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1. (WO2018221681) LIQUID RESIN COMPOSITION FOR SEALING AND ELECTRONIC COMPONENT DEVICE
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Pub. No.: WO/2018/221681 International Application No.: PCT/JP2018/021059
Publication Date: 06.12.2018 International Filing Date: 31.05.2018
IPC:
C08G 59/20 (2006.01) ,C08K 3/00 (2018.01) ,C08K 5/5435 (2006.01) ,C08L 63/00 (2006.01) ,H01L 23/29 (2006.01) ,H01L 23/31 (2006.01)
C CHEMISTRY; METALLURGY
08
ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
G
MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
59
Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by reaction of epoxy polycondensates with monofunctional low-molecular-weight compounds; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
18
Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
20
characterised by the epoxy compounds used
C CHEMISTRY; METALLURGY
08
ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
K
USE OF INORGANIC OR NON-MACROMOLECULAR ORGANIC SUBSTANCES AS COMPOUNDING INGREDIENTS
3
Use of inorganic ingredients
C CHEMISTRY; METALLURGY
08
ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
K
USE OF INORGANIC OR NON-MACROMOLECULAR ORGANIC SUBSTANCES AS COMPOUNDING INGREDIENTS
5
Use of organic ingredients
54
Silicon-containing compounds
541
containing oxygen
5435
containing oxygen in a ring
C CHEMISTRY; METALLURGY
08
ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
L
COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
63
Compositions of epoxy resins; Compositions of derivatives of epoxy resins
H ELECTRICITY
01
BASIC ELECTRIC ELEMENTS
L
SEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
23
Details of semiconductor or other solid state devices
28
Encapsulation, e.g. encapsulating layers, coatings
29
characterised by the material
H ELECTRICITY
01
BASIC ELECTRIC ELEMENTS
L
SEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
23
Details of semiconductor or other solid state devices
28
Encapsulation, e.g. encapsulating layers, coatings
31
characterised by the arrangement
Applicants:
日立化成株式会社 HITACHI CHEMICAL COMPANY, LTD. [JP/JP]; 東京都千代田区丸の内一丁目9番2号 9-2, Marunouchi 1-chome, Chiyoda-ku, Tokyo 1006606, JP
ナミックス株式会社 NAMICS CORPORATION [JP/JP]; 新潟県新潟市北区濁川3993番地 3993, Nigorikawa, Kita-ku, Niigata-shi, Niigata 9503131, JP
Inventors:
井上 英俊 INOUE, Hidetoshi; JP
松崎 隆行 MATSUZAKI, Takayuki; JP
高橋 寿登 TAKAHASHI, Hisato; JP
上村 剛 KAMIMURA, Tsuyoshi; JP
吉井 東之 YOSHII, Haruyuki; JP
Agent:
特許業務法人太陽国際特許事務所 TAIYO, NAKAJIMA & KATO; 東京都新宿区新宿4丁目3番17号 3-17, Shinjuku 4-chome, Shinjuku-ku, Tokyo 1600022, JP
Priority Data:
2017-10871531.05.2017JP
Title (EN) LIQUID RESIN COMPOSITION FOR SEALING AND ELECTRONIC COMPONENT DEVICE
(FR) COMPOSITION DE RÉSINE LIQUIDE POUR SCELLEMENT, ET DISPOSITIF À COMPOSANT ÉLECTRONIQUE
(JA) 封止用液状樹脂組成物及び電子部品装置
Abstract:
(EN) A liquid resin composition for sealing that includes: an aliphatic epoxy compound (A); an epoxy compound (B) having an aromatic ring in the molecules thereof; a nitrogen-containing heterocyclic compound (C); and an inorganic filler (D). The inorganic filler (D) content is at least 77% by mass.
(FR) La composition de résine liquide pour scellement de l’invention contient un composé époxy aliphatique (A), un composé époxy (B) possédant un cycle aromatique dans chaque molécule, un composé hétérocyclique à teneur en azote (C), et une charge inorganique (D). La teneur en charge inorganique (D) est supérieure ou égale à 77% en masse.
(JA) 封止用液状樹脂組成物は、(A)脂肪族エポキシ化合物、(B)分子中に芳香環を有するエポキシ化合物、(C)含窒素複素環化合物及び(D)無機充填剤を含み、前記(D)無機充填剤の含有率が、77質量%以上である。
Designated States: AE, AG, AL, AM, AO, AT, AU, AZ, BA, BB, BG, BH, BN, BR, BW, BY, BZ, CA, CH, CL, CN, CO, CR, CU, CZ, DE, DJ, DK, DM, DO, DZ, EC, EE, EG, ES, FI, GB, GD, GE, GH, GM, GT, HN, HR, HU, ID, IL, IN, IR, IS, JO, JP, KE, KG, KH, KN, KP, KR, KW, KZ, LA, LC, LK, LR, LS, LU, LY, MA, MD, ME, MG, MK, MN, MW, MX, MY, MZ, NA, NG, NI, NO, NZ, OM, PA, PE, PG, PH, PL, PT, QA, RO, RS, RU, RW, SA, SC, SD, SE, SG, SK, SL, SM, ST, SV, SY, TH, TJ, TM, TN, TR, TT, TZ, UA, UG, US, UZ, VC, VN, ZA, ZM, ZW
African Regional Intellectual Property Organization (ARIPO) (BW, GH, GM, KE, LR, LS, MW, MZ, NA, RW, SD, SL, ST, SZ, TZ, UG, ZM, ZW)
Eurasian Patent Office (AM, AZ, BY, KG, KZ, RU, TJ, TM)
European Patent Office (EPO) (AL, AT, BE, BG, CH, CY, CZ, DE, DK, EE, ES, FI, FR, GB, GR, HR, HU, IE, IS, IT, LT, LU, LV, MC, MK, MT, NL, NO, PL, PT, RO, RS, SE, SI, SK, SM, TR)
African Intellectual Property Organization (BF, BJ, CF, CG, CI, CM, GA, GN, GQ, GW, KM, ML, MR, NE, SN, TD, TG)
Publication Language: Japanese (JA)
Filing Language: Japanese (JA)