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1. (WO2018221640) RESIN COMPOSITION, AND MEMBER FOR CONDUCTION TEST

Pub. No.:    WO/2018/221640    International Application No.:    PCT/JP2018/020915
Publication Date: Fri Dec 07 00:59:59 CET 2018 International Filing Date: Fri Jun 01 01:59:59 CEST 2018
IPC: C08L 101/00
G01R 1/073
H01R 11/01
Applicants: SEKISUI CHEMICAL CO., LTD.
積水化学工業株式会社
Inventors: MAHARA, Shigeo
真原 茂雄
Title: RESIN COMPOSITION, AND MEMBER FOR CONDUCTION TEST
Abstract:
Provided is a resin composition capable of effectively preventing a conduction test target member from scratching, and thus capable of effectively improving the reliability of a conduction test. This resin composition contains conductive particles, a thermosetting compound, and a thermosetting agent, wherein the content of the conductive particles in 100 wt% of the resin composition is at least 50 wt%, and the elongation at break of a cured product obtained by heating components other than the conductive particles in the resin composition at 130°C for 30 minutes is 10-100% as measured according to JIS K6251.