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1. (WO2018221724) HIGH-PURITY ELECTROLYTIC COPPER

Pub. No.:    WO/2018/221724    International Application No.:    PCT/JP2018/021178
Publication Date: Fri Dec 07 00:59:59 CET 2018 International Filing Date: Sat Jun 02 01:59:59 CEST 2018
IPC: C25C 1/12
Applicants: MITSUBISHI MATERIALS CORPORATION
三菱マテリアル株式会社
Inventors: TARUTANI Yoshie
樽谷 圭栄
KUBOTA Kenji
久保田 賢治
NAKAYA Kiyotaka
中矢 清隆
ARAI Isao
荒井 公
Title: HIGH-PURITY ELECTROLYTIC COPPER
Abstract:
The present invention exhibits a Cu purity excluding gas components (O, F, S, C, Cl) of 99.9999 mass% or higher, an S content of 0.1 mass ppm or less, and an area ratio of crystals having a (101) ±10° orientation of less than 40% when crystal orientation is measured by electron backscatter diffraction in a cross-section extending in the thickness direction.