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1. (WO2018221351) LIGHT EMITTING DEVICE, PROJECTOR, AND A LIGHT EMITTING DEVICE MANUFACTURING METHOD
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Pub. No.: WO/2018/221351 International Application No.: PCT/JP2018/019841
Publication Date: 06.12.2018 International Filing Date: 23.05.2018
IPC:
H01L 33/38 (2010.01) ,H01L 33/48 (2010.01)
H ELECTRICITY
01
BASIC ELECTRIC ELEMENTS
L
SEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
33
Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
36
characterised by the electrodes
38
with a particular shape
H ELECTRICITY
01
BASIC ELECTRIC ELEMENTS
L
SEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
33
Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
48
characterised by the semiconductor body packages
Applicants:
セイコーエプソン株式会社 SEIKO EPSON CORPORATION [JP/JP]; 東京都新宿区新宿四丁目1番6号 1-6, Shinjuku 4-chome, Shinjuku-ku, Tokyo 1608801, JP
Inventors:
加▲瀬▼谷 浩康 KASEYA Hiroyasu; JP
Agent:
渡辺 和昭 WATANABE Kazuaki; JP
仲井 智至 NAKAI Satoshi; JP
Priority Data:
2017-10834631.05.2017JP
Title (EN) LIGHT EMITTING DEVICE, PROJECTOR, AND A LIGHT EMITTING DEVICE MANUFACTURING METHOD
(FR) DISPOSITIF ÉLECTROLUMINESCENT, PROJECTEUR ET PROCÉDÉ DE FABRICATION DE DISPOSITIF ÉLECTROLUMINESCENT
(JA) 発光装置、プロジェクター、および発光装置の製造方法
Abstract:
(EN) A light emitting device is provided which enables reducing the pressure applied to a light emitting unit during mounting. This light-emitting device is provided with: a light emitting element which comprises a first base body on which a laminate body is provided; a second base body on which the light-emitting element is provided; the laminate body which is provided on the first base body; and a first member which is provided between the first base body and the second base body. The laminate body includes a light-emitting unit. The light-emitting unit comprises a first semiconductor layer, a second semiconductor layer having a conductivity type different from that of the first semiconductor layer, and a light emitting layer which is provided between the first semiconductor layer and the second semiconductor layer and can emit light through the injection of current. The first member is connected at one end to the first base body and is connected at the other end to the second base body, and the laminate body is connected to the second base body on the side opposite of the first base body.
(FR) L'invention concerne un dispositif électroluminescent qui permet de réduire la pression appliquée à une unité électroluminescente pendant le montage. Ce dispositif électroluminescent comprend : un élément électroluminescent qui comprend un premier corps de base sur lequel est disposé un corps stratifié; un second corps de base sur lequel est disposé l'élément électroluminescent; le corps stratifié qui est disposé sur le premier corps de base; et un premier élément qui est disposé entre le premier corps de base et le second corps de base. Le corps stratifié comprend une unité électroluminescente. L'unité électroluminescente comprend une première couche semi-conductrice, une seconde couche semi-conductrice ayant un type de conductivité différent de celui de la première couche semi-conductrice, et une couche électroluminescente qui est disposée entre la première couche semi-conductrice et la seconde couche semi-conductrice et qui peut émettre de la lumière par l'intermédiaire de l'injection de courant. Le premier élément est relié au niveau d'une extrémité au premier corps de base et est relié à l'autre extrémité au second corps de base, et le corps stratifié est relié au second corps de base sur le côté opposé au premier corps de base.<b></b> <b></b>
(JA) 実装時に発光部に加わる圧力を低減できる発光装置を提供する。 積層体が設けられている第1基体を含む発光素子と、前記発光素子が設けら れている第2基体と、前記第1基体に設けられている積層体と、前記第1基体と前記第2基体との間に設けられている第1部材と、を含み、前記積層体は、発光部を含み、前記発光部は、第1半導体層と、前記第1半導体層と導電型の異なる第2半導体層と、前記第1半導体層と前記第2半導体層との間に設けられ、電流が注入されることで光を発することが可能な発光層と、を有し、前記第1部材は、一端が前記第1基体に接続され、他端が前記第2基体に接続され、前記積層体は、前記第1基体と反対側において、前記第2基体に接続されている、発光装置。
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Designated States: AE, AG, AL, AM, AO, AT, AU, AZ, BA, BB, BG, BH, BN, BR, BW, BY, BZ, CA, CH, CL, CN, CO, CR, CU, CZ, DE, DJ, DK, DM, DO, DZ, EC, EE, EG, ES, FI, GB, GD, GE, GH, GM, GT, HN, HR, HU, ID, IL, IN, IR, IS, JO, KE, KG, KH, KN, KP, KR, KW, KZ, LA, LC, LK, LR, LS, LU, LY, MA, MD, ME, MG, MK, MN, MW, MX, MY, MZ, NA, NG, NI, NO, NZ, OM, PA, PE, PG, PH, PL, PT, QA, RO, RS, RU, RW, SA, SC, SD, SE, SG, SK, SL, SM, ST, SV, SY, TH, TJ, TM, TN, TR, TT, TZ, UA, UG, US, UZ, VC, VN, ZA, ZM, ZW
African Regional Intellectual Property Organization (ARIPO) (BW, GH, GM, KE, LR, LS, MW, MZ, NA, RW, SD, SL, ST, SZ, TZ, UG, ZM, ZW)
Eurasian Patent Office (AM, AZ, BY, KG, KZ, RU, TJ, TM)
European Patent Office (EPO) (AL, AT, BE, BG, CH, CY, CZ, DE, DK, EE, ES, FI, FR, GB, GR, HR, HU, IE, IS, IT, LT, LU, LV, MC, MK, MT, NL, NO, PL, PT, RO, RS, SE, SI, SK, SM, TR)
African Intellectual Property Organization (BF, BJ, CF, CG, CI, CM, GA, GN, GQ, GW, KM, ML, MR, NE, SN, TD, TG)
Publication Language: Japanese (JA)
Filing Language: Japanese (JA)