Search International and National Patent Collections

1. (WO2018221587) ELECTROCONDUCTIVE MATERIAL AND CONNECTION STRUCTURE

Pub. No.:    WO/2018/221587    International Application No.:    PCT/JP2018/020764
Publication Date: Fri Dec 07 00:59:59 CET 2018 International Filing Date: Thu May 31 01:59:59 CEST 2018
IPC: H01B 1/22
H01L 21/60
H01R 11/01
H05K 3/32
Applicants: SEKISUI CHEMICAL CO., LTD.
積水化学工業株式会社
Inventors: SOU, Shike
宋 士輝
ITOU, Masahiro
伊藤 将大
SADANAGA, Shuujirou
定永 周治郎
Title: ELECTROCONDUCTIVE MATERIAL AND CONNECTION STRUCTURE
Abstract:
Provided is an electroconductive material in which it is possible to effectively increase the storage stability of the electroconductive material, to effectively increase the cohesiveness of solder during electroconductive connection, and furthermore, to effectively increase the heat resistance of a cured product. The electroconductive material according to the present invention contains a plurality of electrically conductive particles having solder on an outer surface portion of an electrically conductive part, a thermosetting compound, and flux, the electroconductive material comprising one or more of a first configuration in which "flux having a particle diameter that is 2 times or more of the average particle diameter of the flux is not present, or flux having a particle diameter that is 2 times or more of the average particle diameter of the flux is present at a number of less than 10% in 100% of the total number of the flux," and a second configuration in which "a composition in which the electrically conductive particles are removed from the electroconductive material is a colloid, and the flux is present as colloidal particles."