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|1. (WO2018221499) METHOD FOR MANUFACTURING MOUNTING DEVICE AND SEMICONDUCTOR DEVICE|
|Title:||METHOD FOR MANUFACTURING MOUNTING DEVICE AND SEMICONDUCTOR DEVICE|
This mounting device is for manufacturing a semiconductor device by bonding a semiconductor chip 12 to a mounting body that is another semiconductor chip 12 or a substrate 30. The mounting device is provided with a stage 120 on which the substrate 30 is placed, a mounting head 124 that is able to move relative to the stage 120 and bonds the semiconductor chip 12 to the mounting body, and an irradiation unit 108 that emits electromagnetic waves that transmit through the stage and heat the substrate 30 from the lower side of the stage 120. The stage 120 has a first layer 122 formed on the upper surface side. In the first layer 122, the thermal resistance in the surface direction is greater than the thermal resistance in the thickness direction.