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1. (WO2018221499) METHOD FOR MANUFACTURING MOUNTING DEVICE AND SEMICONDUCTOR DEVICE

Pub. No.:    WO/2018/221499    International Application No.:    PCT/JP2018/020505
Publication Date: Fri Dec 07 00:59:59 CET 2018 International Filing Date: Wed May 30 01:59:59 CEST 2018
IPC: H01L 21/60
H01L 25/065
H01L 25/07
H01L 25/18
Applicants: SHINKAWA LTD.
株式会社新川
Inventors: NAKAMURA Tomonori
中村 智宣
MAEDA Toru
前田 徹
TAKANO Tetsuo
高野 徹朗
Title: METHOD FOR MANUFACTURING MOUNTING DEVICE AND SEMICONDUCTOR DEVICE
Abstract:
This mounting device is for manufacturing a semiconductor device by bonding a semiconductor chip 12 to a mounting body that is another semiconductor chip 12 or a substrate 30. The mounting device is provided with a stage 120 on which the substrate 30 is placed, a mounting head 124 that is able to move relative to the stage 120 and bonds the semiconductor chip 12 to the mounting body, and an irradiation unit 108 that emits electromagnetic waves that transmit through the stage and heat the substrate 30 from the lower side of the stage 120. The stage 120 has a first layer 122 formed on the upper surface side. In the first layer 122, the thermal resistance in the surface direction is greater than the thermal resistance in the thickness direction.