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1. (WO2018221373) BLOCK COPOLYMER, METHOD FOR PRODUCING SAME, EPOXY RESIN COMPOSITION, CURED PRODUCT, AND SEMICONDUCTOR ENCAPSULATING MATERIAL

Pub. No.:    WO/2018/221373    International Application No.:    PCT/JP2018/020011
Publication Date: Fri Dec 07 00:59:59 CET 2018 International Filing Date: Fri May 25 01:59:59 CEST 2018
IPC: C08G 81/00
C08L 63/00
C08L 71/02
C08L 83/12
H01L 23/29
H01L 23/31
Applicants: TORAY INDUSTRIES, INC.
東レ株式会社
Inventors: TANAKA, Hiroko
田中寛子
ISAGO, Yuka
井砂友香
ASANO, Itaru
浅野到
TAKEZAKI, Hiroshi
竹崎宏
MIYAMA, Hisashi
御山寿
HONDA, Shiro
本田史郎
Title: BLOCK COPOLYMER, METHOD FOR PRODUCING SAME, EPOXY RESIN COMPOSITION, CURED PRODUCT, AND SEMICONDUCTOR ENCAPSULATING MATERIAL
Abstract:
Provided is a polysiloxane-polyalkylene glycol block copolymer which can be obtained by reacting a polysiloxane (A) having a functional group selected from among a carboxylic acid anhydride group, a hydroxyl group, an epoxy group, a carboxyl group, and an amino group, with a polyalkylene glycol (B) having a functional group selected from among a carboxylic acid anhydride group, a hydroxyl group, a carboxyl group, an amino group, an epoxy group, a thiol group, and an isocyanate group, wherein the content of a structure derived from the polysiloxane (A) is 20-90 mass% with respect to 100 mass% of the block copolymer. When added to an epoxy resin, this polysiloxane-polyalkylene glycol block copolymer is homogeneously and finely dispersed in the epoxy resin so that bleed-out of the block copolymer from an epoxy resin cured product that is obtained can be suppressed and the epoxy resin cured product can have reduced stress and increased toughness. Furthermore, a reduction in fluidity is suppressed by adding the block copolymer to the epoxy resin. Thus, the block copolymer is useful as a variety of additives, such as a surfactant and a resin modifier, and particularly suitable as a stress reducing agent for a semiconductor encapsulating material.