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1. (WO2018221637) THERMALLY CONDUCTIVE POLYSILOXANE COMPOSITION

Pub. No.:    WO/2018/221637    International Application No.:    PCT/JP2018/020905
Publication Date: Fri Dec 07 00:59:59 CET 2018 International Filing Date: Fri Jun 01 01:59:59 CEST 2018
IPC: C08L 83/06
C08K 3/36
C08K 9/06
C08L 83/05
C08L 83/07
Applicants: MOMENTIVE PERFORMANCE MATERIALS JAPAN LLC
モメンティブ・パフォーマンス・マテリアルズ・ジャパン合同会社
Inventors: TAKENAKA Kenji
竹中 健治
SAKAMOTO Atsushi
坂本 淳
Title: THERMALLY CONDUCTIVE POLYSILOXANE COMPOSITION
Abstract:
The present invention relates to a thermally conductive polysiloxane composition containing: (A) a thermally conductive filler; (B) a siloxane compound of a specific structure; (C) an alkoxysilane compound of a specific structure; (D) a polyorganosiloxane having one or more aliphatic unsaturated groups per molecule; (E) a polyorganohydrogensiloxane having two or more hydrogen atoms bonded to silicon atoms per molecule; and (F) a platinum-based catalyst.