZW
African Regional Intellectual Property Organization (ARIPO) (BW, GH, GM, KE, LR, LS, MW, MZ, NA, RW, SD, SL, ST, SZ, TZ, UG, ZM, ZW)
Eurasian Patent Office (AM, AZ, BY, KG, KZ, RU, TJ, TM)
European Patent Office (EPO) (AL, AT, BE, BG, CH, CY, CZ, DE, DK, EE, ES, FI, FR, GB, GR, HR, HU, IE, IS, IT, LT, LU, LV, MC, MK, MT, NL, NO, PL, PT, RO, RS, SE, SI, SK, SM, TR)
African Intellectual Property Organization (BF, BJ, CF, CG, CI, CM, GA, GN, GQ, GW, KM, ML, MR, NE, SN, TD, TG)
Publication Language: Korean (KO)
Filing Language: Korean (KO)