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1. (WO2018221715) CONSTRUCTION MATERIAL PANEL, STRUCTURAL BODY, AND INSTALLATION METHOD FOR CONSTRUCTION MATERIAL PANEL
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Pub. No.: WO/2018/221715 International Application No.: PCT/JP2018/021138
Publication Date: 06.12.2018 International Filing Date: 01.06.2018
IPC:
E04F 13/08 (2006.01) ,E04F 13/074 (2006.01) ,F21S 2/00 (2016.01) ,F21V 33/00 (2006.01) ,F21Y 115/10 (2016.01) ,F21Y 115/30 (2016.01)
[IPC code unknown for E04F 13/08][IPC code unknown for E04F 13/074][IPC code unknown for F21S 2][IPC code unknown for F21V 33][IPC code unknown for F21Y 115/10][IPC code unknown for F21Y 115/30]
Applicants:
大日本印刷株式会社 DAI NIPPON PRINTING CO., LTD. [JP/JP]; 東京都新宿区市谷加賀町一丁目1番1号 1-1, Ichigaya-kaga-cho 1-chome, Shinjuku-ku, Tokyo 1628001, JP
Inventors:
関戸 雅幸 SEKIDO Masayuki; JP
谷口 幸夫 TANIGUCHI Yukio; JP
出原 知之 IDEHARA Tomoyuki; JP
Agent:
永井 浩之 NAGAI Hiroshi; JP
中村 行孝 NAKAMURA Yukitaka; JP
佐藤 泰和 SATO Yasukazu; JP
朝倉 悟 ASAKURA Satoru; JP
堀田 幸裕 HOTTA Yukihiro; JP
塙 和也 HANAWA Kazuya; JP
Priority Data:
2017-10955701.06.2017JP
2017-19147529.09.2017JP
Title (EN) CONSTRUCTION MATERIAL PANEL, STRUCTURAL BODY, AND INSTALLATION METHOD FOR CONSTRUCTION MATERIAL PANEL
(FR) PANNEAU DE MATÉRIAU DE CONSTRUCTION, CORPS STRUCTURAL ET PROCÉDÉ D'INSTALLATION DUDIT PANNEAU
(JA) 建材パネル、構造体、及び建材パネルの取付方法
Abstract:
(EN) A construction material panel (1) includes: a surface light-source device (21) that has a light emitting surface (21a); and a first decorative sheet (23) that is disposed so as to cover at least a section of or the entirety of the light emitting surface (21a).
(FR) L'invention concerne un panneau de matériau de construction (1) comprenant : un dispositif source de lumière de surface (21) comportant une surface d'émission de lumière (21a) ; et une première feuille décorative (23) disposée de sorte à recouvrir au moins une partie ou l'intégralité de la surface d'émission de lumière (21a).
(JA) 建材パネル(1)は、発光面(21a)を有する面光源装置(21)と、少なくとも発光面(21a)の一部あるいは全面を覆うように設けられた第1化粧シート(23)と、を有する。
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Designated States: AE, AG, AL, AM, AO, AT, AU, AZ, BA, BB, BG, BH, BN, BR, BW, BY, BZ, CA, CH, CL, CN, CO, CR, CU, CZ, DE, DJ, DK, DM, DO, DZ, EC, EE, EG, ES, FI, GB, GD, GE, GH, GM, GT, HN, HR, HU, ID, IL, IN, IR, IS, JO, JP, KE, KG, KH, KN, KP, KR, KW, KZ, LA, LC, LK, LR, LS, LU, LY, MA, MD, ME, MG, MK, MN, MW, MX, MY, MZ, NA, NG, NI, NO, NZ, OM, PA, PE, PG, PH, PL, PT, QA, RO, RS, RU, RW, SA, SC, SD, SE, SG, SK, SL, SM, ST, SV, SY, TH, TJ, TM, TN, TR, TT, TZ, UA, UG, US, UZ, VC, VN, ZA, ZM, ZW
African Regional Intellectual Property Organization (ARIPO) (BW, GH, GM, KE, LR, LS, MW, MZ, NA, RW, SD, SL, ST, SZ, TZ, UG, ZM, ZW)
Eurasian Patent Office (AM, AZ, BY, KG, KZ, RU, TJ, TM)
European Patent Office (EPO) (AL, AT, BE, BG, CH, CY, CZ, DE, DK, EE, ES, FI, FR, GB, GR, HR, HU, IE, IS, IT, LT, LU, LV, MC, MK, MT, NL, NO, PL, PT, RO, RS, SE, SI, SK, SM, TR)
African Intellectual Property Organization (BF, BJ, CF, CG, CI, CM, GA, GN, GQ, GW, KM, ML, MR, NE, SN, TD, TG)
Publication Language: Japanese (JA)
Filing Language: Japanese (JA)