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1. (WO2018221378) POLYAMIDE RESIN COMPOSITION AND RELEASE FILM USING SAME
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Pub. No.: WO/2018/221378 International Application No.: PCT/JP2018/020032
Publication Date: 06.12.2018 International Filing Date: 24.05.2018
IPC:
C08L 77/00 (2006.01) ,C08L 23/12 (2006.01) ,C08L 23/26 (2006.01) ,C08L 91/06 (2006.01)
C CHEMISTRY; METALLURGY
08
ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
L
COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
77
Compositions of polyamides obtained by reactions forming a carboxylic amide link in the main chain; Compositions of derivatives of such polymers
C CHEMISTRY; METALLURGY
08
ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
L
COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
23
Compositions of homopolymers or copolymers of unsaturated aliphatic hydrocarbons having only one carbon-to-carbon double bond; Compositions of derivatives of such polymers
02
not modified by chemical after-treatment
10
Homopolymers or copolymers of propene
12
Polypropene
C CHEMISTRY; METALLURGY
08
ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
L
COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
23
Compositions of homopolymers or copolymers of unsaturated aliphatic hydrocarbons having only one carbon-to-carbon double bond; Compositions of derivatives of such polymers
26
modified by chemical after-treatment
C CHEMISTRY; METALLURGY
08
ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
L
COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
91
Compositions of oils, fats or waxes; Compositions of derivatives thereof
06
Waxes
Applicants:
宇部興産株式会社 UBE INDUSTRIES, LTD. [JP/JP]; 山口県宇部市大字小串1978番地の96 1978-96, Oaza Kogushi, Ube-shi, Yamaguchi 7758633, JP
Inventors:
竹内 絢哉 TAKEUCHI Shunya; JP
薮 直靖 YABU Naoyasu; JP
佐野 英男 SANO Hideo; JP
Agent:
赤塚 正樹 AKATSUKA Masaki; JP
Priority Data:
2017-10669430.05.2017JP
2017-10669530.05.2017JP
2017-11872816.06.2017JP
Title (EN) POLYAMIDE RESIN COMPOSITION AND RELEASE FILM USING SAME
(FR) COMPOSITION DE RÉSINE DE POLYAMIDE ET FILM ANTIADHÉSIF UTILISANT LADITE COMPOSITION
(JA) ポリアミド樹脂組成物及びそれを用いた離型フィルム
Abstract:
(EN) The purpose of the present invention is to provide a polyamide resin composition having improved releasability when made into a film and a release film that uses the same. The polyamide resin composition of the present invention includes a polyamide resin, an unmodified polypropylene resin, and a polyolefin wax and/or modified polyethylene resin. The content of the unmodified polypropylene resin is 0.1-10 mass%, and the content of the polyolefin wax and/or modified polyethylene resin is 0.1-8 mass%. The release film of the present invention includes the polyamide resin composition.
(FR) La présente invention concerne une composition de résine de polyamide possédant une aptitude améliorée au décollement lorsqu’elle est transformée en un film et un film antiadhésif qui utilise ladite composition. Selon la présente invention, la composition de résine de polyamide comprend une résine de polyamide, une résine de polypropylène non modifiée et une cire de polyoléfine et/ou une résine de polyéthylène modifiée. La teneur de la résine de polypropylène non modifiée est de 0,1 à 10 % en masse, et la teneur de la cire de polyoléfine et/ou de la résine de polyéthylène modifiée est de 0,1 à 8 % en masse. Selon la présente invention, le film antiadhésif comprend la composition de résine de polyamide.
(JA) 本発明は、フィルムにした場合の離型性を改善したポリアミド樹脂組成物及びそれを用いた離型フィルムを提供することを目的とする。本発明に係るポリアミド樹脂組成物は、ポリアミド樹脂と、未変性ポリプロピレン樹脂と、ポリオレフィンワックス及び/又は変性ポリエチレン樹脂とを含み、前記未変性ポリプロピレン樹脂の含有量が、0.1~10質量%であり、前記ポリオレフィンワックス及び/又は変性ポリエチレン樹脂の含有量が、0.1~8質量%である。本発明に係る離型フィルムは、上記のポリアミド樹脂組成物を含む。
Designated States: AE, AG, AL, AM, AO, AT, AU, AZ, BA, BB, BG, BH, BN, BR, BW, BY, BZ, CA, CH, CL, CN, CO, CR, CU, CZ, DE, DJ, DK, DM, DO, DZ, EC, EE, EG, ES, FI, GB, GD, GE, GH, GM, GT, HN, HR, HU, ID, IL, IN, IR, IS, JO, KE, KG, KH, KN, KP, KR, KW, KZ, LA, LC, LK, LR, LS, LU, LY, MA, MD, ME, MG, MK, MN, MW, MX, MY, MZ, NA, NG, NI, NO, NZ, OM, PA, PE, PG, PH, PL, PT, QA, RO, RS, RU, RW, SA, SC, SD, SE, SG, SK, SL, SM, ST, SV, SY, TH, TJ, TM, TN, TR, TT, TZ, UA, UG, US, UZ, VC, VN, ZA, ZM, ZW
African Regional Intellectual Property Organization (ARIPO) (BW, GH, GM, KE, LR, LS, MW, MZ, NA, RW, SD, SL, ST, SZ, TZ, UG, ZM, ZW)
Eurasian Patent Office (AM, AZ, BY, KG, KZ, RU, TJ, TM)
European Patent Office (EPO) (AL, AT, BE, BG, CH, CY, CZ, DE, DK, EE, ES, FI, FR, GB, GR, HR, HU, IE, IS, IT, LT, LU, LV, MC, MK, MT, NL, NO, PL, PT, RO, RS, SE, SI, SK, SM, TR)
African Intellectual Property Organization (BF, BJ, CF, CG, CI, CM, GA, GN, GQ, GW, KM, ML, MR, NE, SN, TD, TG)
Publication Language: Japanese (JA)
Filing Language: Japanese (JA)